LED Ceramic 9292 Series 10W White LED Datasheet - Size 9.2x9.2x1.6mm - Voltage 28V - Power 10W - English Technical Document

1. Product Overview

The 9292 Ceramic Series represents a high-power, surface-mount LED solution designed for demanding lighting applications requiring robust thermal management and consistent optical performance. The ceramic substrate provides excellent heat dissipation, allowing the LED to operate at higher drive currents and maintain lumen output and color stability over its lifetime. This series is particularly suited for applications where reliability, high luminous flux, and precise color control are critical.

1.1 Core Advantages

• Superior Thermal Performance: The ceramic package offers low thermal resistance, effectively transferring heat from the LED junction to the PCB and heatsink, thereby enhancing longevity and preventing premature lumen depreciation.
• High Power Handling: Capable of operating at up to 500mA continuous forward current, delivering high luminous output from a compact 9.2mm x 9.2mm footprint.
• Stable Color Consistency: Employing a rigorous binning system for both Correlated Color Temperature (CCT) and luminous flux to ensure minimal color and brightness variation within a production batch.
• Wide Viewing Angle: A typical 120-degree half-intensity angle provides broad, uniform illumination suitable for area lighting and downlighting applications.

1.2 Target Applications

This LED is engineered for professional and industrial lighting markets, including but not limited to: high-bay lighting, street lighting, architectural facade lighting, high-output downlights, and specialized horticultural lighting fixtures where precise spectral control and high efficiency are required.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These values represent the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for reliable long-term performance.

• Forward Current (IF): 500 mA (Continuous). Exceeding this current increases junction temperature exponentially, risking catastrophic failure.
• Forward Pulse Current (IFP): 700 mA (Pulse width ≤10ms, Duty Cycle ≤1/10). This rating allows for brief overdrive scenarios, such as during testing or in pulsed operation circuits, but must adhere strictly to the pulse conditions.
• Power Dissipation (PD): 15000 mW (15W). This is the maximum allowable power the package can dissipate, calculated as VF * IF. Proper heatsinking is mandatory to stay within this limit at high drive currents.
• Junction Temperature (Tj): 125 °C. The maximum temperature allowed at the semiconductor junction. The thermal design of the application must ensure Tj remains below this value under all operating conditions to maintain specified performance and lifespan.
• Soldering Temperature (Tsld): Reflow soldering at 230°C or 260°C for a maximum of 10 seconds. This defines the process window for PCB assembly.

2.2 Typical Electro-Optical Characteristics

Measured at a standard test condition of T_s = 25°C (substrate temperature).

• Forward Voltage (V_F): Typical 28V, Maximum 30V at I_F=350mA. The relatively high voltage indicates this is likely a multi-chip series configuration within the package. Designers must ensure the driver can provide sufficient voltage headroom.
• Reverse Voltage (V_R): 5V. LEDs are very sensitive to reverse bias. Circuit protection (e.g., diodes in parallel) is essential if there is any risk of reverse voltage being applied.
• Viewing Angle (2θ_1/2): 120° (Typical), 140° (Max). This wide beam angle is ideal for general illumination, reducing the need for secondary optics in many applications.

3. Binning System Explanation

A precise binning system is crucial for ensuring color and brightness uniformity in lighting projects. This LED uses a multi-dimensional binning approach.

3.1 Correlated Color Temperature (CCT) Binning

The product is offered in standard CCTs common to the lighting industry: 2700K (Warm White), 3000K, 3500K, 4000K, 4500K, 5000K (Neutral White), 5700K, and 6500K (Cool White). Each CCT is further divided into specific chromaticity regions on the CIE 1931 diagram (e.g., 8A, 8B, 8C, 8D for 2700K). This two-letter code ensures the emitted white light falls within a very tight color space, minimizing perceptible differences between individual LEDs.

3.2 Luminous Flux Binning

Flux is binned based on minimum values at 350mA drive current. For example, a Neutral White LED (3700-5000K) with a 3K flux code guarantees a minimum output of 800 lumens, with a typical value of 900 lumens. A 3L code guarantees 900 lumens minimum. It is important to note that the manufacturer specifies minimums, and actual shipped parts may exceed these values while still conforming to the ordered CCT bin.

3.3 Model Number Decoding

The model number T12019L(C、W)A follows a structured format that encodes key features:
T [Series Code] [Flux Code] [CCT Code] [Internal Code] - [Other Codes].
For instance, the '12' indicates the 9292 ceramic package. 'L', 'C', or 'W' indicates Warm White, Neutral White, or Cool White, respectively. Understanding this nomenclature is essential for accurate ordering.

4. Performance Curve Analysis

The provided graphs offer critical insights into the LED's behavior under varying conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve is non-linear. The forward voltage has a negative temperature coefficient; it decreases as the junction temperature rises. This must be considered in constant-current driver design to avoid thermal runaway in poorly heatsunk designs.

4.2 Relative Luminous Flux vs. Forward Current

The light output increases sub-linearly with current. While driving at higher currents (e.g., 500mA) yields more light, the efficacy (lumens per watt) typically decreases, and the junction temperature rises significantly. The optimal drive current balances output, efficiency, and lifetime.

4.3 Spectral Power Distribution & Junction Temperature Effects

The relative spectral energy curve shows the distribution of light across wavelengths for a white LED, which is a blue chip combined with a phosphor. The graph showing junction temperature vs. relative spectral energy illustrates color shift. As Tj increases, the phosphor conversion efficiency can change, often leading to a shift in CCT and a potential decrease in Color Rendering Index (CRI). Maintaining a low Tj is key to color stability.

5. Mechanical & Package Information

5.1 Dimensions and Outline Drawing

The LED has a square footprint of 9.2mm x 9.2mm with a typical height of approximately 1.6mm. The ceramic body provides a robust and flat surface for reliable pick-and-place assembly and efficient thermal contact.

5.2 Recommended Pad Layout and Stencil Design

The datasheet provides detailed land pattern and solder stencil drawings. The pad design is critical for both electrical connection and as a primary thermal path. The recommended stencil aperture ensures the correct volume of solder paste is deposited for a reliable solder joint without causing shorts. A tolerance of ±0.10mm is specified for these mechanical drawings.

5.3 Polarity Identification

The package includes markings or a physical feature (like a chamfered corner) to indicate the cathode (-) terminal. Correct orientation is vital during PCB assembly.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with standard lead-free (SAC) reflow processes. The maximum peak temperature should not exceed 260°C, and the time above 230°C should be limited to 10 seconds. A controlled ramp-up and cool-down rate is recommended to prevent thermal shock to the ceramic package.

6.2 Handling and Storage Precautions

LEDs are sensitive to electrostatic discharge (ESD). Handle in an ESD-protected environment using grounded equipment. Store in original moisture-barrier bags at conditions within the specified storage temperature range (-40°C to +100°C) and at low humidity. If the package has been exposed to ambient air for extended periods, baking may be required before reflow to prevent \"popcorning\" (package cracking due to vapor pressure).

7. Application Design Considerations

7.1 Thermal Management

This is the single most critical aspect of designing with high-power LEDs. Use a PCB with a thick copper layer (e.g., 2oz or more) and thermal vias under the LED pad to transfer heat to a secondary heatsink. The size and design of the external heatsink must be calculated based on the maximum ambient temperature, drive current, and desired junction temperature (recommended to be below 100°C for optimal lifetime). Thermal interface materials (TIMs) like thermal grease or pads can improve heat transfer.

7.2 Electrical Drive

A constant-current driver is mandatory for stable operation. The driver must be rated for the total forward voltage of the LED string (V_F * number of LEDs in series) and the chosen drive current. Include protection against over-voltage, reverse polarity, and open/short circuits. Consider dimming capabilities (PWM or analog) if required by the application.

7.3 Optical Integration

The wide 120-degree viewing angle may be sufficient for many applications. For more controlled beam patterns, secondary optics (reflectors or lenses) designed for the 9292 footprint can be used. Ensure any optical material can withstand the operating temperature and UV exposure from the LED.

8. Comparison with Alternative Technologies

Compared to plastic-packaged SMD LEDs (e.g., 5050), the 9292 ceramic series offers significantly higher power density and superior thermal performance, enabling longer life and higher reliability at high drive currents. Compared to COB (Chip-on-Board) LEDs, the 9292 is a discrete component offering more flexibility in array design, easier replacement, and often better point-source characteristics for optical control.

9. Frequently Asked Questions (FAQs)

9.1 What is the typical lifetime (L70/B50) of this LED?

The datasheet does not specify a lifetime curve (L70, time to 70% lumen maintenance). This is highly dependent on the application's thermal management and drive current. When operated at or below the recommended current with an appropriate heatsink, lifetimes exceeding 50,000 hours can be expected. Consult the manufacturer for specific reliability data.

9.2 Can I drive this LED at 500mA continuously?

Yes, 500mA is the maximum continuous forward current rating. However, doing so will generate maximum heat. The application must have exceptional thermal management to keep the junction temperature within safe limits (<<125°C) to achieve rated performance and longevity. Often, driving at a lower current (e.g., 350mA) offers a better balance of efficiency, lifetime, and thermal load.

9.3 How do I interpret the flux bin code (e.g., 3K, 3L)?

The flux code defines a guaranteed minimum luminous output at the test current (350mA). A \"3K\" bin has a minimum of 800 lm, while a \"3L\" bin has a minimum of 900 lm. You should select the bin based on the minimum brightness required for your design. Actual parts will be at or above this minimum value.

10. Design Case Study: High-Bay Luminaire

Scenario: Designing a 150W high-bay light for an industrial warehouse with a target illuminance of 200 lux at floor level.
Design Process:
1. Luminous Requirement: Calculate total required lumens based on area and target lux. Determine number of LEDs needed, factoring in optical system efficiency and lumen depreciation over time.
2. Electrical Design: Arrange LEDs in a series-parallel configuration compatible with a constant-current driver's voltage and current output. For example, 10 LEDs in series (~280V total V_F) driven at 350mA per string, with multiple strings in parallel.
3. Thermal Design: Use a metal-core PCB (MCPCB) with a high-performance dielectric layer. Mount the MCPCB onto a large aluminum finned heatsink. Perform thermal simulation or calculation to verify Tj < 100°C at 45°C ambient.
4. Optical Design: Select a secondary reflector or lens to achieve the desired beam pattern (e.g., a Type V distribution for wide, uniform coverage).
This case highlights the integration of electrical, thermal, and optical design around the core LED specifications.

11. Technical Principle Introduction

A white LED like the 9292 series operates on the principle of phosphor conversion. The core of the device is a semiconductor chip (typically based on InGaN) that emits blue light when forward biased (electroluminescence). This blue light is partially absorbed by a layer of yellow (and often red) phosphor material deposited on or around the chip. The phosphor re-emits light at longer wavelengths. The combination of the remaining blue light and the broad-spectrum yellow/red light from the phosphor is perceived by the human eye as white light. The ratio of blue to phosphor-converted light determines the Correlated Color Temperature (CCT) of the white output. The ceramic package serves primarily as a mechanically robust and thermally conductive platform for mounting the chip and phosphor, facilitating efficient heat extraction which is crucial for maintaining phosphor efficiency and chip performance.

12. Industry Trends and Developments

The high-power LED market continues to evolve towards higher efficacy (lumens per watt), improved color quality (higher CRI and R9 values), and greater reliability. Trends relevant to ceramic-packaged LEDs like the 9292 include:
Increased Power Density: Pushing more light output from the same or smaller package sizes, demanding ever-better thermal materials.
Color Tuning: Growth in tunable-white systems, which could be addressed by multi-channel ceramic packages or precise single-CCT binning for mixing.
Horticultural Lighting: Increased demand for LEDs with specific spectral outputs optimized for plant growth, driving the need for robust packages that can handle customized phosphor blends.
Advanced Thermal Materials: Development of ceramic composites and direct-bonded metal substrates with even lower thermal resistance.
Standardization: Continued industry efforts to standardize footprints, photometric testing, and lifetime reporting to simplify design and comparison for engineers.