1. Product Overview
This document details the specifications for a high-performance, warm white light-emitting diode (LED). The device is characterized by its compact package design and high luminous efficacy, making it suitable for space-constrained applications requiring quality illumination.
The core advantage of this LED lies in its combination of small form factor and high optical output. It delivers a typical luminous flux of 200 lumens when driven at a forward current of 1 Ampere, with an optical efficiency of 54.47 lumens per Watt. This balance makes it an efficient choice for various lighting solutions.
The target markets for this component are diverse, primarily focusing on applications where a compact, bright, and warm white light source is required. Its design parameters cater to both consumer electronics and specialized lighting fixtures.
2. Technical Parameter Deep Dive
2.1 Electro-Optical Characteristics
The primary electro-optical parameters are measured at a solder pad temperature (Ts) of 25°C. The key performance indicator is the Luminous Flux (Iv), with a minimum value of 180 lm and a typical value of 200 lm under a forward current (IF) of 1000mA. The forward voltage (VF) under this condition ranges from a minimum of 2.95V to a maximum of 3.95V, with the typical value depending on the specific voltage bin. The correlated color temperature (CCT) for this warm white LED falls within the range of 2000K to 2500K.
It is important to note the measurement tolerances: Luminous flux and illuminance measurements have a ±10% tolerance, while forward voltage measurement carries a ±0.1V tolerance. All electric and optical data is tested under a 50 ms pulse condition to minimize self-heating effects during measurement.
2.2 Absolute Maximum Ratings
To ensure reliable operation, the device must not be operated beyond its absolute maximum ratings. The DC forward current for continuous (torch mode) operation is rated at 350 mA. For pulsed operation, a peak pulse current of 1000 mA is allowed under a specific cycle: 400 ms on and 3600 ms off, for up to 30,000 cycles.
The device incorporates ESD protection, tested according to the JEDEC 3b standard (Human Body Model), and can withstand up to 8000V. The maximum allowable junction temperature (TJ) is 145°C, with an operating temperature range from -40°C to +85°C. The storage temperature range is slightly wider, from -40°C to +100°C. For assembly, the soldering temperature is rated at 260°C, and the device can withstand a maximum of 2 reflow cycles.
The thermal resistance from junction to solder point (Rth) is specified as 8.5 °C/W. The viewing angle (2θ1/2), defined as the off-axis angle where luminous intensity is half of the peak value, is 120 degrees with a tolerance of ±5°.
2.3 Thermal and Reliability Notes
Critical reliability notes are provided. The LED is not designed for reverse bias operation. Operation at the maximum junction temperature should not exceed one hour continuously. All specifications are assured by reliability testing for 1000 hours, with the criterion that the IV (current-voltage) characteristic degradation is less than 30%. These reliability tests are conducted under good thermal management using a 1.0 x 1.0 cm² Metal Core Printed Circuit Board (MCPCB).
The device is classified as Moisture Sensitivity Level (MSL) 1 according to JEDEC standards. This means it has an unlimited floor life at conditions ≤30°C and 85% relative humidity and requires a 168-hour bake at 85°C/85% RH if the protective packaging is opened.
3. Binning System Explanation
The LED is sorted into bins based on three key parameters: Forward Voltage (VF), Luminous Flux (Iv), and Chromaticity (color coordinates). This binning ensures consistency in electrical and optical performance for production batches.
3.1 Forward Voltage Binning
Forward voltage is categorized into three bins, identified by a four-digit code representing the voltage range in millivolts (e.g., 2932 represents 2.95V to 3.25V). The bins are: 2932 (2.95V - 3.25V), 3235 (3.25V - 3.55V), and 3539 (3.55V - 3.95V). All measurements are at IF=1000mA.
3.2 Luminous Flux Binning
Luminous flux is binned using alphanumeric codes (J5, J6, J7). The bin relevant to this specific part number is J5, which covers a luminous flux range from 180 lm to 200 lm at IF=1000mA. Other available bins include J6 (200-250 lm) and J7 (250-300 lm).
3.3 Chromaticity (Color) Binning
The chromaticity bin for this warm white LED is defined within the CIE 1931 color space. The bin code 2025 corresponds to specific color coordinate ranges that yield a Correlated Color Temperature between 2000K and 2500K. The reference color coordinates for this bin are provided, with a measurement allowance of ±0.01. Color bins are defined at an operating current of IF=1000mA.
4. Performance Curve Analysis
4.1 Spectral Distribution and Radiation Pattern
The typical relative spectral distribution curve shows the light output across wavelengths when driven at 1000mA. The peak wavelength (λp) is characteristic of the warm white phosphor-converted LED. The typical radiation pattern is Lambertian, meaning the luminous intensity is proportional to the cosine of the viewing angle, resulting in a wide, even distribution of light with the specified 120-degree viewing angle.
4.2 Forward Characteristics
The forward voltage versus forward current curve illustrates the non-linear relationship typical of semiconductor diodes. As current increases, the forward voltage increases. The relative luminous flux versus forward current curve shows how light output increases with current, though efficiency may drop at higher currents due to increased heat. The correlated color temperature (CCT) versus forward current curve indicates how the color temperature of the emitted light may shift slightly with different drive currents. All correlation data for these curves is tested under superior thermal management using a 1x1 cm² MCPCB.
5. Mechanical and Package Information
The device is provided in a surface-mount package. The package dimensions are detailed in an engineering drawing. Critical dimensions include the overall length, width, and height, as well as the pad layout and spacing. Tolerances for dimensions are typically ±0.1mm unless otherwise specified. The drawing includes polarity identification markings to ensure correct orientation during assembly.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
A reflow soldering characteristic profile is provided, detailing the recommended temperature ramp rates, peak temperature, and time above liquidus for the solder. Adherence to this profile is crucial to prevent thermal damage to the LED package and internal die.
