LED Blue 3.00x3.00x2.10mm 3.3V 1.65W EMC Package Datasheet - 460nm - 500mA - 20lm

1. Product Overview

This document provides a comprehensive technical specification for a high-power blue light emitting diode (LED) utilizing an EMC (Epoxy Molding Compound) package. The device is designed for demanding applications requiring high reliability, including security monitoring, sensor illumination, landscape lighting, and general lighting. With a compact footprint of 3.00mm x 3.00mm x 2.10mm, it enables dense PCB layouts while delivering a typical luminous flux of 20 lumens at 500mA drive current. The EMC package offers superior thermal performance and robustness compared to traditional leadframe packages, making it suitable for extended operation in harsh environments.

1.1 Key Features

• Pb-free reflow soldering compatible (RoHS compliant)
• Moisture sensitivity level: MSL Level 3 (per JEDEC)
• Dominant wavelength: 460nm (typical) – blue color
• Forward voltage: 3.0V – 3.3V (typical 3.3V at 500mA)
• Viewing angle: 100 degrees (half-power)
• Thermal resistance: 14°C/W (junction to solder point)
• Electrostatic discharge protection: 2kV (HBM) with >90% yield

1.2 Target Applications

• Optical indicators and signal lighting
• Landscape and architectural lighting
• General illumination and decorative lighting
• Security and surveillance camera illumination
• Sensor and machine vision systems

2. Technical Parameter Analysis

The following sections provide an in-depth interpretation of the electrical, optical, and thermal parameters specified in the product datasheet.

2.1 Optical Characteristics

At 25°C and 500mA forward current, the LED exhibits a dominant wavelength of 460nm with a spectral bandwidth of 30nm. The luminous flux is rated at 20 lumens (typical), with a measurement tolerance of ±10%. The viewing angle (half-power angle 2θ1/2) is 100 degrees, providing a wide beam spread suitable for general illumination and indicator applications. The radiation pattern is highly symmetrical, as shown in the polar diagram (see Fig 1-10 in the original datasheet).

2.2 Electrical Parameters

Forward voltage at 500mA ranges from 3.0V minimum to a typical 3.3V. The measurement tolerance is ±0.1V. The reverse current is specified at 10µA maximum when a reverse voltage of 5V is applied. The power dissipation is limited to 1.65W absolute maximum, which corresponds to the 500mA drive condition. It is critical to never exceed the absolute maximum ratings to avoid permanent damage.

2.3 Thermal Characteristics

The junction-to-solder-point thermal resistance is 14°C/W. This low thermal resistance, facilitated by the EMC package design, allows efficient heat transfer from the LED junction to the PCB. Proper thermal management is essential; the junction temperature should not exceed the maximum rating of 115°C. Derating curves show that forward current must be reduced as ambient temperature increases to maintain junction temperature within limits.

3. Binning and Sorting

Although the datasheet does not explicitly detail binning tables, the product is supplied with bin codes for luminous flux (Φ), dominant wavelength (WLD), and forward voltage (VF) as indicated on the reel label. This allows customers to select specific performance grades for their applications. Typical binning may include flux bins in increments and wavelength bins around 460nm. Contact the supplier for detailed binning availability.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

The I-V characteristic curve (Fig 1-6 in the datasheet) shows a typical forward voltage of approximately 3.3V at 500mA. As current increases from 100mA to 600mA, the voltage rises from about 3.0V to 3.4V. This near-linear relationship is typical for blue LEDs.

4.2 Relative Intensity vs. Current

The relative luminous intensity increases with forward current but shows some saturation at higher currents (Fig 1-7). At 500mA, the relative intensity is approximately 100%, while at 100mA it drops to about 20%. This curve helps designers estimate light output at lower drive currents.

4.3 Temperature Dependency

Fig 1-8 demonstrates that relative intensity decreases with increasing ambient temperature. At 85°C, the intensity drops to about 85% of the value at 25°C. This thermal sensitivity must be accounted for in fixture designs operating in elevated temperature environments.

4.4 Spectral Distribution

The spectrum (Fig 1-9) peaks around 460nm with a full width at half maximum of 30nm. The spectrum is confined to the blue region, with negligible emission outside the 400-700nm range.

4.5 Radiation Diagram

The polar radiation pattern (Fig 1-10) shows a lambertian-like distribution with a half-power angle of ±50 degrees. This wide distribution is suitable for flood lighting and general illumination.

4.6 Current vs. Pin Temperature Derating

Fig 1-11 provides the derating curve: at a pin temperature of 60°C, the maximum forward current is approximately 400mA, and at 100°C it reduces to about 100mA. This curve is essential for thermal design.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED package measures 3.00mm x 3.00mm x 2.10mm (length x width x height) with tolerances of ±0.2mm unless otherwise noted. The top view shows a square package with two pads: cathode and anode are identified in Fig 1-2. The side view indicates a height of 2.10mm with a 0.70mm lens protrusion. The bottom view shows pad dimensions: cathode pad 1.45mm x 0.69mm, anode pad 1.45mm x 0.69mm, with a spacing of 1.45mm between pads. Soldering patterns (Fig 1-5) recommend 3.00 x 2.26mm solder pads for proper mounting.

5.2 Polarity Identification

The cathode is marked by a small notch or dot on the package (see Fig 1-2). The anode is on the opposite side. Correct polarity must be observed during assembly.

