XI3030PF SMD Mid-Power LED Datasheet - 3.0x3.0x1.1mm - 2.8V Max - 65mA - Cool/Neutral/Warm White - English Technical Document

1. Product Overview

The XI3030PF is a surface-mount device (SMD) mid-power LED encapsulated in a PLCC-2 package. It is designed as a top-view white LED, offering a compelling combination of high luminous intensity output and a wide viewing angle. Its compact form factor and high efficacy make it a versatile component suitable for a broad spectrum of lighting applications. The product adheres to stringent environmental standards, being lead-free (Pb-free), compliant with EU REACH regulations, and manufactured as a halogen-free component (with Bromine <900ppm, Chlorine <900ppm, Br+Cl <1500ppm). The product itself remains within RoHS compliant specifications.

1.1 Core Advantages and Target Market

The primary advantages of the XI3030PF series include its high luminous efficacy, which translates to better energy efficiency, and its wide 120-degree viewing angle, ensuring uniform light distribution. The use of ANSI standard binning for color characteristics guarantees consistency and reliability in color output across production batches. These features collectively position this LED as an ideal solution for general lighting, decorative and entertainment lighting, indicator applications, illumination tasks, and switch lights. Its balanced performance profile caters to both consumer and professional lighting markets requiring reliable, efficient, and consistent white light sources.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key technical parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

The device's operational limits are defined under conditions where the soldering point temperature (T_Soldering) is 25°C. Exceeding these ratings may cause permanent damage.

• Forward Current (I_F): 350 mA (Continuous).
• Peak Forward Current (I_FP): 420 mA (Pulsed, duty cycle 1/10, pulse width 10ms).
• Power Dissipation (P_d): 980 mW.
• Operating Temperature (T_opr): -40°C to +100°C.
• Storage Temperature (T_stg): -40°C to +100°C.
• Thermal Resistance (R_{th J-S}): 7.5 °C/W (Junction to Soldering point).
• Junction Temperature (T_j): 115 °C (Maximum).
• Soldering Temperature: Reflow soldering is rated for 260°C for 10 seconds. Hand soldering is permissible at 350°C for a maximum of 3 seconds. The component is sensitive to electrostatic discharge (ESD) and requires careful handling.

2.2 Electro-Optical Characteristics

Measured at T_Soldering = 25°C and a standard test current of I_F=65mA.

• Luminous Flux (Φ): The minimum values vary by correlated color temperature (CCT), ranging from 38 lm (3000K, 6500K) to 40 lm (4000K, 5000K). The typical tolerance is ±11%.
• Forward Voltage (V_F): Maximum rating is 2.8V, with a typical tolerance of ±0.1V. The typical value is around 2.6-2.7V.
• Color Rendering Index (CRI/Ra): A minimum of 80 is guaranteed for the listed models, with a tolerance of ±2.
• Viewing Angle (2θ_1/2): 120 degrees, typical.
• Reverse Current (I_R): Maximum 50 µA at a reverse voltage (V_R) of 5V.

2.3 Thermal Characteristics

The thermal resistance from the junction to the soldering point is a critical parameter at 7.5 °C/W. This value directly influences the junction temperature rise for a given power dissipation. Effective thermal management through PCB design (e.g., thermal vias, copper area) is essential to maintain the junction temperature below its 115°C maximum, ensuring long-term reliability and stable light output.

3. Binning System Explanation

The product employs a comprehensive binning system to ensure color and performance consistency.

3.1 Product Numbering and Binning Codes

The part number XI3030PF/KK8C-5MXXXX28U6/2N contains embedded bin codes. The \"XXXX\" section is replaced with specific digits defining key parameters: CRI, CCT, and Luminous Flux. For example, in \"5M404028U6\", \"5M\" indicates a CRI ≥80, \"40\" indicates a CCT of 4000K, the second \"40\" indicates a minimum luminous flux of 40 lm, \"28\" indicates a maximum forward voltage of 2.8V, and \"U6\" indicates a forward current of 65mA.

3.2 Color Rendering Index (CRI) Binning

CRI is binned with specific minimum values: M=60, N=65, L=70, Q=75, K=80, P=85, H=90, R=90 (with R9≥50). The models in this datasheet use the \"K\" bin, guaranteeing Ra ≥80.

3.3 Luminous Flux Binning

Flux is binned per CCT group. For instance, at 4000K/5000K, bins are 40L2 (40-42 lm) and 42L2 (42-44 lm). At 3000K, bins are 38L2 (38-40 lm) and 40L2 (40-42 lm). At 6500K, bins are 39L2 (39-41 lm) and 41L2 (41-43 lm). All have an ±11% tolerance.

3.4 Forward Voltage Binning

Voltage is grouped under code \"2628\" with two bins: 26A (2.6-2.7V) and 27A (2.7-2.8V), with a ±0.1V tolerance.

3.5 Chromaticity Binning (MacAdam Ellipses)

The LED chromaticity coordinates are controlled within defined MacAdam ellipse steps to ensure color uniformity. The datasheet provides data for both 3-step and 5-step ellipses across the available CCTs (3000K, 4000K, 5000K, 6500K). A 3-step ellipse is a tighter tolerance, meaning LEDs within this ellipse are visually very similar in color. The provided CIE 1931 diagram illustrates the target chromaticity points for each CCT.

4. Performance Curve Analysis

The datasheet includes several graphs depicting the LED's behavior under varying conditions.

4.1 Forward Voltage vs. Junction Temperature (Fig.1)

This curve shows that the forward voltage (V_F) has a negative temperature coefficient. As the junction temperature (T_j) increases from 25°C to 115°C, V_F decreases linearly by approximately 0.2V. This characteristic is important for constant-current driver design and thermal compensation considerations.

4.2 Relative Luminous Intensity vs. Forward Current (Fig.2) & Junction Temperature (Fig.3)

Figure 2 shows the sub-linear relationship between light output and current; increasing current yields diminishing returns in luminous flux. Figure 3 demonstrates the negative impact of temperature on light output. Relative luminous flux decreases as T_j rises, highlighting the critical need for effective heat sinking to maintain brightness and longevity.

4.3 Forward Current vs. Forward Voltage (Fig.4)

This is the standard I-V curve, showing the exponential relationship typical of a diode. It is essential for determining the operating point and power dissipation (V_F * I_F).

4.4 Maximum Driving Current vs. Ambient/Soldering Temperature (Fig.5)

This derating graph defines the maximum allowable forward current based on the temperature at the soldering point. As the ambient/solder point temperature increases, the maximum safe drive current must be reduced to prevent the junction temperature from exceeding its limit. This graph is vital for designing reliable systems operating in elevated temperature environments.

4.5 Radiation Pattern (Fig.6) and Spectrum Distribution

Figure 6 is a polar plot confirming the wide, Lambertian-like emission pattern with a 120° viewing angle. The spectrum distribution graph shows the relative spectral power distribution (SPD) for the white LED, which is a blue die combined with a phosphor, resulting in a broad emission peak in the yellow region and a smaller blue peak.

5. Mechanical and Package Information

5.1 Package Dimensions

The XI3030PF has a nominal footprint of 3.0mm x 3.0mm. The overall package height is approximately 1.1mm. The dimensional drawing specifies key measurements including pad size (typically 2.8mm x 2.8mm), lens dimensions, and cutout details. Tolerances are generally ±0.2mm unless otherwise noted.

5.2 Polarity Identification

The PLCC-2 package features a molded notch or a chamfered corner on the body. This physical marker denotes the cathode side. Correct polarity orientation is crucial during assembly to ensure proper operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is suitable for infrared or convection reflow soldering. The maximum peak temperature should not exceed 260°C, and the time above 260°C should be limited to 10 seconds. A standard, lead-free reflow profile is recommended.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature should be controlled to 350°C maximum, and the contact time per lead should be limited to 3 seconds. Use a low-power iron (approx. 30W) with a fine tip.

6.3 Handling and Storage Precautions

The LED is sensitive to electrostatic discharge (ESD). Handle in an ESD-protected environment using grounded wrist straps and conductive mats. Store in original, moisture-barrier bags in a controlled environment (as per the storage temperature range). Avoid exposure to high humidity before soldering.

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

• General Lighting: LED bulbs, tubes, panel lights, downlights.
• Decorative Lighting: String lights, architectural accent lighting, signage.
• Entertainment Lighting: Stage lighting effects where consistent white light is needed.
• Indicators & Switch Lights: Backlighting for panels, switches, and status indicators requiring higher brightness than standard LEDs.

