High Power White LED 3.0x3.0x0.55mm - Forward Voltage 5.8-7.2V - Power 2.16W - English Technical Datasheet

1. Product Overview

This high power white LED is fabricated using a blue chip combined with phosphor to produce white light. The device is housed in an EMC (Epoxy Molding Compound) package with outline dimensions of 3.0 mm × 3.0 mm × 0.55 mm, offering a compact and robust solution for demanding lighting applications. Key features include an extremely wide viewing angle of 120°, suitability for all SMT assembly and solder processes, and availability on tape and reel for automated pick-and-place. The LED is RoHS compliant and has a moisture sensitivity level of 3. Typical applications include backlighting for LCD, TV or monitor; switch and symbol illumination; optical indicators; indoor displays; tubular light applications; and general use. With a forward voltage range of 5.8 V to 7.2 V at 300 mA and a luminous flux of 140 lm to 220 lm, this LED delivers high brightness while maintaining reliable performance.

2. Technical Parameter Deep Analysis

2.1 Electrical / Optical Characteristics (at Ts=25°C)

The following table summarizes the key electrical and optical parameters measured at a solder temperature of 25°C and a forward current of 300 mA:

• Forward Voltage (VF): Minimum 5.8 V, Typical 6.0 V (from graph), Maximum 7.2 V.
• Reverse Current (IR): Maximum 10 µA at VR=10 V.
• Luminous Flux (Φ): Minimum 140 lm, Typical 180 lm, Maximum 220 lm.
• Viewing Angle (2θ1/2): Typical 120°.
• Thermal Resistance (RTHJ-S): Typical 12 °C/W.

Absolute maximum ratings: Power dissipation 2160 mW, forward current 300 mA, peak forward current 450 mA (1/10 duty cycle, 0.1 ms pulse width), reverse voltage 10 V, ESD (HBM) 2000 V, operating temperature -40°C to +85°C, storage temperature -40°C to +100°C, junction temperature 115°C.

2.2 Bin Range of Forward Voltage and Luminous Flux

At IF=300 mA, the forward voltage is binned into ranges from 5.8-6.0 V (bin TB) to 7.0-7.2 V (bin TN). Luminous flux is binned from 140-145 lm (bin T140) to 240-245 lm (bin T240). The exact bin code is a combination of voltage and flux bins, allowing customers to select devices with specific characteristics. The C.I.E. chromaticity diagram provides multiple color bins (D00, D01, ..., H00, H01, ..., K00, K01, ..., T00, T01, ...) to achieve consistent white color coordinates. Each bin has precise CIE-x and CIE-y corner coordinates as listed in Table 1-4, ensuring tight color control.

3. Performance Curve Analysis

3.1 Forward Voltage vs. Forward Current

The forward voltage increases with forward current. At 5.5 V the current is near zero; at 7 V the current reaches approximately 300 mA. This relationship is typical for high-power LEDs and demonstrates the need for current regulation rather than voltage drive.

3.2 Forward Current vs. Relative Intensity

The relative intensity increases linearly with forward current from 0 to 300 mA, reaching about 100% at 300 mA. This indicates good efficiency and predictable output.

3.3 Solder Temperature vs. Relative Intensity

As solder temperature rises from 25°C to 115°C, the relative intensity decreases slightly to about 85%. Designers must account for thermal derating to maintain light output.

3.4 Solder Temperature vs. Forward Current

The maximum allowable forward current decreases with increasing solder temperature to prevent overheating. At Ts=25°C the max current is 300 mA; at 85°C it drops to about 200 mA. This derating is critical for reliable operation.

3.5 Forward Voltage vs. Solder Temperature

Forward voltage decreases slightly as temperature rises (approximately -2 mV/°C). From 20°C to 120°C, VF drops from about 6.20 V to 6.02 V.

3.6 Radiation Diagram

The LED has a wide viewing angle of 120°. The relative luminous intensity remains above 50% from -60° to +60° and drops to near zero at ±90°. This makes the device ideal for applications requiring broad illumination.

3.7 Chromaticity Coordinate vs. Solder Temperature

The CIE x and y coordinates shift slightly with temperature. As temperature increases from 25°C to 85°C, the white point moves slightly towards higher x and y values (warmer color). This shift should be considered in color-critical designs.

3.8 Spectrum Distribution

The relative emission intensity peaks near 450 nm (blue) and 560 nm (phosphor yellow-green), with a broad spectrum covering 400-700 nm. The white light is created by the combination of blue chip emission and yellow phosphor.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The package measures 3.00 mm × 3.00 mm with a height of approximately 0.55 mm. The top view shows two contact pads (anode and cathode) with dimensions 1.45 mm × 0.46 mm each. The bottom view shows the same pads with additional markings. Polarity is indicated by a notch or marking on the package (see Fig. 1-4). The soldering patterns recommend using pads of 2.26 mm × 0.69 mm with a 0.46 mm gap between them for optimal solder joint formation. All dimensions have tolerances of ±0.2 mm unless otherwise noted.

4.2 Carrier Tape and Reel

The LEDs are packaged in carrier tape with pitch P1=4.0 mm and P2=2.0 mm. The tape width is 8.0 mm with pockets of size A0=3.2±0.1 mm, B0=3.3±0.1 mm, and K0=1.4±0.1 mm. The reel has an outer diameter of 178 mm, inner hub diameter of 59 mm, and width of 16.9 mm. Each reel contains 5000 pieces.

4.3 Labeling and Moisture Barrier

The label includes part number, spec number, lot number, bin codes for flux (Ф), chromaticity (XY), forward voltage (VF), wavelength (WLD), quantity (QTY), and date (DATE). The package is sealed in a moisture barrier bag with desiccant, and an ESD warning label is attached.

5. Soldering and Assembly Guidelines

5.1 Reflow Soldering Profile

A typical reflow soldering profile is recommended: preheat from 150°C to 200°C for 60-120 seconds, ramp up at max 3°C/s to peak temperature of 260°C (max 10 seconds above 255°C), and cool down at max 6°C/s. The total time from 25°C to peak should not exceed 8 minutes. Reflow soldering should not be performed more than twice.

5.2 Hand Soldering and Repair

Hand soldering should be done at iron temperature below 300°C for less than 3 seconds, and only one time. Repair is not recommended; if unavoidable, use a double-head soldering iron and pre-confirm LED integrity.

5.3 Cautions

The silicone encapsulation is soft; avoid excessive pressure on the top surface. Do not mount LEDs on warped PCB areas. After soldering, do not apply mechanical stress or rapid cooling.

6. Packaging and Ordering Information

Standard packaging is 5000 pcs per reel. The cardboard box dimensions and packaging process are shown in the product specification. The label format includes all necessary traceability codes. The product is shipped in a moisture-resistant packaging process with a sealed moisture barrier bag and ESD protection.

7. Application Recommendations

Typical applications include LCD backlighting, indoor displays, tubular lights, and general illumination. For optimal performance, use a constant current driver to maintain forward current at 300 mA. Consider thermal management by attaching the LED to a metal-core PCB (MCPCB) with good heat sinking. The junction temperature must not exceed 115°C. In circuit design, include series resistors to balance current in parallel strings. Avoid exposing the LED to high sulfur environments (>100 ppm) or halogen compounds (>900 ppm each for Br and Cl). Use isopropyl alcohol for cleaning if needed; ultrasonic cleaning is not recommended.

8. Technical Comparison

Compared to standard 2835 or 3030 white LEDs, this device offers higher forward voltage (5.8-7.2V vs. typical 3V) indicating multiple chips in series, enabling higher power density. The 120° viewing angle is wider than many high-power LEDs (often 110°). The EMC package provides better moisture resistance and high-temperature stability than traditional PPA packages. The luminous efficacy of ~60-80 lm/W at 300mA is competitive for high-power white LEDs. The tight binning in chromaticity (multiple D, H, K, T bins) ensures color consistency across production lots.

9. Frequently Asked Questions

Q: What is the recommended forward current? A: The absolute maximum rating is 300 mA DC; for best efficacy and lifetime, operate at 280-300 mA with proper heat sinking.

Q: Can this LED be driven at higher current? A: Peak current up to 450 mA at 1/10 duty cycle, 0.1ms pulse width, but average current must not exceed 300 mA.

Q: How does temperature affect color? A: Chromaticity shifts slightly (x,y increase) as temperature rises; for color-critical applications, consider active cooling or feedback.

Q: What is the storage condition? A: Before opening moisture barrier bag, store at <30°C / <75% RH for up to 1 year. After opening, use within 24 hours at <30°C / <60% RH. If exceeded, bake at 65±5°C for 24 hours.

Q: What cleaning solvents are safe? A: Isopropyl alcohol is recommended; avoid solvents that may dissolve the silicone or package.

10. Practical Application Cases

In a backlight unit for a 10-inch LCD panel, using 12 of these LEDs in series with a constant current driver at 300 mA provides approximately 2000 lm total flux, sufficient for a bright display. The wide viewing angle ensures uniform illumination across the panel. In a tubular retrofit lamp, 24 LEDs on a linear PCB with appropriate heat sink can replace a 20W fluorescent tube, delivering 3500+ lumens with better energy efficiency and longer life. For indoor signage, arrays with proper spacing and lens optics achieve high brightness with minimal shadow.

11. Principle of Operation

This white LED uses a blue InGaN (Indium Gallium Nitride) chip emitting at ~450 nm. The chip is covered with a phosphor layer (typically YAG:Ce or similar) that absorbs blue light and re-emits in a broad yellow-green spectrum. The combination of transmitted blue light and phosphor-converted yellow light produces white light. The CIE coordinates can be tuned by adjusting phosphor composition and concentration. The LED is encapsulated in silicone to protect the chip and phosphor and to provide optical coupling.

12. Development Trends

The trend in high-power white LEDs is toward higher luminous efficacy (>150 lm/W at chip level), improved color rendering (CRI>90), and smaller packages for compact designs. EMC packages are replacing PPA due to better thermal stability and reliability. New phosphor technologies, such as nitride and fluoride phosphors, enable wider color gamut and higher CRI. Integration of multiple chips in series (as seen in this 6V class device) allows higher-voltage drive to reduce current and I²R losses. Future developments include chip-scale packaging (CSP) and flip-chip designs for better thermal path and lower cost.