5.3 Soldering Patterns

The recommended soldering pattern (Fig 1-5) is 3.00mm x 2.26mm with 0.46mm spacing to the edge. The thermal pad helps dissipate heat. Use appropriate stencil design to ensure adequate solder coverage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile (Fig 3-1) specifies: preheat from 150°C to 200°C for 60-120 seconds; time above 217°C (TL) should be 60-150 seconds; peak temperature (TP) 260°C with a maximum 10 seconds hold time (tP) within 5°C of peak. Cooling rate should not exceed 6°C/second. Only two reflow passes are allowed. If more than 24 hours pass between first and second reflow, the LEDs may be damaged.

6.2 Manual Soldering

When hand soldering, use a soldering iron set below 300°C for less than 3 seconds per pad. Only one hand solder operation is permitted.

6.3 Rework and Repair

Repair is not recommended after soldering. If unavoidable, use a double-head soldering iron and pre-check characteristics. Ensure no mechanical stress is applied during heating.

6.4 Handling Precautions

• Do not apply pressure to the silicone lens surface; handle only by the sides.
• Avoid mounting on warped PCBs; do not bend the board after soldering.
• Do not rapidly cool after soldering; allow natural cooling to room temperature.
• Do not apply mechanical vibration during cooling.

6.5 Storage Conditions

Unopened moisture barrier bags: store at <30°C and <75% RH for up to one year from date of packing. After opening: 168 hours at <30°C and <60% RH. If exceeded, bake at 60±5°C for 24 hours before use.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The LED is supplied in tape and reel packaging with 3000 pieces per reel. Carrier tape dimensions are shown in Fig 2-1 with a polarity mark. Reel dimensions: A=12.7±0.3mm, B=330.2±2mm, C=79.5±1mm, D=14.3±0.2mm. Moisture barrier bag with desiccant and humidity indicator card is used for moisture protection.

7.2 Label Information

The reel label includes: Part Number (PART NO.), Spec Number (SPEC NO.), Lot Number (LOT NO.), Bin Code (BIN CODE), Luminous Flux (Φ), Dominant Wavelength (WLD), Forward Voltage (VF), Quantity (QTY), and Date (DATE). This information is used for traceability and bin selection.

7.3 Cardboard Box

Reels are packed in cardboard boxes for shipping. The box is labeled with product and quantity information.

8. Reliability and Qualification

8.1 Reliability Test Items

The product has passed the following reliability tests per JEDEC standards: Reflow soldering (260°C, 3 times), Temperature cycling (-40°C to 100°C, 100 cycles), Thermal shock (-40°C to 115°C, 300 cycles), High temperature storage (100°C, 1000h), Low temperature storage (-40°C, 1000h), and Life test (25°C, 500mA, 1000h). Acceptance criteria: 0 failures out of 10 samples (0/1) for each test.

8.2 Failure Criteria

Post-stress limits: Forward voltage change ≤ 1.1x upper spec limit; Reverse current ≤ 2.0x upper spec limit; Luminous flux degradation ≥ 0.7x lower spec limit.

9. Application Design Recommendations

9.1 Thermal Design

Given the 14°C/W thermal resistance and 1.65W maximum power dissipation, adequate heatsinking is crucial. Use proper PCB copper area and thermal vias to keep junction temperature below 115°C. Derate current based on ambient temperature using the provided derating curve.

9.2 Electrical Design

Each LED must be driven with current-limiting resistors or constant current sources to prevent thermal runaway. Reverse voltage should be avoided; use protection diodes if necessary. ESD protection is recommended during handling and operation.

9.3 Environmental Considerations

Avoid exposure to sulfur compounds (>100ppm), halogens (bromine and chlorine individually <900ppm, total <1500ppm), and volatile organic compounds that can outgas and damage the silicone lens. Use isopropyl alcohol for cleaning if needed.

10. Working Principle

This LED is a semiconductor device that emits light via electroluminescence. The active region consists of an InGaN (indium gallium nitride) quantum well structure that emits blue light when electrons and holes recombine under forward bias. The emission wavelength is determined by the bandgap of the quantum well material. The EMC package uses epoxy molding compound as the encapsulation, which provides mechanical protection and optical coupling. The silicone lens increases the viewing angle and improves light extraction.

11. Technology Trends

The trend for high-power LEDs continues toward higher efficacy, smaller packages, and improved thermal management. EMC packages like this one offer a balance of cost and performance for general lighting and industrial applications. The 460nm blue chip is also used as a phosphor-pumping source for white LEDs, though this device is intended for direct blue emission. Future developments may include higher flux densities and enhanced reliability with lower thermal resistance.

12. Common Questions and Design Cases

12.1 FAQ

Q: Can I drive this LED at 700mA? A: No, the absolute maximum current is 500mA (with proper heat sinking). Exceeding this may damage the device.

Q: What is the typical lifetime? A: The datasheet does not specify L70 lifetime, but based on similar EMC LEDs, under rated conditions it can exceed 50,000 hours.

Q: Is the LED suitable for pulse operation? A: Yes, pulsed operation with low duty cycle can allow higher peak current, but ensure average power does not exceed 1.65W.

12.2 Application Example

In a landscape lighting fixture with 12 LEDs, each driven at 350mA to achieve a total of 240 lumens, with proper heatsinking using an aluminum PCB. The forward voltage at 350mA is approximately 3.2V, so total power per LED is 1.12W. Thermal design ensures junction temperature below 85°C under 40°C ambient. A constant current driver with thermal foldback is recommended for safety.