Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Package Dimensions and Mechanical Information
- 2.1 Package Dimension
- 3. Technical Parameters
- 3.1 Electrical and Optical Characteristics (Ts=25°C)
- 3.2 Absolute Maximum Ratings
- 4. Binning System
- 5. Typical Optical Characteristics Curves
- 6. Packaging Information
- 6.1 Packaging Specification
- 6.2 Reel Dimensions
- 6.3 Label Information
- 6.4 Moisture Resistant Packing
- 6.5 Cardboard Box
- 7. Reliability Test Items and Conditions
- 8. SMT Reflow Soldering Instructions
- 8.1 Recommended Reflow Profile
- 8.2 Manual Soldering
- 8.3 Repair
- 8.4 Cautions
- 9. Handling Precautions
- 9.1 Environmental Protection
- 9.2 Circuit Design
- 9.3 Thermal Management
- 9.4 Storage and Baking
- 9.5 ESD Sensitivity
- 10. Operating Principle
- 11. Application Guidance
- 11.1 Typical Use Cases
- 11.2 Design Considerations
- 12. Frequently Asked Questions
- 13. Technology Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
The Colour LED is fabricated using a blue chip and an orange chip, allowing for a unique color output suitable for various indication and display applications. The package measures 1.6mm x 1.6mm x 0.7mm, making it ideal for compact SMT designs. This device is designed for general-purpose use where a combination of blue and orange light is required.
1.2 Features
- Extremely wide viewing angle of 140°.
- Suitable for all SMT assembly and solder processes.
- Moisture sensitivity level: Level 3.
- RoHS compliant.
1.3 Applications
Optical indicators, switch and symbol displays, general decorative lighting, and other applications requiring a compact multicolor LED.
2. Package Dimensions and Mechanical Information
2.1 Package Dimension
The LED has a top view dimension of 1.60mm x 1.60mm, with a height of 0.70mm (including lens). Polarity is marked: Pin 1 is anode for orange chip, Pin 2 is cathode for orange chip, Pin 3 is anode for blue chip, Pin 4 is cathode for blue chip, as per the bottom view diagram. A soldering pattern is provided for optimal heat dissipation and mechanical stability. All dimensions in millimeters with tolerances ±0.2mm unless noted.
3. Technical Parameters
3.1 Electrical and Optical Characteristics (Ts=25°C)
At a test current of 20mA, the forward voltage for the orange chip ranges from 1.8V to 2.4V (typical 2.0V), and for the blue chip from 2.8V to 3.5V (typical 3.2V). The dominant wavelength is binned: orange chips are available in bins D00 (615-620nm), E00 (620-625nm), F00 (625-630nm), G00 (630-635nm); blue chips in bins B10 (455-457.5nm), B20 (457.5-460nm), C10 (460-462.5nm), C20 (462.5-465nm). Spectral half bandwidth is typically 30nm for orange and 15nm for blue. Luminous intensity is also binned: orange bins include F00 (65-100mcd), G00 (100-150mcd), 1KQ (150-225mcd); blue bins include E00 (43-65mcd), F00 (65-100mcd), G00 (100-150mcd), 1KQ (150-225mcd). Viewing angle is 140°. Reverse current at 5V is max 10µA. Thermal resistance from junction to solder point is max 450°C/W.
3.2 Absolute Maximum Ratings
Power dissipation: orange 72mW, blue 105mW. Forward current: 30mA DC. Peak forward current (pulse 1/10 duty, 0.1ms): 60mA. Electrostatic discharge (HBM): 1000V. Operating temperature range: -40°C to +85°C. Storage temperature: -40°C to +85°C. Junction temperature: 95°C maximum.
4. Binning System
Devices are sorted into wavelength bins (dominant wavelength), luminous intensity bins, and forward voltage bins as per the datasheet coding. Each reel is labeled with the specific bin codes for wavelength, intensity, forward voltage, and lot number. This binning ensures consistency for application requirements.
5. Typical Optical Characteristics Curves
The following curves are provided for design guidance at Ts=25°C unless otherwise specified:
- Forward Voltage vs Forward Current: At low currents (0-5mA) voltage increases rapidly; above 10mA the slope becomes more gradual, typical for LED diodes.
- Forward Current vs Relative Intensity: Relative intensity increases nearly linearly with forward current up to 30mA, with slight saturation at higher currents.
- Pin Temperature vs Relative Intensity: Intensity decreases as temperature rises. At 100°C, relative intensity drops to about 80% of the value at 25°C.
- Pin Temperature vs Forward Current: Maximum safe forward current decreases with temperature to prevent overheating. At 100°C, the allowable current reduces to about 20mA.
- Forward Current vs Dominant Wavelength: For orange chip, wavelength shifts slightly (about 2-3nm) with current; for blue chip, shift is minimal.
- Relative Intensity vs Wavelength: Spectrum shows two peaks: blue around 460nm and orange around 620nm.
- Radiation Diagram: The device has a wide beam pattern typical of an SMD LED, with relative intensity above 0.5 up to ±70°.
6. Packaging Information
6.1 Packaging Specification
Standard packaging: 4000 pieces per reel. Carrier tape dimensions: 8mm width, with a pocket pitch of 4mm. Tape thickness 0.2mm. Polarity marking on tape ensures correct orientation.
6.2 Reel Dimensions
Reel outer diameter 178mm, width 8.0mm, hub diameter 60mm. Tape slot width 13mm.
6.3 Label Information
Each reel is labeled with Part Number, Spec Number, Lot Number, Bin Code (wavelength, flux, forward voltage), Quantity (typically 4000pcs), and Date.
6.4 Moisture Resistant Packing
LEDs are packed in moisture barrier bags with desiccant and humidity indicator card. Sealed bag storage condition: <30°C / <75% RH for up to one year from date of packing.
6.5 Cardboard Box
Reels are placed in cardboard boxes for shipping. The box is labeled with product and quantity information.
7. Reliability Test Items and Conditions
| Test | Condition | Duration | Sample size | Accept Criteria |
|---|---|---|---|---|
| Reflow | 260°C max, 10s | 2 times | 22 pcs | 0/1 |
| Temperature Cycle | -40°C to 125°C, 30min cycles | 100 cycles | 22 pcs | 0/1 |
| Thermal Shock | -40°C to 125°C, 15min dwell | 300 cycles | 22 pcs | 0/1 |
| High Temperature Storage | 100°C | 1000 hrs | 22 pcs | 0/1 |
| Low Temperature Storage | -40°C | 1000 hrs | 22 pcs | 0/1 |
| Life Test | Ta=25°C, IF=20mA | 1000 hrs | 22 pcs | 0/1 |
Criteria for judging damage: Forward voltage change < 1.1x upper spec limit; reverse current < 2x upper spec limit; luminous flux > 0.7x lower spec limit.
8. SMT Reflow Soldering Instructions
8.1 Recommended Reflow Profile
Preheating: 150°C to 200°C for 60-120 seconds. Ramp-up rate: max 3°C/s. Time above 217°C: 60-150 seconds. Peak temperature: 260°C for max 10 seconds. Cooling rate: max 6°C/s. Total time from 25°C to peak: max 8 minutes.
8.2 Manual Soldering
If manual soldering is necessary, use a soldering iron set below 300°C and complete in less than 3 seconds. Only one manual solder operation per LED is allowed.
8.3 Repair
Repairing is not recommended. If unavoidable, use a double-head soldering iron and pre-validate that LED characteristics are not damaged.
8.4 Cautions
Do not mount components on warped PCBs. Avoid mechanical stress during cooling. Do not rapidly cool after soldering. Reflow should not be performed more than twice.
9. Handling Precautions
9.1 Environmental Protection
The LED operating environment should limit sulfur element composition to less than 100PPM in mating materials. Bromine and chlorine content in external materials: each less than 900PPM, total less than 1500PPM. Volatile organic compounds (VOCs) can attack silicone encapsulant; avoid outgassing adhesives and chemicals.
9.2 Circuit Design
Current through each LED must not exceed absolute maximum ratings. Use series resistors to prevent current surge due to voltage variations. Design driving circuit to allow only forward voltage; reverse voltage can cause migration and damage.
9.3 Thermal Management
Thermal design is critical. Heat generation can reduce brightness and shift color. Ensure adequate heat sinking. Junction temperature must not exceed 95°C.
9.4 Storage and Baking
Unopened moisture barrier bag: store at <30°C and <75% RH for up to 1 year. After opening: store at <30°C and <60% RH for 168 hours. If moisture absorbent material has faded or storage time exceeded, bake at 60±5°C for 24 hours before use.
9.5 ESD Sensitivity
LEDs are electrostatic discharge sensitive. Standard ESD precautions should be taken during handling and assembly.
10. Operating Principle
This device combines a blue InGaN chip and an orange AlInGaP chip in a single package. When forward current is applied, each chip emits its characteristic wavelength. The two chips can be driven independently to produce separate blue and orange light, or simultaneously to create a mixed color (e.g., warm white if combined with other phosphors, but in this product the colors are used directly for indication purposes).
11. Application Guidance
11.1 Typical Use Cases
Ideal for status indicators requiring distinct colors, such as power-on (blue) and warning (orange) in consumer electronics. Also suitable for decorative lighting where color change or combination is programmed.
11.2 Design Considerations
When designing the PCB, follow the recommended soldering pattern for thermal and mechanical reliability. Ensure adequate clearance for the 0.7mm height. For pulse driving, stay within peak current limits. Consider binning for color consistency if multiple devices are used together.
12. Frequently Asked Questions
Q: Can I drive both chips simultaneously at full current? Yes, but ensure total power dissipation does not exceed the sum of absolute maximum ratings for each chip and that junction temperature remains below 95°C.
Q: What is the recommended current for long life? For longest lifetime, operate at 20mA or less per chip. Higher current reduces life due to elevated junction temperature.
Q: How do I prevent ESD damage? Use grounded workstations, conductive containers, and avoid direct contact with LED terminals.
Q: What is the color of the mixed light? The mixed light appears as a combination of blue and orange, which can be perceived as a shade of warm white or pinkish depending on the relative intensities. Exact color can be fine-tuned by adjusting current to each chip.
13. Technology Trends
The trend in LED packaging continues towards smaller footprints, higher efficiency, and multichip integration. This product reflects the move toward compact multi-emitter packages that save board space and allow design flexibility. Advanced binning and stricter reliability standards support demanding applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |