Infrared LED PLCC4 3.5x2.8x1.85mm - 1.5V Forward Voltage - 100mA - 940nm Wavelength - 190mW Power Dissipation - Technical Specifications

1. Product Overview

1.1 General Description

The infrared LED is fabricated using AlGaAs epitaxial technology on a substrate, producing high-efficiency emission in the near-infrared spectrum. The device is housed in a PLCC4 package with dimensions of 3.5mm x 2.8mm x 1.85mm, making it suitable for compact designs and surface-mount assembly. The LED emits at a typical peak wavelength of 940nm, which is ideal for applications such as remote control, night vision, and automotive lighting.

1.2 Features

• PLCC4 package for SMT compatibility
• Extremely wide viewing angle of 120°
• Suitable for all SMT assembly and soldering processes
• Available on tape and reel for automated placement
• Moisture sensitivity level: Level 3
• Compliant with RoHS and REACH directives
• Qualified according to AEC-Q102 stress test for automotive-grade discrete semiconductors

1.3 Applications

• Automotive interior and exterior lighting (e.g., ambient lighting, sensor illumination)
• Infrared remote control systems
• Optical sensors and encoders
• Night vision equipment

2. Technical Specifications

2.1 Electrical and Optical Characteristics (at Ts=25°C, IF=100mA)

2.2 Absolute Maximum Ratings (at Ts=25°C)

2.3 Bin Range for VF, Ie, and Dominant Wavelength (IF=100mA)

The LEDs are sorted into bins for forward voltage, radiant intensity, and wavelength to ensure consistency. The available bins are as follows:

3. Performance Curves

3.1 Forward Voltage vs. Forward Current (Fig. 1-7)

The typical VF-IF curve shows a nonlinear relationship: at low currents (10mA) the voltage is about 1.2V, rising to approximately 1.5V at 100mA and 1.7V at 200mA. This exponential behavior is characteristic of infrared LEDs and must be considered when designing constant-current drivers.

3.2 Relative Intensity vs. Forward Current (Fig. 1-8)

Radiant output increases nearly linearly with forward current up to 100mA. At 100mA the relative intensity is normalized to 100%; at 50mA it is about 60%. Operating beyond 100mA (pulsed mode only) yields higher peak outputs but must be limited by duty cycle.

3.3 Solder Temperature vs. Relative Intensity (Fig. 1-9)

As the solder point temperature rises, the LED's efficiency decreases. At 100°C the relative intensity drops to approximately 70% of the value at 25°C. Adequate thermal management is essential to maintain optical performance.

3.4 Solder Temperature vs. Maximum Forward Current (Fig. 1-10)

To keep the junction temperature below 120°C, the maximum allowable forward current must be derated with increasing ambient temperature. At 25°C the full 100mA can be applied; at 100°C the allowable current reduces to about 20mA.

3.5 Forward Voltage vs. Solder Temperature (Fig. 1-11)

Forward voltage decreases linearly with temperature at a rate of approximately -2.5 mV/°C. This negative temperature coefficient must be accounted for when designing current regulation loops.

3.6 Radiation Pattern (Fig. 1-12)

The LED exhibits a Lambertian-like emission pattern with a 50% power angle of ±60°, corresponding to a total viewing angle of 120°. The radiation is symmetrical and spreads uniformly over a wide angle, making it suitable for applications requiring broad coverage.

3.7 Forward Current vs. Dominant Wavelength (Fig. 1-13)

The dominant wavelength shifts slightly with current: from 940nm at 65mA to 946nm at 105mA. This red shift of about 0.2 nm/mA is typical for infrared emitters and may need compensation in wavelength-sensitive applications.

3.8 Spectral Distribution (Fig. 1-14)

The emission spectrum peaks at 940nm with a full-width at half-maximum (FWHM) of approximately 40nm. The spectrum is clean without secondary peaks, ensuring high spectral purity for filtering and detection.

4. Mechanical Information

4.1 Package Dimensions (Fig. 1-1 to 1-4)

The LED package is a PLCC4 with overall dimensions of 3.5mm x 2.8mm x 1.85mm. The top view shows four terminals: cathode (pin 1) marked with a polarity notch, anode (pin 2), and two additional terminals (pins 3 and 4) which are electrically connected to the heat sink for improved thermal dissipation. The bottom view indicates a heat pad of 2.6mm x 1.6mm. The soldering patterns recommended have a central pad of 4.6mm x 2.6mm with pin pads of 0.8mm x 0.7mm.

4.2 Soldering Patterns (Fig. 1-5)

Proper PCB layout is critical for thermal and electrical performance. The recommended land pattern includes a large thermal pad under the package to conduct heat away. All dimensions are in millimeters with tolerances of ±0.2mm unless otherwise noted.

5. Packaging Information

5.1 Tape and Reel Dimensions (Fig. 2-1, 2-2)

The LEDs are packaged in tape and reel with a quantity of 2000 pieces per reel. The carrier tape has pocket pitch of 4.0mm, width of 12.0mm, and component depth optimized for the PLCC4 package. The reel has a diameter of 330mm, hub diameter of 60mm, and width of 12.6mm.

5.2 Label Information (Table 2-2)

Each reel is labeled with part number, spec number, lot number, bin code for flux, chromaticity bin, forward voltage bin, wavelength bin, quantity, and date code. The bin codes correspond to the sorted ranges described in Section 2.3.

5.3 Moisture Resistant Packing

The LEDs are shipped in a moisture barrier bag with desiccant and a humidity indicator card. The moisture sensitivity level (MSL) is Level 3, meaning the floor life is 168 hours after opening the bag under conditions of ≤30°C/60%RH. If the floor life is exceeded or the bag is damaged, baking at 60±5°C for >24 hours is required before use.

6. Reliability Testing

6.1 Reliability Test Items (Table 2-3)

6.2 Failure Criteria

After reliability testing, the LED is considered failed if any of the following limits are exceeded: forward voltage > 1.1 × upper spec limit (USL), reverse current > 2.0 × USL, or radiant intensity < 0.7 × lower spec limit (LSL).

7. Soldering Guidelines

7.1 SMT Reflow Soldering Profile

Reflow soldering must follow the recommended temperature profile: preheat from 150°C to 200°C over 60-120 seconds, ramp-up rate ≤3°C/s, time above 217°C (liquidus) up to 60 seconds, peak temperature 260°C with time within 5°C of peak not to exceed 30 seconds (maximum 10 seconds at actual peak), and cool-down rate ≤6°C/s. Total time from 25°C to peak should be less than 8 minutes. Do not reflow more than twice. If more than 24 hours elapse between reflows, baking is required.

7.2 Hand Soldering

Hand soldering is permitted only once with iron temperature below 300°C and contact time under 3 seconds. Avoid applying pressure to the silicone lens during soldering.

7.3 Repairing

Repairing is not recommended. If unavoidable, use a dual-head soldering iron and carefully evaluate that the LED characteristics are not degraded.

8. Handling Precautions

8.1 Storage Conditions

Before opening the moisture barrier bag: store at ≤30°C and ≤75% RH, shelf life 1 year. After opening: use within 24 hours at ≤30°C and ≤60% RH. If not used within that time, bake at 60±5°C for >24 hours.

8.2 Environmental Considerations

Avoid exposure to sulfur-containing compounds above 100 ppm in the LED's surroundings. Also avoid high levels of bromine and chlorine (each below 900 ppm, total below 1500 ppm) to prevent corrosion. Use materials that do not outgas volatile organic compounds (VOCs) that can discolor the silicone encapsulation.

8.3 Mechanical Handling

Do not apply pressure directly on the silicone lens; handle the package by the sides. Use proper pick-and-place nozzles with controlled force. Do not mount LEDs on warped PCBs or bend the board after soldering.

8.4 Electrostatic Discharge (ESD) Protection

The LED is sensitive to ESD. Use grounded workstation, wrist straps, and ionizers. The HBM threshold is 2000V; however, more than 90% of devices pass at this level, so careful handling is still required.

8.5 Thermal Design

Junction temperature must not exceed 120°C. Thermal resistance to solder point is 130°C/W. Design the PCB with adequate copper area and heat sinking to keep the solder point temperature low. Consider derating current if ambient temperature is high.

9. Application Considerations

9.1 Automotive Lighting

With AEC-Q102 qualification, this LED is suitable for automotive interior and exterior lighting applications. The wide viewing angle makes it ideal for ambient lighting and indicator functions. Ensure compliance with automotive EMC and thermal requirements.

9.2 Design Tips

• Use a constant-current driver to avoid forward voltage variations causing current imbalance in parallel strings.
• Include a series resistor per string to prevent thermal runaway.
• Provide adequate thermal vias under the thermal pad.
• For pulsed operation (e.g., communication), respect the maximum peak current (700mA) and duty cycle (1/10).
• Filter or shield the IR output to avoid interference with other IR-sensitive devices.

10. Compliance

This product is designed to comply with RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) regulations. It also meets the reliability requirements of AEC-Q102 for automotive-grade stress tests. The MSL classification is Level 3 per JEDEC J-STD-020. The device is halogen-free and antimony-free.