6.2 Handling and Storage Precautions
Important handling notes are emphasized. Although the device has ESD protection, it is not designed for reverse bias operation. External current-limiting resistors should be used in the circuit to prevent over-current conditions, as a slight voltage shift could cause a large current shift leading to failure.
For storage, the MSL-1 classification means the devices can be stored in their original moisture-resistant packaging indefinitely under controlled conditions. Once the bag is opened, standard industry practices for moisture-sensitive devices should be followed if not used immediately.
7. Packaging and Ordering Information
The product is supplied in moisture-resistant packing. The minimum package quantity is 1000 pieces. For larger volumes, it is available on reels with a standard loaded quantity of 2000 pieces per reel. The product labeling on the reel includes critical information: Customer Product Number (CPN), internal Part Number (P/N), Lot Number, Packing Quantity (QTY), and the bin codes for Luminous Flux (CAT), Color (HUE), and Forward Voltage (REF). The Moisture Sensitivity Level (MSL-X) is also indicated.
Dimensions for the carrier tape and the emitter reel are provided in millimeters to facilitate automated pick-and-place assembly processes.
8. Application Suggestions
8.1 Typical Application Scenarios
Based on its specifications, this LED is well-suited for several applications: Mobile Phone Camera Flash, where high brightness in a small package is essential; Torch light for Digital Video applications; General indoor lighting; Signal and orientation lighting (e.g., exit signs, step lights); Backlighting for displays; Decorative and entertainment lighting; and both exterior and interior automotive illumination (contingent on meeting specific automotive qualifications).
8.2 Design Considerations
Designers must consider thermal management due to the device's 8.5 °C/W thermal resistance. Adequate heat sinking, typically via the PCB pads and traces connected to a thermal plane, is necessary to maintain junction temperature within limits, especially when driving at or near the maximum current. The forward voltage bin should be considered for driver design to ensure stable current regulation. The wide viewing angle makes it suitable for applications requiring broad illumination rather than a focused spot.
9. Compliance and Environmental Information
The device is compliant with several environmental regulations. It is RoHS compliant and lead-free. The product itself will remain within RoHS compliant versions. It also complies with the EU REACH regulation. Furthermore, it is Halogen Free, with limits set at: Bromine (Br) < 900 ppm, Chlorine (Cl) < 900 ppm, and the sum of Bromine and Chlorine < 1500 ppm.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the maximum continuous current I can drive this LED with?
A: The Absolute Maximum Rating for DC forward current in torch mode is 350 mA. For reliable long-term operation, it is advisable to drive it at or below this value with proper heat sinking.
Q: Can I use this LED with a pulsed current higher than 350mA?
A: Yes, for pulsed operation, a peak current of 1000 mA is allowed under a specific duty cycle: 400ms on / 3600ms off, for a maximum of 30,000 cycles. This is typical for camera flash applications.
Q: How do I interpret the bin codes in the part number (e.g., J5, 2932, 2025)?
A: The part number includes key bin information. \"J5\" refers to the luminous flux bin (180-200 lm). \"2932\" refers to the forward voltage bin (2.95-3.25V). \"2025\" refers to the chromaticity bin for warm white (2000-2500K CCT).
Q: Is a heatsink required?
A> Given the thermal resistance of 8.5°C/W, effective thermal management is crucial, especially at higher currents. This typically involves designing the PCB with adequate thermal vias and copper area connected to the LED's solder pads. For high-power or continuous operation, an external heatsink may be necessary.
11. Design and Usage Case Example
Scenario: Designing a compact portable work light.
A designer needs a bright, warm white light source for a battery-powered, handheld work light. The key requirements are high luminosity, good efficiency to extend battery life, and a wide beam angle. This LED is a strong candidate. The designer selects a drive current of 700mA to balance brightness and efficiency, which from the performance curves would provide high relative luminous flux while managing heat. A constant-current driver circuit is designed, accounting for the forward voltage bin (e.g., 3.1V typical for bin 2932). The PCB is designed with large thermal pads connected through multiple vias to a bottom-side copper plane to act as a heatsink, keeping the junction temperature well below the 145°C maximum during extended use. The 120-degree viewing angle provides a broad, useful work area illumination without the need for secondary optics.
12. Technical Principle Introduction
This LED is based on semiconductor technology. The core is a chip made of Indium Gallium Nitride (InGaN) materials. When a forward voltage is applied, electrons and holes recombine within the semiconductor structure, releasing energy in the form of photons (light). The primary emission from the InGaN chip is in the blue spectrum. To create warm white light, a phosphor coating is applied over the chip. This phosphor absorbs a portion of the blue light and re-emits it at longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-converted light results in the perceived warm white color with a correlated color temperature between 2000K and 2500K. The efficiency (lm/W) is a measure of how effectively electrical power is converted into visible light perceived by the human eye.
13. Industry Trends and Context
The development of LEDs like this one is part of a broader trend in solid-state lighting towards higher efficiency, greater reliability, and smaller form factors. The push for higher lumens per watt (efficacy) continues to be a primary driver, enabling energy savings and new application possibilities. The warm white color temperature range (2000-2500K) is increasingly popular for creating comfortable, inviting ambient lighting, mimicking traditional incandescent or halogen sources. Furthermore, integration of features like robust ESD protection and compliance with environmental regulations (RoHS, REACH, Halogen-Free) has become standard, reflecting the industry's focus on reliability and sustainability. The combination of high flux density in a small package, as seen in this device, enables miniaturization of lighting products and integration into ever-smaller electronic devices.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |