Dual-Color LED 3.2x1.0x1.48mm - Blue/Orange - Forward Voltage 2.0V/3.0V - Power 48/64mW - English Technical Datasheet

1. Product Overview

The dual-color LED is a compact surface-mount device fabricated using separate blue and orange chips. Its package dimensions are 3.2mm x 1.0mm x 1.48mm, making it suitable for space-constrained applications. The device combines two emission wavelengths in a single package, offering design flexibility for multi-color indication and display.

1.1 Key Features

• Extremely wide viewing angle of 140°, ensuring uniform light distribution.
• Compatible with all standard SMT assembly and reflow soldering processes.
• Moisture sensitivity level: Level 3 (MSL 3) per JEDEC standard.
• RoHS compliant, free from hazardous substances.
• Dual-color output: Orange (dominant wavelength ~620nm) and Blue (dominant wavelength ~465nm).
• Low forward voltage: Orange ~2.0V, Blue ~3.0V at 20mA.

1.2 Target Applications

• Optical indicators for consumer electronics, appliances, and industrial equipment.
• Switch and symbol backlighting, display panels.
• General-purpose status indication where dual colors provide clear visual feedback.

2. Detailed Technical Parameter Analysis

All electrical and optical characteristics are measured at Ts=25°C and IF=20mA unless otherwise noted. The product is designed for reliable operation within specified limits.

2.1 Electro-Optical Characteristics

Dominant Wavelength (λd): Orange chip: 615-630nm, typical 620nm (tested at 20mA). Blue chip: 460-475nm, typical 465nm. The spectral half bandwidth (Δλ) is 15-30nm for both chips, indicating relatively pure color output.

Forward Voltage (VF): Orange chip has VF bins ranging from 1.8V to 2.2V typical 2.0V. Blue chip has VF bins from 2.8V to 3.6V typical 3.0V. The low forward voltage reduces power supply requirements and minimizes heat generation.

Luminous Intensity (IV): Orange chip offers intensity bins from 100 mcd to 350 mcd typical 150-230 mcd. Blue chip offers intensity bins from 100 mcd to 350 mcd typical 150-230 mcd. The intensity varies by bin; designers should select appropriate bins for uniform brightness.

Viewing Angle (2θ1/2): 140 degrees, enabling wide-area visibility. This is beneficial for edge-lit indicators or applications requiring broad illumination.

Reverse Current (IR): Less than 10 µA at VR=5V, ensuring minimal leakage in reverse bias conditions.

Thermal Resistance (RTHJ-S): 450°C/W, which is relatively high. Adequate thermal management is essential to maintain junction temperature within limits.

2.2 Absolute Maximum Ratings

Design must ensure that peak current and power dissipation never exceed these limits. Proper current limiting resistors are mandatory.

3. Binning System Explanation

The product uses a binning system to categorize LEDs by forward voltage (VF), dominant wavelength (WLD), and luminous intensity (IV). Each reel contains parts from specific bins to ensure consistency within a single order.

3.1 Forward Voltage Bins (Orange)

Orange chip VF bins: B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V). Typical used bin is B0 or C0.

3.2 Forward Voltage Bins (Blue)

Blue chip VF bins: G0 (2.8-3.0V), H0 (3.0-3.2V), I0 (3.2-3.4V), J0 (3.4-3.6V). Common bin is H0.

3.3 Wavelength Bins

Orange wavelength bins: D00 (615-620nm), E00 (620-625nm), F00 (625-630nm). Blue wavelength bins: C00 (460-465nm), D00 (465-470nm), E00 (470-475nm).

3.4 Intensity Bins

Orange intensity bins: B0 (100-150mcd), C0 (150-230mcd), D0 (230-350mcd). Blue intensity bins: G00 (100-150mcd), H00 (150-230mcd), I00 (230-350mcd).

4. Performance Curve Analysis

The datasheet provides several characteristic curves to help designers understand device behavior.

4.1 Forward Voltage vs Forward Current (IV Curve)

The IV curve shows a typical exponential relationship. At 20mA, forward voltage is around 2.0V for orange and 3.0V for blue. The curve is steep, emphasizing the need for current regulation rather than voltage drive.

4.2 Relative Intensity vs Forward Current

Relative intensity increases nearly linearly with forward current up to 20mA. Beyond this, efficiency may drop due to heating. Operating at rated current ensures optimal output.

4.3 Temperature Effects on Intensity and Forward Current

At higher ambient temperatures (up to 100°C), relative intensity decreases by about 10-15%. The maximum allowed forward current must be derated as pin temperature rises above 25°C.

4.4 Wavelength Shift vs Forward Current

Dominant wavelength shifts slightly with current: for orange, wavelength increases ~1nm from 0 to 30mA; for blue, wavelength increases ~2nm over the same range. This effect should be considered in color-sensitive applications.

4.5 Spectral Distribution

The spectrum shows two distinct peaks at ~465nm (blue) and ~620nm (orange) with narrow half-widths. No significant secondary emission is present.

4.6 Radiation Pattern

The radiation pattern is symmetric with half-power angle of 140°. The intensity distribution is Lambertian-like, providing uniform coverage across a wide angle.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED body measures 3.20mm (length) x 1.00mm (width) x 1.48mm (height). The bottom view shows a polarity mark (cathode) for correct orientation. Four solder pads are provided: two for anode/cathode of each chip. The recommended soldering pattern includes 0.35mm wide traces with 2.00mm spacing.

5.2 Carrier Tape and Reel

LEDs are packaged in carrier tape with 8.00mm width, pitch 4.00mm. Each reel contains 3000 pieces. Reel dimensions: outer diameter 178mm, hub diameter 60mm, hub slot width 13mm. Tape feed direction is marked.

5.3 Polarity Identification

The polarity mark on the bottom indicates the common cathode or anode? According to the bottom view, pin 1 is orange anode, pin 2 is orange cathode/blue anode? Actually the drawing shows pins labeled O (orange) and B (blue). Detailed connection: The LED has separate chips; each chip has its own anode and cathode. Designers must refer to the pinout diagram to avoid reverse biasing.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

The recommended reflow profile: Preheating zone from 150°C to 200°C for 60-120 seconds, ramp-up rate ≤3°C/s. Time above 217°C (liquidus) should be 60-150 seconds. Peak temperature 260°C max, hold time ≤10 seconds. Cooling rate ≤6°C/s. Do not exceed two reflow cycles. If more than 24 hours between cycles, baking is required.

6.2 Hand Soldering

If manual soldering is necessary, use iron temperature ≤300°C for less than 3 seconds per joint. Only one touch is allowed. Avoid applying mechanical stress during heating.

6.3 Cleaning

Use isopropyl alcohol as cleaning solvent. Ultrasonic cleaning is not recommended as it may damage the LED. Ensure the solvent does not attack the silicone encapsulation.

6.4 Storage Conditions

Before unsealing: store at ≤30°C and ≤75% RH for up to one year. After opening: use within 24 hours at ≤30°C, ≤60% RH. If moisture absorption is suspected, bake at 60±5°C for ≥24 hours.

7. Packaging and Ordering Information

Standard packaging: 3000 LEDs per reel in anti-static carrier tape, sealed in a moisture barrier bag with desiccant, then packed in a cardboard box. Label includes part number, spec number, lot number, bin code (VF, wavelength, intensity), quantity, and date code. Ordering is based on full reel quantities and specific bin codes.

8. Application Recommendations

Typical uses: status indicators (e.g., orange for warning, blue for power), bi-color backlighting, display signs. Design considerations: Always use current-limiting resistors; calculate resistor value based on supply voltage and VF bin. Provide adequate heat sinking if ambient temperature exceeds 50°C or if multiple LEDs are densely packed. For series/parallel arrays, match VF bins to ensure equal current sharing.

9. Technical Comparison with Single-Color LEDs

This dual-color LED replaces two separate LEDs, saving PCB space and assembly cost. The independent chips allow full control of each color separately, enabling more complex indication schemes. However, the thermal resistance is higher compared to single-chip packages (450°C/W vs typical 200-300°C/W), so thermal design needs more attention.

10. Frequently Asked Questions (FAQ)

Q: Can I drive both colors simultaneously? Yes, but total power must not exceed the absolute maximum rating for each chip. Ensure the sum of currents does not cause overall temperature rise above 85°C junction.

Q: How can I ensure uniform brightness across multiple LEDs? Order LEDs from the same intensity bin (e.g., H00 for blue). Use an appropriate drive current (e.g., 20mA) and ensure consistent temperature.

Q: What is the ESD sensitivity? HBM 1000V Class 1C. Use standard ESD precautions during handling and assembly.

11. Practical Application Case

In a network switch, dual-color LEDs are used to indicate link status: solid orange for 100Mbps, solid blue for 1Gbps, and blinking orange for activity. The compact 3.2x1.0mm size allows mounting on a front panel with 2.54mm pitch. The wide 140° viewing angle ensures visibility from all directions.

12. Principle Introduction

The blue chip is typically InGaN (indium gallium nitride) emitting near 465nm. The orange chip is typically AlInGaP (aluminum indium gallium phosphide) emitting near 620nm. Both are mounted on a common substrate with separate wire bonds. The encapsulation uses clear silicone to maintain high light extraction efficiency and resist yellowing.

13. Development Trends

The trend in dual-color LEDs is toward higher luminous efficacy (up to 200 lm/W for monochrome) and smaller package sizes (e.g., 2.5x0.5mm). Integration with smart drivers and addressability (like WS2812) is also common. This product aligns with the industry move toward miniaturization and multi-functionality.