Infrared LED RE30A0-IPX-FR Specification - 3.0x3.0x2.53mm - 1.5V - 0.85W - 950nm - English Technical Document

1. Product Overview

This document details the specifications for a high-power infrared (IR) light-emitting diode (LED) designed for demanding applications requiring reliable, invisible illumination. The device utilizes an Epoxy Molding Compound (EMC) package, which offers enhanced thermal performance and long-term reliability compared to traditional plastic packages. Its primary emission is in the 950nm wavelength range, making it ideal for use with CCD and CMOS image sensors that are sensitive in the near-infrared spectrum.

The core advantage of this product lies in its combination of a robust EMC package, a peak wavelength optimized for common camera sensors, and a design focused on surface-mount technology (SMT) assembly. It is engineered for applications where consistent performance, resistance to environmental factors, and efficient heat dissipation are critical.

The target market for this LED is primarily the security and surveillance industry, where it is used in night vision cameras and infrared illuminators. It is also well-suited for machine vision systems, industrial automation, and other sensing applications that require controlled infrared lighting.

2. In-Depth Technical Parameter Analysis

2.1 Electrical & Optical Characteristics

The device's performance is characterized under standard test conditions (Ts=25\u00b0C). Key parameters define its operational envelope and expected output.

• Forward Voltage (V_F): At the typical drive current of 500mA, the forward voltage is 1.5V (min: 1.4V). This relatively low voltage contributes to higher system efficiency by reducing power loss across the LED itself.
• Peak Wavelength (\u03bb_p): The dominant wavelength of emission is 950nm (min: 942nm). This wavelength is invisible to the human eye but falls within the high-sensitivity range of silicon-based image sensors, providing effective illumination without causing a visible red glow ("red leak").
• Total Radiant Flux (\u03a6_e): The total optical power output is 224mW (min: 140mW) when driven at 500mA. This parameter is crucial for determining the illumination intensity and coverage area of the IR source.
• Viewing Angle (2\u03b8_1/2): The half-intensity angle is 120 degrees, providing a wide field of illumination suitable for general area coverage in surveillance applications.
• Thermal Resistance (R_THJ-S): The junction-to-solder point thermal resistance is 14\u00b0C/W. This value is critical for thermal management design, as it determines how much the junction temperature will rise for a given amount of dissipated power.
• Reverse Current (I_R): With a reverse voltage of 5V applied, the leakage current is a maximum of 10\u00b5A.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation outside these limits is not guaranteed.

• Power Dissipation (P_D): 0.85W. The total electrical power converted to heat and light must not exceed this value.
• Forward Current (I_F): 500mA (DC).
• Reverse Voltage (V_R): 5V.
• Electrostatic Discharge (ESD): 2000V (Human Body Model). Proper ESD handling procedures are mandatory.
• Operating Temperature (T_OPR): -40\u00b0C to +85\u00b0C.
• Storage Temperature (T_STG): -40\u00b0C to +100\u00b0C.
• Junction Temperature (T_J): 95\u00b0C (maximum). This is the most critical temperature limit for LED longevity.

3. Binning System Explanation

The product employs a binning system for key parameters to ensure consistency within a production lot and allow for precise selection based on application needs. The primary binned parameters are Forward Voltage (V_F) and Total Radiant Flux (\u03a6_e), both measured at I_F = 500mA.

This binning allows designers to select LEDs with tightly grouped electrical and optical characteristics, which is essential for applications requiring uniform illumination or specific drive circuit parameters. The provided specification lists typical values; for specific bin codes and their ranges, consult the manufacturer's detailed binning documentation.

4. Performance Curve Analysis

The characteristic curves provide insight into the device's behavior under varying conditions.

• Forward Voltage vs. Forward Current (IV Curve): This curve shows the non-linear relationship between voltage and current. It is essential for designing the current drive circuit (e.g., constant current driver) to ensure stable operation.
• Forward Current vs. Relative Intensity: This curve demonstrates the optical output's dependence on drive current. It typically shows a sub-linear relationship at very high currents due to efficiency droop and thermal effects.
• Case Temperature vs. Relative Intensity: This graph illustrates the thermal quenching effect. As the LED's case temperature increases, its optical output generally decreases. Proper heat sinking is vital to maintain consistent light output.
• Spectral Distribution: The spectrum plot confirms the peak emission at 950nm and shows the spectral bandwidth (typically 40nm FWHM). A narrower spectrum can be beneficial for applications requiring specific wavelength filtering.

5. Mechanical & Package Information

5.1 Package Dimensions

The device is housed in a surface-mount package with dimensions of 3.00mm (Length) x 3.00mm (Width) x 2.53mm (Height). The package footprint and solder pad layout are designed for standard SMT assembly processes. All dimensional tolerances are \u00b10.2mm unless otherwise specified.

5.2 Polarity Identification & Pad Design

Clear polarity marking is provided on the top of the package to prevent incorrect placement during assembly. The recommended solder pad pattern (land pattern) is provided to ensure reliable solder joint formation and proper thermal connection to the printed circuit board (PCB). Adherence to this recommended footprint is crucial for mechanical stability and optimal heat transfer from the LED junction to the PCB.

6. Soldering & Assembly Guidelines

6.1 SMT Reflow Soldering

The product is compatible with lead-free (Pb-free) reflow soldering processes. It is classified as Moisture Sensitivity Level (MSL) 3. This means the device can be exposed to factory floor conditions for up to 168 hours (7 days) prior to reflow soldering without requiring baking. If the exposure time is exceeded, the devices must be baked according to the standard IPC/JEDEC J-STD-033 guidelines to remove absorbed moisture and prevent "popcorning" (package cracking) during the high-temperature reflow process.

Specific reflow profile parameters (preheat, soak, reflow peak temperature, time above liquidus) should be developed based on the solder paste used and overall board assembly requirements, ensuring the peak package body temperature does not exceed the maximum ratings.

6.2 Handling & Storage Precautions

• Always follow ESD (Electrostatic Discharge) safe handling procedures. Use grounded workstations and wrist straps.
• Store in a dry, controlled environment within the specified storage temperature range.
• Adhere to the MSL 3 handling requirements to avoid moisture-induced damage during reflow.
• Avoid mechanical stress on the lens or package body.
• During operation, ensure the maximum junction temperature (T_J) is not exceeded by implementing adequate thermal management, such as using a PCB with thermal vias or an external heatsink.

7. Packaging & Ordering Information

The LEDs are supplied in industry-standard packaging for automated assembly.

• Carrier Tape: Devices are placed in embossed carrier tape for protection and handling by pick-and-place machines. The tape dimensions (pocket size, pitch) are specified.
• Reel: The carrier tape is wound onto a reel. Reel dimensions (diameter, width, hub size) are provided.
• Moisture Barrier Bag: The reels are packaged in moisture-resistant barrier bags with a humidity indicator card to protect the MSL 3 devices during storage and shipment.
• Labeling: The reel and box include labels with product identification, quantity, lot number, and other traceability information as per the specified label form.

The part number "RE30A0-IPX-FR" follows the manufacturer's internal naming convention, typically encoding information about the package type, chip technology, wavelength, and performance bin.

8. Application Recommendations

8.1 Typical Application Scenarios

• Surveillance Camera IR Illuminators: Providing invisible night-time illumination for security cameras. The 950nm wavelength is ideal as it is beyond human vision but within camera sensitivity.
• Machine Vision Lighting: Used for inspection, sorting, or guidance systems where controlled IR lighting can enhance contrast or eliminate ambient visible light interference.
• Industrial Sensors: Proximity sensing, object detection, and optical encoders.

8.2 Design Considerations

• Thermal Management: This is paramount. With a power dissipation up to 0.85W and a thermal resistance of 14\u00b0C/W, the temperature rise can be significant. Use a PCB with a sufficient copper area (thermal pad), thermal vias under the package, and possibly an external heatsink to keep the junction temperature below 95\u00b0C for maximum reliability and light output stability.
• Drive Circuit: Use a constant current driver, not a constant voltage source, to ensure stable optical output and prevent thermal runaway. The driver should be rated for at least 500mA. Consider implementing pulse-width modulation (PWM) for dimming control if required.
• Optical Design: The 120-degree viewing angle provides wide coverage. For longer throw distances or specific beam patterns, secondary optics (lenses) may be required.
• ESD Protection: Incorporate transient voltage suppression (TVS) diodes or other protection circuits on the PCB input if the assembly environment or end-use poses an ESD risk.

9. Technical Comparison & Differentiation

The key differentiating factors of this LED are its EMC package and 950nm wavelength.

• EMC vs. Standard Plastic (PPA/PCT): EMC packages offer superior resistance to high temperature and humidity, leading to better long-term reliability (lumen maintenance) and resistance to sulfurization, which can darken standard plastic lenses over time. This makes them ideal for harsh outdoor or industrial environments.
• 950nm vs. 850nm: While 850nm LEDs are more common and often have higher radiant efficiency, they emit a faint red glow visible in darkness. The 950nm wavelength is completely invisible, making it preferable for covert surveillance applications. However, camera sensitivity is generally lower at 950nm than at 850nm, which may require higher power or more sensitive cameras.

10. Frequently Asked Questions (FAQs)

10.1 Why is the forward voltage so low (1.5V)?

Infrared LEDs, particularly those based on certain semiconductor materials like GaAlAs, inherently have a lower forward voltage than visible light LEDs (which are typically around 3.0V for white/blue). This is due to the smaller bandgap energy of the semiconductor material used to produce infrared light.

10.2 How do I control the brightness?

Brightness (radiant flux) is primarily controlled by the forward current (I_F). The most stable and recommended method is to use a constant current driver and adjust its current setpoint. For dynamic control, PWM dimming of the constant current source is effective and avoids color shift.

10.3 What does "free of red" mean?

"Free of red" or "no red leak" indicates that the LED emits very little to no visible red light (around 650-700nm). A pure 950nm LED should appear completely dark when viewed directly, which is a critical feature for covert illumination.

10.4 How critical is the MSL 3 rating?

Very critical for assembly yield. If the devices absorb too much moisture from the air and are then subjected to the high heat of reflow soldering, the rapid vaporization of the moisture can cause internal delamination or cracking ("popcorning"). Always follow the handling instructions related to the MSL rating.

11. Practical Design Case Study

Scenario: Designing a compact IR illuminator for an outdoor security camera.

1. Requirements: Provide uniform illumination over a 90-degree horizontal field of view at a distance of 15 meters. The illuminator must be weatherproof and have a lifespan of several years.
2. LED Selection: This 950nm EMC-packaged LED is chosen for its invisible output, wide viewing angle (120\u00b0), and robust package suitable for outdoor use.
3. Thermal Design: A 2-layer FR4 PCB is used with a large top-layer copper pour connected to the LED's thermal pad. An array of thermal vias transfers heat to a bottom-layer copper plane, which acts as a heatsink. Thermal simulation is run to ensure T_J < 85\u00b0C under worst-case ambient temperature.
4. Electrical Design: A switching constant-current LED driver IC is selected, configured to deliver 450mA (slightly derated from 500mA for extra reliability). PWM input is provided for the camera system to synchronize or dim the IR LEDs.
5. Optical/Mechanical Design: Multiple LEDs are arranged in an array. A diffuser lens is placed over the array to blend the individual beams and achieve the desired 90-degree pattern. The housing is sealed with an IP67 rated gasket.

12. Technology Principle Introduction

This LED is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. The energy released during this recombination is emitted as photons (light). The wavelength of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region. For a 950nm output, materials from the Gallium Aluminum Arsenide (GaAlAs) family are typically employed. The EMC package encapsulates the semiconductor chip, provides mechanical protection, houses the primary lens that shapes the beam, and includes a leadframe that serves as both the electrical connection and a primary path for heat conduction away from the chip.

13. Industry Trends & Developments

The infrared LED market is driven by growing demand in security, automotive (LiDAR, driver monitoring), and consumer electronics (face recognition). Key trends include:

• Higher Power & Efficiency: Continuous development of chip and package technology to deliver more radiant flux per unit area (W/mm\u00b2) and higher wall-plug efficiency (optical power out / electrical power in).
• Advanced Packaging: Adoption of chip-scale packages (CSP), flip-chip designs, and improved thermal interfaces to manage heat from increasingly powerful devices.
• Multi-Wavelength & VCSELs: Growth of Vertical-Cavity Surface-Emitting Lasers (VCSELs) for structured light and time-of-flight applications, offering different beam characteristics compared to traditional edge-emitting LED chips.
• Integration: Movement towards integrated modules that combine the LED, driver, optics, and sometimes a sensor into a single compact unit, simplifying design for end-users.