Dual-Color LED 1.6x1.6x0.7mm Orange/Green - Forward Voltage 1.8-3.6V - Power Dissipation 108mW - Technical Data Sheet

1. Product Overview

1.1 General Description

This dual-color LED is fabricated using an orange chip and a green chip in a compact 1.6mm x 1.6mm x 0.7mm package. It is designed for surface mount technology (SMT) assembly and is suitable for a wide range of indicator and display applications.

1.2 Features

• Extremely wide viewing angle of 140 degrees.
• Suitable for all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3 (per J-STD-020).
• RoHS compliant.

1.3 Applications

• Optical indicators
• Switches, symbols, and displays
• General purpose lighting and signaling

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics (Ta=25°C)

At a forward current of 20mA, the device exhibits the following characteristics:

• Dominant Wavelength: Orange: 620-630nm (typical 623nm); Green: 520-530nm (typical 525nm). The wavelength is binned into subgroups for tighter control.
• Spectral Half Bandwidth: Orange: 15nm; Green: 30nm.
• Forward Voltage: Orange: 1.8-2.4V (typical 2.0V); Green: 2.8-3.6V (typical 3.2V). Binned into specific voltage ranges.
• Luminous Intensity: Orange: 150-430 mcd (binned into C1-I2); Green: 260-900 mcd (binned into H00-1CM).
• Viewing Angle: 140 degrees (at half power).
• Reverse Current: ≤10 μA at VR=5V.
• Thermal Resistance (Junction to Solder Point): 450°C/W.

2.2 Absolute Maximum Ratings (Ta=25°C)

Note: The peak forward current is specified at 1/10 duty cycle, 0.1ms pulse width. Proper thermal management is required to ensure junction temperature does not exceed 95°C.

2.3 Binning System

The device is sorted into bins for dominant wavelength, forward voltage, and luminous intensity to facilitate consistent performance in applications. For orange, wavelength bins include E00 (620-625nm) and F00 (625-630nm). For green, bins include E10 (520-522.5nm), E20 (522.5-525nm), F10 (525-527.5nm), F20 (527.5-530nm). Forward voltage bins are designated as B1 (1.8-1.9V), B2 (1.9-2.0V) for orange; for green, bins range from 2.8-2.9V up to 3.5-3.6V. Luminous intensity bins are coded C1 through J2 for orange and H00 through 1CM for green. The bin codes are marked on the packaging label.

3. Performance Curves

The following typical performance curves are provided for reference at Ta=25°C unless otherwise stated.

3.1 Forward Voltage vs Forward Current

At low currents, the forward voltage increases logarithmically with current. The VF-IF curve indicates that at 20mA, the forward voltage is approximately 2.0V for orange and 3.2V for green. At higher currents, the voltage increases due to series resistance.

3.2 Relative Intensity vs Forward Current

The relative luminous intensity increases with forward current up to 30mA, showing a nearly linear relationship for both colors. At 20mA, the intensity is at its nominal rated value.

3.3 Pin Temperature Effects

As the ambient or pin temperature rises, the relative intensity decreases. At 85°C, the intensity drops to approximately 80% of the value at 25°C. The maximum allowable forward current is also derated with increasing temperature; at pin temperatures above 85°C, the current must be reduced to avoid exceeding the maximum junction temperature.

3.4 Dominant Wavelength vs Forward Current

For orange, the dominant wavelength shifts slightly (~1-2nm) with increasing current. For green, the shift is minimal over the range of 0-30mA. This information is important for color-critical applications.

3.5 Spectral Distribution

The orange emission peaks around 623nm with a FWHM of 15nm; the green emission peaks around 525nm with a FWHM of 30nm. The spectra show no secondary peaks, ensuring pure color output.

3.6 Radiation Pattern

The radiation pattern is Lambertian-like with a wide viewing angle of 140 degrees, making it suitable for indicator applications where wide angular coverage is desired.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The LED package measures 1.6mm x 1.6mm x 0.7mm (LxWxH). The bottom view shows four pads: pad 1 (anode for green), pad 2 (cathode for green), pad 3 (anode for orange), pad 4 (cathode for orange). The polarity is indicated by a mark on the package. The soldering pattern recommends 0.8mm x 0.6mm pads for each terminal.

4.2 Carrier Tape and Reel

The devices are packaged in carrier tape with a width of 8mm, a pitch of 4mm, and a pocket depth of 1.83mm. Each reel holds 4000 pieces. The reel diameter is 178mm (7 inches) with a hub diameter of 60mm.

4.3 Label Information

The label includes part number, spec number, lot number, bin codes (wavelength, voltage, intensity), quantity, and date code. The bin codes allow traceability of the specific performance parameters.

5. Reliability and Testing

5.1 Reliability Test Conditions

The LED has been qualified according to JEDEC standards. Tests include:

• Reflow: 260°C max, 10 seconds, 2 times.
• Temperature Cycle: -40°C to 100°C, 100 cycles.
• Thermal Shock: -40°C to 100°C, 300 cycles.
• High Temperature Storage: 100°C, 1000 hours.
• Low Temperature Storage: -40°C, 1000 hours.
• Life Test: 25°C, 20mA, 1000 hours.

All tests are passed with 0 failures allowed (Ac/Re 0/1) on sample sizes of 22 pieces.

5.2 Failure Criteria

After reliability tests, the following changes are considered failure: forward voltage increase >10% above upper spec limit, reverse current >2x upper spec limit, and luminous flux drop below 70% of lower spec limit.

6. SMT Reflow Soldering Guidelines

6.1 Reflow Profile

The recommended reflow profile is as follows:

• Average ramp-up rate (Tsmax to TP): ≤3°C/s
• Preheat: 150°C to 200°C for 60-120 seconds
• Time above 217°C: 60-150 seconds
• Peak temperature: 260°C, maximum 10 seconds
• Cooling rate: ≤6°C/s
• Time from 25°C to peak: ≤8 minutes

Reflow soldering should not exceed two times. If more than 24 hours elapse between soldering operations, baking is required to remove moisture.

6.2 Hand Soldering and Repair

Hand soldering is permitted with a soldering iron temperature below 300°C for less than 3 seconds, and only one soldering cycle is allowed. For repair, a double-head soldering iron is recommended to avoid damage to the package.

7. Handling Precautions and Storage

7.1 Environmental Restrictions

The LED should be used in environments where the sulfur content is below 100 ppm, and halogen content (bromine, chlorine) is below 900 ppm each, with total halogens below 1500 ppm. Volatile organic compounds (VOCs) can cause discoloration of the silicone lens, so materials used in the fixture should be tested for compatibility.

7.2 Storage Conditions

Before opening the moisture barrier bag, store at ≤30°C and ≤75% RH for up to 1 year. After opening, the LEDs must be used within 168 hours at ≤30°C and ≤60% RH. If the storage time is exceeded or the desiccant has faded, bake at 60±5°C for at least 24 hours before use.

7.3 ESD Protection

The LED is sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Proper ESD precautions, such as grounded workstations and wrist straps, should be taken during handling.

7.4 Cleaning

Cleaning after soldering is recommended if cleanliness is critical. Isopropyl alcohol is a suitable solvent. Ultrasonic cleaning is not recommended as it may damage the LED. Ensure that solvents do not attack the package materials.

8. Ordering Information

The device is supplied in tape and reel packaging with 4000 pieces per reel. The part number and bin codes are printed on the reel label. To order specific bins, specify the desired wavelength, voltage, and intensity ranges. For example, a typical ordering code may include the base part number followed by bin identifiers.