Full-Color RGB SMD LED RF-W1SA15IS-A44 Specification - Size 1.6x1.7x1.6mm - Forward Voltage R:1.7-2.4V G/B:2.4-3.2V - Power Dissipation 48mW per Channel - IPX6 Waterproof

1. Product Overview

This document provides the complete technical specification for the full-color RGB SMD LED model RF-W1SA15IS-A44, a common anode device designed for high-performance display and lighting applications. The LED features a compact package measuring 1.6 mm x 1.7 mm x 1.6 mm, with a surface brush ink technology that delivers exceptionally high contrast and a matte finish. It is rated IPX6 waterproof, making it suitable for outdoor environments. The device is RoHS compliant and designed for Pb-free reflow soldering. Moisture sensitivity level is 5a, requiring careful handling and storage. With an extremely wide viewing angle of 110° and high luminous intensity, this LED is ideal for outdoor full-color video screens, indoor and outdoor decorative lighting, amusement applications, and general use.

2. Technical Parameters and Electrical Characteristics

The electrical and optical characteristics are specified at Ts = 25°C. The product contains three independent LED chips: Red (R), Green (G), and Blue (B), driven separately. Key parameters include forward voltage (VF), dominant wavelength, luminous intensity, reverse current, and spectral bandwidth.

2.1 Forward Voltage (VF)

Red chip: VF min 1.7V, max 2.4V at IF = 10mA. Green and Blue chips: VF min 2.4V, max 3.2V at IF = 10mA (Green) and IF = 5mA (Blue). These values ensure compatibility with common drive circuits. Measurement tolerance is ±0.1V.

2.2 Dominant Wavelength and Color Binning

Wavelength ranges: Red 617~628 nm (5 nm per bin), Green 520~545 nm (3 nm per bin), Blue 460~475 nm (3 nm per bin). The tight binning ensures color consistency across production batches. Spectral radiation bandwidth (Δλ) is 24 nm for Red, 38 nm for Green, 30 nm for Blue.

2.3 Luminous Intensity (IV)

Luminous intensity values at test currents: Red min 250 mcd, typ 420 mcd, max 715 mcd; Green min 680 mcd, typ 1150 mcd, max 1950 mcd; Blue min 70 mcd, typ 110 mcd, max 175 mcd. Bin ratio is 1:1.3 for all colors, allowing selection for consistent brightness. Measurement tolerance is ±10%.

2.4 Reverse Current and Absolute Maximum Ratings

Reverse current is ≤6 μA at VR = 5V for all chips. Absolute maximum ratings: forward current Red 20 mA, Green 15 mA, Blue 15 mA; reverse voltage 5V; operating temperature -30°C to +85°C; storage temperature -40°C to +100°C; power dissipation 48 mW per channel; junction temperature 100°C; ESD (HBM) 1000V. Care must be taken not to exceed these limits.

3. Binning System

The LED is binned by forward voltage (VF), dominant wavelength (Wd), and luminous intensity (IV). The binning information is printed on the product label along with part number, lot number, and quantity. This allows customers to order specific combinations for display uniformity. Typical bin ranges: VF bins for Red (e.g., 1.7-1.9V, 1.9-2.1V, etc.), wavelength bins as per 5nm/3nm steps, and intensity bins with 1:1.3 ratio. The label also includes forward current (IF) test condition and date code.

4. Performance Curves and Optical Characteristics

The specification includes several typical optical characteristic curves that are essential for understanding the device behavior under different conditions.

4.1 Forward Voltage vs. Forward Current (V-I Curve)

The V-I curve shows the exponential relationship typical of LEDs. For Red, at 10 mA the VF is around 2.0V; for Green and Blue, around 2.8V at 10 mA. The curves allow designers to predict current changes with small voltage variations.

4.2 Forward Current vs. Relative Intensity

Relative intensity increases linearly with current up to the maximum rating. At 20 mA, Red reaches about 200% relative intensity; Green at 20 mA is around 150%; Blue at 10 mA is about 120%. This helps in setting drive current to achieve desired brightness.

4.3 Luminous Intensity vs. Ambient Temperature

Intensity decreases as temperature rises. At 85°C, Red intensity drops to about 80% of the 25°C value, Green to 70%, Blue to 75%. Proper thermal management is crucial to maintain brightness stability.

4.4 Solder Temperature vs. Forward Current Derating

Derating curves show that at high solder pad temperatures, the maximum allowed forward current must be reduced. For example, at 85°C, the recommended current for Red is reduced from 20 mA to about 12 mA, for Green from 15 mA to 10 mA, for Blue from 15 mA to 10 mA.

4.5 Spectrum Distribution and Viewing Angle

The spectral distribution shows peak wavelengths at approximately 625 nm (Red), 530 nm (Green), and 470 nm (Blue). The FWHM values confirm saturated colors. The radiation pattern is nearly Lambertian with a half-angle of 110°, providing wide uniform illumination.

5. Mechanical and Packaging Information

The LED package dimensions are precisely defined with tolerances of ±0.1 mm. The top view indicates pin assignments: Pin 1 is common anode (+), Pin 2 is Red cathode (R-), Pin 3 is Green cathode (G-), Pin 4 is Blue cathode (B-). The package has a clear polarity mark. Bottom view shows solder pad layout with recommended soldering patterns: pad size 0.7 x 0.5 mm for common anode, 0.4 mm for each color. A glue filling recommendation is given: filling height must be ≥0.65 mm for mechanical protection and water resistance. The device is supplied in tape and reel packaging: 15,500 pcs per reel. Carrier tape dimensions are specified (pitch, cavity size). Reel dimensions: outer diameter 400±2 mm, hub diameter 100±0.4 mm. The label includes all binning and traceability information. Moisture barrier bag with desiccant and humidity indicator card is used for moisture protection. Cardboard box packaging for shipment.

6. Soldering and Assembly Guidelines

Reflow soldering profile is critical for reliability. The recommended profile: preheat from 150°C to 200°C for 60-120 seconds, ramp-up ≤4°C/s to peak temperature 245°C (max 10 seconds), cooling ≤6°C/s. Only one reflow cycle is allowed. Use middle temperature solder paste. Nitrogen reflow is recommended to avoid oxidation. Hand soldering: iron temperature ≤300°C for ≤3 seconds, one time only. Repairing should be avoided; if necessary use double-head iron. Cleaning: use alcohol; avoid water, benzene, thinner, and ionic liquids containing Cl or S. After soldering, cool to room temperature before handling.

7. Packaging and Ordering Information

The product is ordered by part number RF-W1SA15IS-A44. Packaging quantity: 15,500 pcs per reel. Reels are sealed in anti-static moisture barrier bags with desiccant and humidity card. Cardboard box dimensions are provided but not specified in the PDF. The label contains: part number (PART NO.), lot number (LOT NO.) including packing machine number, serial number, bin codes for IV, VF, Wd, IF, quantity (QTY), and date code (DATE). Customers should specify binning requirements when ordering.

8. Application Notes and Design Considerations

This LED is designed for outdoor full-color video screens, indoor/outdoor decorative lighting, amusement equipment, and general signage. Key design considerations: ensure proper current limiting (use constant current drive), avoid reverse voltage >5V, provide adequate thermal management (LED surface temperature <55°C, soldering pad temperature <75°C, junction temperature <100°C). For high-density arrays, consider PCB thermal resistance and spacing. The device is IPX6 waterproof, but additional sealing (glue filling) is recommended for outdoor use. For long-term reliability, operate within derating curves. In environments with high humidity, hydrogen sulfide, or salt, life may be reduced. When first powering up after storage, start at 20% of the target current to gradually desorb moisture.

9. Technical Comparison with Alternative Products

Compared to standard RGB SMD LEDs (e.g., 3528, 5050 packages), this 1.6x1.7x1.6mm device offers a smaller footprint, enabling higher pixel density. The surface brush ink technology provides superior contrast ratio (matte surface reduces reflection). IPX6 rating is unique among similar-size RGB LEDs; most competitors offer only IPX4 or no waterproofing. The wide viewing angle of 110° is competitive. However, the maximum forward current is lower (20/15/15 mA) compared to larger packages that can handle higher currents, so this device is best suited for applications requiring many small pixels rather than extremely high brightness per pixel. The binning granularity (5nm and 3nm) is finer than some alternatives, ensuring better color uniformity.

10. Frequently Asked Questions (based on technical parameters)

Q1: Can I drive the red, green, and blue chips simultaneously at maximum current?
No. The total power dissipation of the package must not exceed 48 mW per channel. If all three chips operate at maximum current simultaneously (R 20mA, G 15mA, B 15mA), the total power would exceed the rating. You must limit the combined current or use PWM with low duty cycle to stay within thermal limits.

Q2: What is the recommended storage condition before use?
Store in original moisture barrier bag at ≤30°C and ≤60% RH. If bag is opened, use within 12 hours. Unused parts should be stored at ≤30°C and ≤10% RH, then baked at 65±5°C for 24 hours before next use.

Q3: Can I use this LED with a common cathode driver?
No. The device is common anode. You must connect the common anode to positive supply and drive each cathode with constant current sinks.

Q4: How do I interpret the luminous intensity bin code?
The bin codes (e.g., IV) are provided on the label. Each bin covers a 1:1.3 range. For example, if typical IV is 420 mcd, bin range might be 420-546 mcd. You must order specific bins to match brightness across a display.

11. Practical Design Cases

Case 1: Outdoor P8 LED Display Module
A common application for this small RGB LED is in pixel pitch ≤8mm outdoor screens. Using a 16x16 pixel matrix, each LED needs to produce 1000-2000 cd/m² brightness. With typical drive current of 10mA per color, the red contributes ~420 mcd, green ~1150 mcd, blue ~110 mcd. To achieve white balance (e.g., 6500K), the red and blue currents must be increased (but limited by max ratings) while green is reduced via PWM. The compact size allows dense packing. Proper glue filling (≥0.65mm) ensures IPX6 compliance.

Case 2: Indoor decorative LED strip
The LED can be used in flexible strips for accent lighting. With constant current drive at low current (e.g., 2-5 mA), the efficiency is higher but brightness lower. The wide viewing angle provides uniform light distribution. The matte surface eliminates hot spots. The device's small size enables narrow strip designs.

12. Operating Principle of an RGB SMD LED

This LED is a surface-mount device that integrates three separate semiconductor dice (red, green, blue) in a single epoxy package. Each die emits light through electroluminescence when forward biased. The common anode design means all three anodes are connected internally to a common positive terminal (pin 1). The cathodes are separate. By controlling the current through each die independently, any color within the RGB gamut can be produced. The phosphor is not used (direct emission). The contrast ratio is enhanced by a black or dark-colored epoxy with a matte surface that absorbs ambient light. The IPX6 waterproof rating is achieved by the glue filling that seals the internal cavity.

13. Technology Trends and Future Outlook

The trend in SMD RGB LEDs is toward smaller packages (e.g., 1.5x1.5mm, 1.0x1.0mm) for ultra-fine pitch displays. However, maintaining high luminous efficacy and wide viewing angle in smaller packages is challenging. This device balances size and performance. Future developments include higher efficiency (lm/W) through improved die materials (e.g., GaN on Si for blue/green, AlInGaP for red), better thermal management (e.g., embedded ceramic substrates), and integrated ESD protection. The adoption of common anode simplifies PCB layout but limits compatibility with some driver ICs. Newer driver ICs support both common anode and common cathode. The IPX6 waterproofing is becoming standard for outdoor signage. As microLED technology matures, it may eventually replace traditional SMD RGB LEDs in high-end applications, but cost and manufacturing yield remain barriers.