Table of Contents
- 1. Product Overview
- 2. Technical Parameters Detailed Interpretation
- 2.1 Optical-Electrical Characteristics
- 2.2 Absolute Maximum Ratings
- 2.3 Binning System
- 3. Mechanical and Packaging Information
- 3.1 Outline Dimensions
- 3.2 Package Diagram
- 4. Reliability and Material Testing
- 4.1 Reliability Tests
- 4.2 Material Performance Tests
- 5. Soldering and Handling Precautions
- 6. Packaging and Ordering Information
- 6.1 Packaging Specifications
- 6.2 Label Information
- 7. Application Recommendations
- 8. Working Principle
- 9. Development Trends
- 10. Frequently Asked Questions
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This LED module is designed according to the market mainstream of lamps and lanterns, ensuring easy matching and convenient assembly. It utilizes 2835 LED packages, offering high lighting efficiency, low heat generation, and is free of mercury, qualifying as an environmental-friendly cold light source. The module boasts high reliability and safety, with electrical parameters designed to align with mainstream LED power supplies. It is particularly suited for direct-lit (DLED) panel lights, providing uniform illumination and long operational life.
2. Technical Parameters Detailed Interpretation
2.1 Optical-Electrical Characteristics
At a solder point temperature (Ts) of 25°C and a forward current of 360mA, the module exhibits the following typical characteristics:
- Forward Voltage: Typically 41.6V to 52.8V, with a minimum of 41.6V and maximum of 52.8V.
- Power Consumption: Ranges from 14.976W to 19.1W.
- Luminous Flux: Varies by color temperature bin, from a minimum of 2230 lm to a maximum of 3000 lm. For example, the 2870-3220K bin offers 2230-2708 lm, while the 4740-5250K bin offers 2470-3000 lm.
- Color Rendering Index (CRI): Typical value of 84, with a minimum of 80 (Ra ≥ 80).
- Color Tolerance: The module maintains a MacAdam ellipse of ≤ 4.2 SDCM, ensuring color consistency across units.
Four standard correlated color temperature (CCT) bins are available: 2870-3220K, 3220-3700K, 3700-4275K, and 4740-5250K, covering warm white to cool white.
2.2 Absolute Maximum Ratings
The module must not be operated beyond the following absolute maximum ratings at Ts=25°C to prevent damage:
- Forward Current (IF): 360 mA (continuous), 650 mA (peak).
- Reverse Voltage (VR): 5 V.
- Electrostatic Discharge (ESD): 2000 V (HBM).
- Operating Temperature (TOPR): -40°C to +85°C.
- Storage Temperature (TSTG): -40°C to +100°C.
- Junction Temperature (TJ): 115°C (single LED).
2.3 Binning System
The module is sorted into bins based on CCT, luminous flux, and voltage. The naming convention (e.g., RF-MTD402T18-E1) encodes the module type (D: DLED), CCT (40: 3700-4275K), LED package type (2: 2835), CRI grade (H: 85≥T>80), power (18: 18W), emitting light way (E: top view), and version (1: first version). This systematic binning allows customers to select modules with tightly controlled parameters for consistent fixture performance.
3. Mechanical and Packaging Information
3.1 Outline Dimensions
The module has the following dimensions (tolerances are ±0.3mm unless noted):
- Length (L): 582 mm
- Width (W): 24 mm
- PCB Thickness (H1): 1.5 mm (±0.16mm)
- Overall Module Height (H2): 6 mm
The module is designed as a linear light bar with a 4P16S electrical configuration (4 parallel groups, 16 series LEDs per group? Or 4 pins, 16 series? The specification shows 4P16S connection diagram, indicating 4 parallel strings of 16 series LEDs). The PCB is a single-layer or multi-layer board with connector interface for easy integration.
3.2 Package Diagram
Modules are packed in blister boxes (trays) with a specific stacking method. Each blister box holds 20 modules (10 slots, 2 modules placed back-to-back per slot). A total of 8 loaded blister boxes plus one empty box (as a cover) are placed in a carton, yielding 160 modules per carton (20 modules/box × 8 boxes). The carton dimensions are provided in the full specification, and the carton is printed with handling symbols and identifiers.
4. Reliability and Material Testing
4.1 Reliability Tests
The module has undergone rigorous reliability testing with zero failures under the following conditions (sample size 6 per test):
- Operating Life at Room Temperature: TA=25°C, IF=360mA, TJ<115°C, 500 hours. Criteria: ΔΦ<30%, Vf<110%, CIE Δx/Δy<0.015, no catastrophic failure.
- Operating Life at High Temperature: TA=60°C, IF=360mA, TJ<115°C, 500 hours. Same criteria.
- Operating Life at High Temperature and Humidity: 60°C, RH=90%, IF=360mA, TJ<115°C, 500 hours. Same criteria.
- Thermal Shock: -40°C for 15 minutes to 85°C for 15 minutes, with 10-second transition, 100 cycles. Same criteria.
These tests confirm the module's durability under typical and stressful environments.
4.2 Material Performance Tests
At Ta=25°C, the module's materials are tested to ensure quality:
- LED Optical-Electrical Characteristics: Verified by integrating sphere to comply with specifications.
- Connector Pull Force: ≥7 kgf.
- LED Push & Pull Force: ≥3 kgf.
- LED Welding Standards: X-shift ≤ ±0.15mm, Y-shift ≤ ±0.15mm, angle ≤ ±3°.
5. Soldering and Handling Precautions
To ensure long-term reliability, adhere to the following guidelines:
- Material Compatibility: Avoid materials containing sulfur and its compounds above 100 ppm. Halogen content (Br, Cl) should be below 900 ppm each, with total below 1500 ppm.
- VOC Sensitivity: Organic volatiles can penetrate the silicone encapsulant and cause discoloration under heat and light. Test all materials for compatibility before use.
- Handling: Handle modules by the edges using tweezers; do not touch the silicone lens surface directly. Avoid bending or twisting the light bar more than 10°.
- Cleaning: If cleaning is required after soldering, use isopropyl alcohol. Do not use ultrasonic cleaning as it may damage the LEDs.
- ESD Protection: LEDs are sensitive to electrostatic discharge. Use proper ESD precautions (e.g., grounded workstations, wrist straps).
- Circuit Design: Current through each LED must not exceed the absolute maximum rating. Use series resistors to limit current and prevent thermal runaway. Ensure reverse voltage is never applied.
6. Packaging and Ordering Information
6.1 Packaging Specifications
Modules are shipped in cartons containing 9 blister boxes (8 loaded + 1 empty cover). Each blister box holds 20 modules (10 slots × 2 modules back-to-back). The total quantity per carton is 160 modules. The stacking height for cartons is a maximum of 6 layers; adjust based on actual conditions to avoid damage.
6.2 Label Information
Each carton label includes the following fields: Customer Part Number, Part Number (P/N), Bin Code, Luminous Flux (LM), Voltage (VF), CCT, CRI, Quantity, Net Weight, and Date. This allows traceability and easy binning selection.
7. Application Recommendations
This LED module is optimized for direct-lit (DLED) panel lights. Typical applications include office lighting, commercial lighting, and general indoor illumination. When designing the luminaire, ensure proper heat sinking to keep the junction temperature below 115°C. The module's 4P16S configuration should be driven by a constant-current LED driver with a suitable current (360 mA typical) and voltage range (41.6–52.8 V). For optimal color uniformity, modules from the same CCT bin should be used within a single fixture.
8. Working Principle
These modules use 2835-sized SMD LEDs. When a forward current flows through the LED chip, electrons and holes recombine in the p-n junction, emitting photons. The emitted light's wavelength (color) depends on the semiconductor material (e.g., phosphor conversion for white LEDs). The module's high efficacy is achieved by using high-efficiency chips and optimized thermal management. The LEDs are arranged in a series-parallel matrix to achieve the desired voltage and current, ensuring uniform light output.
9. Development Trends
The trend in LED lighting modules is toward higher efficacy, smaller form factors, and improved color quality. This module's use of 2835 packages—a widely adopted mid-power package—balances cost and performance. Future developments may include higher CRI options (e.g., Ra > 90), tunable white capabilities, and integration with smart lighting controls. Additionally, environmental regulations continue to push for elimination of hazardous substances, which this module already complies with (RoHS, no mercury).
10. Frequently Asked Questions
Q1: What is the maximum current that can be applied to this module? The absolute maximum forward current is 360 mA continuous, with a peak of 650 mA (non-repetitive). For reliable operation, drive at 360 mA or lower.
Q2: Can the module be used in outdoor environments? The operating temperature range is -40°C to +85°C, but the module is not rated for outdoor use without additional moisture protection. Use in dry indoor environments is recommended.
Q3: How do I select the correct bin for my application? Choose CCT based on desired color temperature (e.g., 3500K for warm, 5000K for cool). Luminous flux bins indicate brightness; choose higher bins for higher output, but ensure the driver can handle the increased current. Voltage bins should match the driver's output range.
Q4: Is the module compatible with triac dimming? The module itself is a constant-current device. Dimming requires a compatible constant-current dimmable driver that adjusts forward current. Ensure the driver's minimum load is satisfied.
Q5: What is the expected lifetime? Based on the reliability tests, the module can exceed 50,000 hours of operation at rated current with L70 maintenance (30% lumen depreciation). Actual lifetime depends on thermal management and driver quality.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |