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G9 LED Filament Specification - Size 12x28x2.3mm - AC230V - Power 2.8-3.4W - Color Temperature 2200K-6500K - English Technical Document

Complete technical specification for G9 LED filament, 12x28x2.3mm package, AC230V, 2.8-3.4W, 300-500lm, Ra≥80, 360° viewing angle, multiple CCT bins.
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PDF Document Cover - G9 LED Filament Specification - Size 12x28x2.3mm - AC230V - Power 2.8-3.4W - Color Temperature 2200K-6500K - English Technical Document

1. Product Overview

1.1 General Description

The product is a white LED fabricated using a blue chip and phosphor conversion. Package dimensions: 12mm x 28mm x 2.3mm. It features an integrated package design and 360° full-angle luminescence, suitable for spot welding processes. Moisture sensitivity level: Level 5. RoHS compliant.

1.2 Key Features

1.3 Applications

Primary applications include LED halogen lamps (retrofit), decorative lighting, indoor illumination, and general lighting. The wide viewing angle and high CRI make it suitable for residential and commercial environments.

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics (Ts=25°C)

ParameterSymbolConditionMinTypMaxUnit
Forward VoltageVfAC230V225-235V
Luminous FluxΦAC230V300-500lm
Viewing Angle2θ1/2AC230V--360deg
Color Rendering IndexRaAC230V80--/
R9R9AC230V0--/
PowerPAC230V2.83.13.4W

The LED is designed to operate at 230V AC mains frequency (60Hz). The forward voltage range is 225-235V. Luminous flux varies from 300 to 500 lumens, depending on bin. The viewing angle is 360°, providing uniform light distribution. Color rendering index is at least 80, with R9 >= 0, ensuring good color reproduction for most applications. Power consumption is between 2.8W and 3.4W, making it energy-efficient.

2.2 Absolute Maximum Ratings

ParameterSymbolRatingUnit
Power DissipationPD3.73W
FrequencyHz60Hz
Electrostatic Discharge (HBM)ESD2000V
Operating TemperatureTOPR-40 ~ +85°C
Storage TemperatureTOPR-40 ~ +85°C
Junction TemperatureTJ125°C

These ratings must not be exceeded during operation. Power dissipation is limited to 3.73W. The LED is rated for 2000V ESD (HBM). Operating and storage temperature range from -40°C to +85°C, with maximum junction temperature of 125°C. Above the maximum ratings may cause permanent damage.

3. Binning System

3.1 Color Temperature Bins

The LED series is available in multiple color temperatures: 2200K, 2400K, 2700K, 3000K, 4000K, 5000K, 6500K. Each CCT has multiple lumen bins. For example, 2700K has bins Rank430 (430-460lm), Rank480 (450-510lm), etc. The CIE chromaticity coordinates are precisely defined for each bin. Refer to the CIE diagram and coordinate tables in the specification for detailed bin boundaries.

3.2 Luminous Flux Bins

Total luminous flux range is 300-500lm at AC230V. Within each CCT, bins are categorized by flux ranges (e.g., 430-460lm, 450-510lm, 460-520lm, 470-530lm). Customers can specify desired bin code for tighter performance consistency.

4. Performance Curves Analysis

The following typical curves illustrate the LED behavior under various conditions.

4.1 Forward Voltage vs. Relative Intensity

As forward voltage increases from 200V to 300V, relative intensity rises to a maximum and then saturates. The optimal operating region is around 225-235V.

4.2 Ambient Temperature vs. Relative Intensity

Relative luminous flux decreases with rising ambient temperature. At 100°C, the flux drops to about 70% of the value at 25°C. Thermal management is crucial for maintaining light output.

4.3 Central Surface Temperature vs. Relative Intensity

Similar trend: as the central surface temperature increases, relative intensity decreases. The LED should be kept below 85°C for optimal performance.

4.4 Forward Voltage vs. Temperature

Forward voltage shows a negative temperature coefficient: it decreases linearly with rising temperature. At 100°C, Vf is approximately 227V compared to 235V at 25°C.

4.5 Central Surface Temperature vs. Forward Current

The forward current (mA) decreases as temperature increases, indicating that the LED driver must compensate for thermal effects.

4.6 Radiation Diagram

The radiation pattern shows uniform emission in all horizontal directions, confirming the 360° viewing angle. Intensity variation is minimal.

4.7 Chromaticity Coordinate vs. Temperature

CIE x and y coordinates shift slightly with temperature, but remain within specified bin boundaries for the rated range (-40 to +85°C).

4.8 Spectrum Distribution

The spectrum consists of a blue peak around 450nm and a broad yellow phosphor emission centered at ~580nm, resulting in white light.

5. Mechanical and Packaging Information

5.1 Package Dimensions

Package size: 12mm (length) x 28mm (width) x 2.3mm (height). Tolerances ±0.5mm unless otherwise noted. The LED features two leads for electrical connection. A reversed drawing shows the correct polarity. ESD caution symbol is marked on the package.

5.2 Suction Box Dimensions

The suction box used for packaging has dimensions 750mm x 800mm (subject to tolerance ±0.1mm). Each box contains 50 pieces.

5.3 Label Specification

Labels include: Part Number (P/N), Spec Number (S/N), Lot Number (L/N), Bin Code, Chromaticity Bin (X/Y), Luminous Flux (Φ), Forward Voltage (Vf), Color Rendering Index (Ra), Quantity (QTY), and Date. Barcode may be included.

6. Soldering and Assembly Guidelines

6.1 Handling Precautions

6.2 Moisture Sensitivity and Storage

6.3 Cleaning

If cleaning is necessary, isopropyl alcohol is recommended. Do not use solvents that may dissolve the package. Ultrasonic cleaning is not recommended as it may damage the LED.

7. Packaging and Ordering Information

7.1 Packaging Quantity

Standard packaging: 50 pieces per box.

7.2 Reliability Test Items

Test ItemConditionDurationAc/Re
Thermal Shock-40°C/15min ↔ 100°C/15min1000 cycles0/1
Switching Test25°C, On/Off 2.5min2500 cycles0/1
Life Test (Room Temperature)Ta=25°C, AC230V1000 hrs0/1
High Temperature High Humidity Life Test60°C/90%RH, AC230V500 hrs0/1

7.3 Failure Criteria

After testing, the device is considered failed if power consumption exceeds ±10% of specification, or luminous flux drops below 70% of initial value.

8. Application Design Considerations

When designing with this G9 LED filament, consider the following: (1) Use a constant voltage AC driver with appropriate current limiting. (2) Ensure proper heatsinking; the junction temperature must not exceed 125°C. (3) For dimmable applications, select compatible dimmers designed for AC LEDs. (4) Account for inrush current. (5) The LED is non-spectroscopic product; over 90% of units in a batch meet the electrical/optical parameters. (6) Avoid mechanical stress on the filament.

9. Technical Advantages

Compared to traditional LED filament bulbs, this product offers an integrated package, 360° light distribution, simplified assembly (spot welding), and wide color temperature range. The high CRI (Ra≥80) and good R9 value ensure vivid color rendering. The moisture barrier bag and MSL 5 rating guarantee reliability during storage and soldering.

10. Frequently Asked Questions

Q: Why is the operating voltage AC230V? A: This LED is designed to work directly on mains AC, simplifying driver design. Q: How to ensure the 360° viewing angle? A: The filament-shaped package emits light from all sides. Q: What if the device is exposed to humidity? A: Follow the baking instructions to dry before use. Q: Can I use a DC driver? A: The specification is based on AC; using DC may affect performance. Q: What is the lifespan? A: The reliability tests show 1000 hours at room temperature; actual lifetime depends on thermal management and operating conditions.

11. Application Examples

Typical application: replacing G9 halogen bulbs in decorative chandeliers, wall sconces, and under-cabinet lighting. The 360° emission and small size make it ideal for retrofitting existing fixtures. Multiple units can be combined for higher lumen output.

12. Working Principle

The LED uses a blue InGaN chip that emits blue light (peak ~450nm). A yellow phosphor (often YAG:Ce) converts part of the blue light into broader yellow emission. The combination of blue and yellow produces white light. Different phosphor compositions achieve different correlated color temperatures (CCT) from warm white (2200K) to cool white (6500K).

13. Development Trends

Future trends for LED filaments include higher efficacy (over 200 lm/W), even higher CRI (Ra>95), better thermal performance, and reduced size. Integration with smart control (dimming, color tuning) is also expected. The G9 form factor will continue to evolve for better compatibility with existing fixtures.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.