EMC3030 Full Color LED Datasheet - Dimensions 3.0x3.0mm - Voltage 1.6-3.4V - Power 0.468-0.648W - English Technical Document

1. Product Overview

The EMC3030 series is a high-performance, full-color surface-mount LED designed for demanding lighting applications. This component integrates red, green, and blue (RGB) chips within a compact 3.0mm x 3.0mm package, enabling the creation of a wide spectrum of colors through additive color mixing. Its primary design focus is on delivering high luminous output and efficacy while maintaining robust operation under high drive currents.

Core Advantages: The key strengths of this LED include its high lumen output, suitability for high-current operation, and low thermal resistance. These features contribute to stable performance and long operational life in various environments.

Target Market: This LED is engineered for applications requiring vibrant, dynamic, or tunable white light. Its primary target markets are outdoor lighting and architectural lighting, where color effects, durability, and energy efficiency are paramount.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key technical parameters specified in the datasheet.

2.1 Electro-Optical Characteristics

The luminous flux output is measured at a standard test current (I_F) of 150mA and an ambient temperature (T_a) of 25°C. The typical ranges are:

• Red Chip: 22 to 28 lumens (lm)
• Green Chip: 44 to 51 lm
• Blue Chip: 7 to 12 lm

A measurement tolerance of ±7% applies to these luminous flux values. The correlated color temperature (CCT) for white light mixtures is derived from the CIE 1931 chromaticity diagram based on the combined output of the individual chips.

The device features a wide viewing angle (2θ_1/2) of 120 degrees, which is the off-axis angle where luminous intensity drops to half of its peak value. This ensures a broad and even light distribution.

2.2 Electrical Parameters

The forward voltage (V_F) varies by chip color at I_F = 150mA:

• Red: 1.6V to 2.6V (Typical)
• Green: 2.6V to 3.4V (Typical)
• Blue: 2.6V to 3.4V (Typical)

The forward voltage measurement tolerance is ±0.1V. The reverse voltage (V_R) rating for all chips is a maximum of 5V, with a reverse current (I_R) of less than 10µA at this voltage. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

2.3 Thermal and Absolute Maximum Ratings

Operating the LED beyond these limits may cause permanent damage.

• Maximum Forward Current (I_F): 180mA (Continuous) for all colors.
• Maximum Pulse Forward Current (I_FP): 250mA (Pulse width ≤100µs, Duty cycle ≤1/10).
• Maximum Power Dissipation (P_D):
  • Red: 468 mW
  • Green: 648 mW
  • Blue: 648 mW
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +105°C.
• Thermal Resistance (R_{th j-sp}): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 5°C/W for all colors at I_F=150mA. This low value is crucial for effective heat management.

It is critically important that the total power dissipation in the application does not exceed the specified P_D ratings to ensure reliability.

3. Binning System Explanation

The LEDs are sorted (binned) according to key performance parameters to ensure consistency in production runs. The binning is performed at I_F = 150mA and T_a = 25°C.

3.1 Dominant Wavelength Binning

This defines the precise color of light emitted by each chip.

• Red: Binned into codes RB2 (615-620nm), RC1 (620-625nm), and RC2 (625-630nm).
• Green: Binned into a single code GC3, covering a range from 520nm to 535nm in 2.5nm steps (e.g., 520-522.5nm, 522.5-525nm, etc.).
• Blue: Binned into multiple codes: BB3 (450-452.5nm), BB4 (452.5-455nm), up to BC6 (467.5-470nm).

The tolerance for wavelength measurement is ±1nm.

3.2 Luminous Flux Binning

LEDs are grouped based on their light output.

• Red: Code DR0 (22-28 lm)
• Green: Code DG0 (44-51 lm)
• Blue: Code DB0 (7-12 lm)

The tolerance for luminous flux measurement is ±7%.

3.3 Forward Voltage Binning

This sorting ensures electrical compatibility in circuit design. Voltage bins range from AB2 (1.8-2.0V) to AF1 (3.2-3.4V), with a measurement tolerance of ±0.1V.

4. Performance Curve Analysis

The datasheet includes several graphs that illustrate the LED's behavior under different conditions. Understanding these is key to optimal design.

