T5C Series 5050 White LED Datasheet - Size 5.0x5.0x1.9mm - Voltage 25.6V - Power 5.12W - English Technical Documentation

1. Product Overview

The T5C series represents a high-performance, top-view white LED encapsulated in a compact 5050 (5.0mm x 5.0mm) package. This device is engineered for general and architectural lighting applications, offering a balance of high luminous output and robust thermal performance. Its design is optimized for reliability and efficiency in demanding lighting environments.

1.1 Core Advantages

• Thermally Enhanced Package: The package design prioritizes efficient heat dissipation, which is critical for maintaining performance and longevity at high drive currents.
• High Luminous Flux Output: Delivers high brightness levels, making it suitable for applications requiring significant illumination.
• High Current Capability: Rated for continuous operation at 200mA, with a maximum forward current of 240mA, supporting high-power applications.
• Wide Viewing Angle: Features a typical viewing angle (2θ1/2) of 120 degrees, providing broad and uniform light distribution.
• Environmental Compliance: The product is designed for Pb-free reflow soldering processes and adheres to RoHS compliance standards.

1.2 Target Applications

This LED is versatile and finds use in various lighting scenarios, including interior lighting, retrofit lamps for replacing traditional light sources, general illumination fixtures, and architectural or decorative lighting where both performance and form factor are important.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Electro-Optical Characteristics

The primary performance metrics are measured at a junction temperature (Tj) of 25°C and a forward current (IF) of 200mA, which is the recommended operating point.

• Forward Voltage (VF): The typical forward voltage is 25.6V, with a minimum of 24V and a maximum of 27V (tolerance ±3%). This relatively high voltage indicates the LED likely contains multiple semiconductor chips connected in series within the package.
• Luminous Flux: Output varies significantly with Correlated Color Temperature (CCT) and Color Rendering Index (CRI). For example, a 4000K LED with CRI 70 (Ra70) has a typical flux of 775 lumens (min 700 lm), while a 2700K LED with CRI 90 (Ra90) has a typical flux of 580 lumens (min 500 lm). Higher CRI generally correlates with a reduction in luminous efficacy.
• Viewing Angle: The 120-degree viewing angle is characteristic of a Lambertian or near-Lambertian emission pattern, ideal for area lighting rather than focused beams.

2.2 Absolute Maximum Ratings and Electrical Parameters

These ratings define the operational limits beyond which permanent damage may occur.

• Current Limits: Maximum continuous forward current (IF) is 240mA. A pulsed forward current (IFP) of 360mA is allowed under strict conditions (pulse width ≤100μs, duty cycle ≤1/10). Exceeding these limits risks catastrophic failure.
• Power Dissipation (PD): The absolute maximum is 6480 mW. Careful thermal design is essential to ensure the actual operating power (VF * IF) remains below this value, considering derating at elevated temperatures.
• Thermal Resistance (Rth j-sp): The typical thermal resistance from the junction to the solder point is 2.5 °C/W. This low value is crucial for the thermally enhanced design, allowing heat to be efficiently transferred from the LED die to the printed circuit board (PCB).
• Electrostatic Discharge (ESD): Rated at 1000V Human Body Model (HBM), which is a standard level of protection for optoelectronic components. Proper ESD handling procedures should still be followed during assembly.

2.3 Thermal Characteristics

Thermal management is paramount for LED performance and lifetime.

• Junction Temperature (Tj): The maximum allowable junction temperature is 120°C. Operating at or near this limit will accelerate lumen depreciation and reduce operational life.
• Operating & Storage Temperature: The device can operate in ambient temperatures from -40°C to +105°C and be stored from -40°C to +85°C.
• Soldering Temperature: Compatible with standard reflow profiles, with a peak soldering temperature of 230°C or 260°C for a maximum of 10 seconds.

3. Binning System Explanation

The product is sorted into bins based on key performance parameters to ensure consistency in application.

3.1 Luminous Flux Binning

Flux bins are defined for each combination of CCT and CRI. The bin code (e.g., GN, GP, GQ) specifies a minimum and maximum luminous flux range at 200mA. For instance, for 4000K/5000K/5700K/6500K LEDs with CRI 70, bins GQ (700-750 lm), GR (750-800 lm), and GS (800-850 lm) are available. This allows designers to select LEDs with predictable brightness for their specific needs.

3.2 Forward Voltage Binning

LEDs are also binned by forward voltage into two categories: Code 6E (24-26V) and Code 6F (26-28V). Matching LEDs from the same voltage bin can simplify driver design and improve current balance in multi-LED arrays.

3.3 Chromaticity Binning (Color Consistency)

The chromaticity coordinates (x, y) are controlled within a 5-step MacAdam ellipse for each CCT bin (e.g., 27R5 for 2700K, 40R5 for 4000K). A 5-step ellipse is a common industry standard for ensuring acceptable color uniformity to the human eye in most general lighting applications. The datasheet provides the center coordinates and ellipse parameters for both 25°C and 85°C junction temperatures, acknowledging the color shift that occurs with heating.

4. Performance Curve Analysis

The provided graphs offer insights into the LED's behavior under varying conditions.

4.1 Current vs. Intensity/Voltage (IV Curves)

Figure 3 (Forward Current vs. Relative Intensity) typically shows a sub-linear relationship, where efficiency (lumens per watt) may decrease at very high currents due to increased heat. Figure 4 (Forward Current vs. Forward Voltage) shows the diode's exponential IV characteristic, with voltage increasing with current.

4.2 Temperature Dependence

Figure 5 (Ambient Temperature vs. Relative Luminous Flux) is critical: it shows lumen output decreasing as temperature rises. Effective heatsinking is necessary to minimize this drop. Figure 6 (Ambient Temperature vs. Relative Forward Voltage) typically shows a negative temperature coefficient, where VF decreases slightly with increasing temperature. Figure 8 (Ta vs. CIE x, y Shift) visually represents the chromaticity coordinate drift with temperature, which is quantified in the chromaticity binning table.

4.3 Spectral Distribution and Viewing Angle

Figures 1a, 1b, and 1c show the spectral power distribution for CRI 70, 80, and 90, respectively. Higher CRI spectra have a more filled-in valley between the blue pump peak and the broader phosphor emission, leading to better color rendering. Figure 2 illustrates the spatial intensity distribution, confirming the wide 120-degree viewing angle.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a footprint of 5.0mm x 5.0mm with a typical height of 1.9mm. The dimensional drawing specifies tolerances of ±0.1mm unless otherwise noted. The bottom view clearly shows the solder pad layout.

5.2 Solder Pad Design and Polarity

The soldering pattern is designed for stable mechanical attachment and optimal thermal conduction. The cathode and anode are clearly marked in the diagram. The cathode is typically indicated by a distinctive feature such as a notch, a green marking, or a different pad shape. Correct polarity must be observed during assembly to prevent damage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The LED is compatible with standard infrared or convection reflow processes using Pb-free solder (SAC alloys). The maximum peak temperature should not exceed 230°C or 260°C, and the time above liquidus should be controlled according to the solder paste manufacturer's specifications, with the absolute limit at peak temperature being 10 seconds. A controlled ramp-up and cool-down rate is recommended to minimize thermal stress.

6.2 Handling and Storage Precautions

Due to its ESD sensitivity (1000V HBM), personnel and workstations should be properly grounded. The LEDs should be stored in their original moisture-barrier bags in a controlled environment (temperature < 30°C, relative humidity < 60% recommended) to prevent moisture absorption, which can cause \"popcorning\" during reflow.

7. Model Numbering Rule

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include: X1 (Type code, e.g., '5C' for 5050), X2 (CCT code, e.g., '40' for 4000K), X3 (CRI code, e.g., '8' for Ra80), X4/X5 (Number of serial/parallel chips, represented as 1-Z), X6 (Component code), and X7 (Color Code, e.g., 'R' for 85°C ANSI binning). This system allows for precise identification of the LED's electrical and optical characteristics.

8. Application Recommendations

8.1 Design Considerations

• Thermal Management: The low thermal resistance (2.5°C/W) is only effective if the LED is mounted on a suitable Metal Core PCB (MCPCB) or other heatsinking substrate. The system thermal design must keep the junction temperature well below the 120°C maximum for reliable operation.
• Driver Selection: Given the high typical VF of ~25.6V, a constant-current driver rated for this voltage range is required. The driver should be chosen based on the desired current (e.g., 200mA) and the number of LEDs connected in series/parallel.
• Optical Design: The wide 120-degree beam angle may require secondary optics (lenses, reflectors) if a more directed beam is needed for spot or downlight applications.

8.2 Typical Application Circuits

For reliable operation, LEDs should be driven by a constant current source. When connecting multiple LEDs, a series configuration is preferred for current matching, but the total forward voltage of the string must be within the driver's compliance voltage. Parallel connection of LEDs without individual current balancing is generally not recommended due to Vf variations causing uneven current sharing.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the actual power consumption of this LED?
A: At the typical operating point of 200mA and 25.6V, the electrical power input is approximately 5.12 Watts (P = V * I).

Q: How does color temperature (CCT) affect light output?
A: As shown in the electro-optical table, for the same CRI, higher CCTs (e.g., 6500K) generally have slightly higher typical luminous flux compared to lower CCTs (e.g., 2700K).

Q: What does \"5-step MacAdam ellipse\" mean for my application?
A: It means that LEDs from the same color bin will have chromaticity coordinates so close that the color difference is imperceptible or minimal to most observers under typical lighting conditions, ensuring good color consistency in a fixture.

Q: Can I drive this LED at its maximum current of 240mA continuously?
A: While possible, it will generate more heat (approximately 6.14W assuming 25.6V) and likely reduce luminous efficacy and lifetime. Operating at the recommended 200mA provides a better balance of performance and reliability.

10. Operational Principle

White LEDs of this type typically use a blue light-emitting indium gallium nitride (InGaN) semiconductor chip. Part of the blue light is converted to longer wavelengths (yellow, red) by a phosphor layer deposited on or around the chip. The combination of the remaining blue light and the phosphor-converted light results in the perception of white light. The specific blend of phosphors determines the Correlated Color Temperature (CCT) and Color Rendering Index (CRI) of the emitted light.

11. Industry Trends

The market for high-power LEDs continues to evolve towards higher efficacy (more lumens per watt), improved color quality (higher CRI with less efficacy trade-off), and greater reliability. There is also a trend toward standardized form factors and electrical interfaces to simplify design and manufacturing. Thermally efficient packages, like the one used in this series, remain essential as power densities increase. Furthermore, there is growing emphasis on precise binning and tighter color tolerances to meet the demands of high-quality architectural and commercial lighting.