LED RF-A3H10-W60P-E5 Ceramic Package Automotive White - Size 2.0x1.6x0.8mm - Voltage 2.8-3.4V - Power 5.1W - Technical Datasheet

1. Product Overview

The RF-A3H10-W60P-E5 is a ceramic package high-power LED designed primarily for automotive exterior lighting applications. It adopts a robust ceramic substrate and silicone encapsulation to ensure high reliability under extreme thermal and mechanical stress. This LED delivers a luminous flux of 360–460 lm at a forward current of 1000 mA, with a compact footprint of only 2.00 mm × 1.60 mm × 0.80 mm. The device is qualified according to AEC-Q102, making it suitable for headlamps, daytime running lamps, fog lamps, and other exterior lighting systems that demand long lifetime and consistent performance.

Key features include Pb-free reflow soldering compatibility, moisture sensitivity level 2, compliance with RoHS and REACH, and electrostatic discharge protection up to 8000 V (HBM). The LED operates over a wide temperature range from −40 °C to +125 °C, with a maximum junction temperature of 150 °C.

2. Technical Parameters

2.1 Electrical and Optical Characteristics

At a solder temperature of 25 °C and forward current of 1000 mA, the typical forward voltage is 2.8 V, with a guaranteed range of 2.8 V minimum to 3.4 V maximum. The reverse current at 5 V is below 10 µA. The luminous flux typically reaches 360 lm, with a bin range from 360 lm to 460 lm. The viewing angle (half-power) is 120° (typical). The color rendering index (Ra) is not specified in this datasheet, indicating that the product targets luminance rather than color quality.

2.2 Absolute Maximum Ratings

The device can withstand a power dissipation up to 5100 mW, forward continuous current up to 1500 mA, and peak forward current of 2000 mA (1/10 duty cycle, 10 ms pulse). Reverse voltage must not exceed 5 V. The operating temperature range is −40 °C to +125 °C, storage temperature same, and junction temperature maximum is 150 °C. ESD sensitivity (HBM) is rated at 8000 V.

2.3 Thermal Resistance

Thermal resistance from junction to solder point (RthJ-S) is typically 3.1 °C/W and maximum 4.1 °C/W at 1000 mA. This low thermal resistance ensures efficient heat transfer to the PCB, essential for maintaining junction temperature within safe limits during high-current operation.

3. Binning System

3.1 Forward Voltage Bins

At IF = 1000 mA, forward voltage is sorted into three bins:

• G0: 2.8 – 3.0 V
• H0: 3.0 – 3.2 V
• I0: 3.2 – 3.4 V

3.2 Luminous Flux Bins

Luminous flux is categorized into four bins:

• BG: 360 – 380 lm
• BH: 380 – 400 lm
• FD: 400 – 430 lm
• FE: 430 – 460 lm

3.3 Chromaticity Bins

Three chromaticity bins are defined based on CIE 1931 coordinates. The bins correspond to white regions typically used for automotive lighting:

• 57N: vertices (0.3221,0.3255) → (0.3206,0.3474) → (0.3375,0.3628) → (0.3365,0.3381)
• 60N: (0.3157,0.3211) → (0.3142,0.3430) → (0.3311,0.3584) → (0.3301,0.3337)
• 65N: (0.3029,0.3286) → (0.3206,0.3463) → (0.3222,0.3243) → (0.3069,0.3095)

These bins ensure consistent color appearance across production lots.

4. Performance Curves

4.1 Forward Voltage vs. Forward Current

At room temperature, forward voltage increases gradually from about 2.6 V at 200 mA to 3.4 V at 1500 mA. The curve exhibits typical diode behavior. Designers must account for this voltage variation to avoid exceeding absolute maximum ratings.

4.2 Relative Intensity vs. Forward Current

Relative luminous intensity rises almost linearly with current up to 1500 mA, reaching approximately 140% of the intensity at 1000 mA. At low currents (200 mA), intensity is about 20% of the value at 1000 mA.

4.3 Temperature Characteristics

As solder temperature increases from −40 °C to 125 °C, relative luminous intensity decreases to about 80% at 125 °C. Forward voltage also drops with rising temperature (about 0.1 V over the range). Chromaticity coordinates shift slightly with temperature, remaining within acceptable limits for automotive applications.

4.4 Spectrum Distribution

The LED emits white light with a broad spectrum from 400 nm to 750 nm. The spectral peak lies around 450 nm (blue) with a secondary phosphor-converted yellow component, resulting in a correlated color temperature (CCT) typical of automotive white LEDs.

4.5 Radiation Pattern

The radiation diagram shows a Lambertian-like distribution with a half-power angle of ±60° (120° total). The intensity falls off gradually from the center, ensuring homogeneous illumination in reflector or lens optics.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package measures 2.00 mm × 1.60 mm (top view) with a height of 0.80 mm. The bottom view reveals two large anode and cathode pads (1.85 mm × 0.55 mm and 1.00 mm × 1.45 mm). Polarity is indicated by a small notch on the package corner. All dimensions have a tolerance of ±0.2 mm unless otherwise specified.

5.2 Recommended Soldering Pattern

To ensure proper heat dissipation and mechanical reliability, the recommended PCB land pattern includes two rectangular pads: one of 1.95 mm × 0.65 mm for the cathode and another of 1.05 mm × 0.60 mm for the anode, with a 0.60 mm gap between them. The solder pad geometry should match the bottom metallization to avoid bridging.

5.3 Polarity Identification

The polarity is clearly marked by the package outline. The bottom view shows the anode pad is larger (left side) and the cathode pad smaller (right side), aligning with the soldering pattern diagram.

5.4 Carrier Tape and Reel Dimensions

The LEDs are supplied in 8 mm wide carrier tape with 4 mm pitch. Pocket dimensions are 2.30 mm × 1.80 mm (B0 × A0) with depth 0.95 mm. Each reel holds 4000 pieces. Reel dimensions: outer diameter 180 mm, hub diameter 60 mm, width 12 mm.

5.5 Packaging Quantity and Labeling

Standard packaging: 4000 pcs per reel. The reel comes with a moisture barrier bag and desiccant. Labels include part number, lot number, bin code (flux and chromaticity), forward voltage bin, quantity, and date.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile follows JEDEC J-STD-020. Key parameters:

• Average ramp-up rate: 3 °C/s max (from Tsmax to TP)
• Preheat: 150–200 °C for 60–120 s
• Time above 217 °C: 60 s max
• Peak temperature: 260 °C max, time within 5 °C of peak: 30 s max
• Cooling rate: 6 °C/s max
• Total time from 25 °C to peak: 8 min max

Do not perform more than two reflow cycles. If the interval between two reflows exceeds 24 hours, the LEDs may absorb moisture and require baking before the second pass.

6.2 Cautions

Avoid mechanical stress on the silicone lens during and after soldering. Do not warp the PCB after mounting. Use a double-head soldering iron if rework is necessary. Do not rapidly cool the device after soldering.

6.3 Storage Conditions

Before opening the vacuum-sealed bag: store at ≤30 °C and ≤75% RH for up to one year. After opening: use within 24 hours at ≤30 °C and ≤60% RH. If exceeded, bake at 60±5 °C for ≥24 hours before use.

7. Reliability Test Information

7.1 Test Items and Conditions

Reliability tests include reflow soldering (260 °C, 10 s, 2 cycles), moisture sensitivity level 2 preconditioning (85 °C/60% RH, 168 h), thermal shock (−40 °C to 125 °C, 1000 cycles), life test (125 °C, 1000 mA, 1000 h), and high temperature/high humidity life test (85 °C/85% RH, 1000 mA, 1000 h). All tests are performed on 20 samples with acceptance criteria 0/1 failures.

7.2 Failure Criteria

After each test, the following limits apply:

• Forward voltage change: ≤ 1.1 × USL (upper spec limit)
• Reverse current: ≤ 2.0 × USL
• Luminous flux drop: ≥ 0.7 × LSL (lower spec limit)

8. Handling Precautions

LED operating environment and mating materials must contain sulfur content below 100 ppm. Bromine and chlorine content must each be below 900 ppm, and their total below 1500 ppm. Volatile organic compounds (VOCs) from fixture materials can penetrate the silicone encapsulant and cause discoloration; therefore, only compatible adhesives and coatings should be used. Handle LEDs with tools gripping the side surfaces, never press the lens directly. ESD protection is mandatory during handling and assembly. For cleaning, isopropyl alcohol is recommended; avoid ultrasonic cleaning.

9. Application Notes

9.1 Typical Applications

This LED is ideal for automotive exterior lighting such as daytime running lamps, low/high beam headlamps, and fog lamps. Its small ceramic package enables compact optical designs, while high luminous flux and wide beam angle provide efficient light distribution.

9.2 Thermal Design Considerations

Because the junction temperature must stay below 150 °C, proper heat sinking is critical. The low thermal resistance (3.1 °C/W typical) allows use of standard FR4 PCBs with thermal vias, but for maximum current, metal-core PCBs (MCPCB) are recommended. A thermal simulation should be performed to ensure the solder temperature does not exceed 105 °C at maximum current.

9.3 Circuit Design

Always include a current-limiting resistor or constant-current driver to prevent thermal runaway. Reverse voltage protection should be provided; if the LED is subjected to reverse bias, leakage current may cause damage. When paralleling multiple LEDs, ensure matched forward voltages (same bin) to balance current distribution.