• Forward Current vs. Relative Intensity (Fig. 3): This curve shows how light output increases with drive current. It is typically non-linear, and operating near the maximum current may reduce efficacy and lifespan.
• Forward Current vs. Forward Voltage (Fig. 4): This IV curve is essential for driver design. The forward voltage increases with current, and the relationship differs slightly between the red, green, and blue chips due to their different semiconductor materials.
• Ambient Temperature vs. Relative Luminous Flux (Fig. 5): This graph demonstrates thermal derating. As the ambient temperature rises, the light output decreases. Designers must account for this to maintain consistent brightness in warm environments.
• Ambient Temperature vs. Relative Forward Voltage (Fig. 6): The forward voltage typically decreases as temperature increases. This characteristic is important for constant-current driver stability.
• Ambient Temperature vs. Maximum Forward Current (Fig. 7): This derating curve is critical. It shows the maximum allowable forward current must be reduced as ambient temperature increases to prevent overheating. For example, at 85°C, the maximum current for the red chip is approximately 136.4mA, and for green/blue chips, it is around 93.7mA and 90.9mA respectively.
• Color Spectrum (Fig. 1) & Viewing Angle Distribution (Fig. 2): These figures provide visual references for the spectral output and beam pattern of the LED.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in an EMC3030 surface-mount package. The overall dimensions are 3.0mm in length and 3.0mm in width. The detailed mechanical drawing specifies the exact placement of the LED chips, cathode/anode markings, and the lens structure. The general tolerance for dimensions is ±0.2mm unless otherwise noted.

5.2 Recommended Solder Pad Design

A land pattern (footprint) is provided for PCB design. Adhering to this recommended pad layout is essential for reliable soldering, proper thermal transfer, and preventing tombstoning during reflow. The pad dimensions have a tolerance of ±0.1mm.

5.3 Polarity Identification

The package includes markings to identify the cathode (negative) terminal for each color chip. Correct polarity connection is mandatory to avoid damaging the LED.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The LED is compatible with lead-free (Pb-free) reflow soldering processes. The specified profile is critical:

• Peak Package Body Temperature (T_p): Maximum 260°C.
• Time above Liquidous (T_L=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (T_L to T_p): Maximum 3°C/second.
• Ramp-down Rate (T_p to T_L): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Strictly following this profile prevents thermal shock and damage to the LED package and internal wire bonds.

6.2 Handling and Storage Precautions

LEDs are sensitive to electrostatic discharge (ESD). Use appropriate ESD-safe handling procedures (wrist straps, conductive mats). Store in a dry, anti-static environment within the specified temperature range (-40°C to +105°C). Avoid exposure to moisture before soldering; if necessary, follow the manufacturer's baking instructions.

7. Packaging and Ordering Information

7.1 Tape and Reel Packaging

The LEDs are supplied on embossed carrier tape wound onto reels for automated pick-and-place assembly. The reel can hold a maximum of 5,000 pieces. The dimensional drawing of the tape, including pocket spacing and reel diameter, is provided. The cumulative tolerance over 10 pitches is ±0.25mm.

7.2 Part Numbering System

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "3C" for the 3030 package.
• CCT/Color Code: "CW" for RGB (full color).
• Number of Serial/Parallel Chips, Component Code, Color Code: These digits specify internal configurations, binning selections (like wavelength and flux), and other product variants.

Consulting the full binning table is necessary to decode a specific part number for its exact performance characteristics.

8. Application Recommendations

8.1 Typical Application Scenarios

• Architectural Facade Lighting: Creating dynamic color-changing effects on buildings.
• Outdoor Landscape Lighting: Illuminating pathways, trees, and water features with colored light.
• Signage and Display Backlighting: For vibrant, attention-grabbing signs.
• Entertainment and Stage Lighting: Where programmable color is required.

8.2 Critical Design Considerations

• Thermal Management: This is the most critical factor for longevity. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder point temperature within safe limits, especially when driving at high currents or in high ambient temperatures.
• Drive Current: Use a constant-current driver tailored for RGB LEDs. The current should be set based on the required brightness and thermal derating curves. Do not exceed the absolute maximum ratings.
• Color Mixing and Control: To achieve consistent white light or specific colors, use pulse-width modulation (PWM) to independently control the intensity of each chip. Consider the different luminous efficacies of the red, green, and blue chips in your control algorithm.
• Optics: Secondary optics (lenses, diffusers) may be needed to achieve the desired beam angle and color mixing uniformity.

9. Technical Comparison and Differentiation

While direct competitor comparisons are not in the datasheet, the EMC3030's specifications highlight its competitive positioning:

• vs. Smaller Packages (e.g., 3528): The 3030 package typically offers higher power handling and lumen output due to a larger thermal path and potentially larger chip size.
• vs. Standard 5050 RGB LEDs: The 3030 may offer a more compact solution with similar or better performance, allowing for higher pixel density in dense arrays or finer-pitch displays.
• Key Differentiators: The specified low thermal resistance (5°C/W) and high maximum drive current (180mA) suggest a design optimized for thermal performance, enabling sustained high-brightness operation compared to parts with higher thermal resistance.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive all three chips (RGB) at 180mA simultaneously?
A: No. The absolute maximum power dissipation (P_D) must not be exceeded. Driving red at 180mA (V_F~2.1V) gives ~378mW, which is below its 468mW limit. However, driving green or blue at 180mA (V_F~3.0V) gives ~540mW, which is below their 648mW limit. The total power for all three would be ~1.46W, which must be dissipated by the PCB/heatsink. More importantly, you must consult the derating curve (Fig. 7) which reduces the allowable current at higher ambient temperatures.

Q: Why is the luminous flux for the blue chip lower than red and green?
A: This is related to human eye sensitivity (photopic response). The eye is least sensitive to blue light (~450-470nm). Therefore, a blue LED requires more radiant power to achieve the same perceived brightness (luminous flux) as a green LED, where the eye's sensitivity peaks. The specified values reflect this physiological reality.

Q: How do I select the correct bin codes for my project?
A: For color-critical applications (e.g., uniform white light across multiple LEDs), you must specify tight bins for dominant wavelength (especially for green and blue) and forward voltage. For less critical applications, wider bins may be acceptable and more cost-effective. Always consult the full binning tables when placing an order.

11. Practical Design Case Study

Scenario: Designing an outdoor architectural linear light with tunable white light (2700K to 6500K).

Implementation:

1. LED Selection: Use the EMC3030 RGB LEDs. The red, green, and blue outputs are mixed to simulate various white points along the black body locus.
2. Thermal Design: The fixture is aluminum. The PCB is a metal-core PCB (MCPCB) to efficiently transfer heat from the LED solder point to the fixture body. Calculations are performed to ensure the junction temperature remains below 85°C at the maximum ambient temperature (e.g., 40°C) and drive current.
3. Electrical Design: A constant-current LED driver with three independent PWM channels is used. The current is set to 150mA per chip, providing a good balance of brightness and efficacy. The forward voltage bins are considered to ensure the driver's compliance voltage is sufficient for all units in production.
4. Optical Design: A milky white diffuser cover is placed over the LED array to blend the individual RGB points into a uniform, glare-free linear light source.
5. Control: A microcontroller runs an algorithm that maps desired CCT values to specific PWM duty cycles for the R, G, and B channels, calibrated based on the actual binning of the LEDs used.

12. Operating Principle Introduction

The EMC3030 is a multi-chip LED. Each chip is a semiconductor diode made from different material systems:

• Red: Typically based on Aluminum Gallium Indium Phosphide (AlGaInP).
• Green & Blue: Typically based on Indium Gallium Nitride (InGaN).

When forward voltage is applied, electrons and holes recombine within the semiconductor's active region, releasing energy in the form of photons (light). The specific wavelength (color) of the light is determined by the bandgap energy of the semiconductor material. The three primary colors (Red, Green, Blue) are combined additively within the single package. By independently controlling the intensity of each chip, a vast spectrum of colors, including various shades of white light, can be produced.

13. Technology Trends

The development of full-color LEDs like the EMC3030 is driven by several ongoing trends in the lighting industry:

• Increased Efficacy (lm/W): Continuous improvements in epitaxial growth and chip design lead to higher light output per electrical watt, improving energy efficiency.
• Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and tighter binning processes enable more accurate and consistent color production, which is critical for architectural and retail lighting.
• Higher Power Density and Better Thermal Management: Package designs are evolving to extract heat more efficiently, allowing for higher drive currents and sustained lumen output in compact form factors.
• Integration with Smart Controls: LEDs are increasingly designed to be paired with intelligent drivers and IoT connectivity, enabling dynamic color tuning, scheduling, and data collection for human-centric and energy-saving lighting solutions.
• Miniaturization: The push for smaller pixels in fine-pitch direct-view LED displays continues, though this balances against the need for thermal performance and light output.