7.2 Key Design Considerations

• Thermal Management: This is paramount. Use a PCB with adequate thermal relief, thermal vias under the pad, and sufficient copper area to dissipate heat. The 7.5 °C/W R_{th J-S} is from junction to solder point; the system thermal resistance to ambient must be managed by the board design.
• Drive Current: While rated up to 350mA, operating at lower currents like the typical 65mA improves efficacy and longevity. Use a constant-current LED driver for stable performance.
• Optics: The wide 120° beam may require secondary optics (lenses, reflectors) for applications needing focused or directed light.
• Color Consistency: For applications where color matching is critical, specify tight MacAdam ellipse steps (e.g., 3-step) and ensure all LEDs in a fixture are from the same production bin for flux and voltage.

8. Technical Comparison and Differentiation

While the datasheet does not compare directly with other products, objective analysis based on its parameters reveals its position. The XI3030PF, with its 3.0x3.0mm footprint, sits in the popular mid-power category. Its key differentiators include a relatively high efficacy for its class (e.g., ~230 lm/W typical at 65mA for 4000K), a wide 120° viewing angle, and comprehensive ANSI-standard binning for color and flux. The maximum forward voltage of 2.8V is competitive, potentially leading to lower system resistive losses compared to LEDs with higher V_F. Its compliance with the latest environmental standards (Halogen-Free, REACH) is also a significant advantage for modern, eco-conscious designs.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the actual power consumption at the typical operating point?

At the standard test condition of I_F=65mA and a typical V_F of 2.7V, the electrical power input is approximately 175.5 mW (0.065A * 2.7V).

9.2 How do I interpret the luminous flux bin code \"40L2\"?

The \"40\" represents the minimum luminous flux in lumens for that bin. The \"L2\" is an internal bin identifier. The actual range for the 40L2 bin at 4000K is 40-42 lm (minimum to maximum), with a ±11% tolerance on top of that.

9.3 Can I drive this LED at 350mA continuously?

Yes, but only if the thermal management is exceptionally effective. The datasheet lists minimum flux values at 350mA, but the power dissipation would be nearly 1W (350mA * ~2.8V), pushing the limits of the 980mW P_d rating. The junction temperature must be kept below 115°C, which requires a very low system thermal resistance. For most applications, operating at a lower current (e.g., 150mA or 65mA) is recommended for better efficacy and reliability.

9.4 What does \"MacAdam 3-step\" mean for color consistency?

A MacAdam ellipse defines a region on the CIE chromaticity diagram where color differences are imperceptible to the average human eye. A \"3-step\" ellipse means the LED's color coordinates are guaranteed to fall within an ellipse that is three times the size of the smallest perceptible difference (a 1-step ellipse). This represents good color consistency, suitable for most general lighting applications where slight color variations between adjacent LEDs are acceptable.

10. Practical Design and Usage Case

Case: Designing a High-Efficiency LED Panel Light

A designer is creating a 600x600mm LED panel light for office use targeting high efficacy and good color quality (CRI >80). They select the XI3030PF/KK8C-5M404028U6/2N for its 4000K neutral white temperature, 80+ CRI, and high typical efficacy of 230 lm/W. To maximize lifespan and efficacy, they choose to drive the LEDs at 65mA instead of the maximum rating. They design a metal-core PCB (MCPCB) with a high thermal conductivity dielectric layer to efficiently transfer heat from the LED solder pads to the aluminum substrate, which acts as a heat sink. The LEDs are arranged in a series-parallel configuration powered by a constant-current driver. By operating well within the thermal and electrical limits and leveraging the LED's high efficacy and consistent binning, the designer achieves a panel light with high luminous output, uniform color, and long operational life.

11. Operating Principle Introduction

The XI3030PF is a phosphor-converted white LED. At its core is a semiconductor chip made of indium gallium nitride (InGaN), which emits blue light when forward biased (electrical current passes through it). This blue light-emitting chip is encapsulated within a package that contains a layer of cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor. Part of the blue light from the chip is absorbed by the phosphor, which then re-emits light across a broad spectrum centered in the yellow region. The combination of the remaining blue light and the broad yellow emission from the phosphor results in the perception of white light. The exact correlated color temperature (CCT) is controlled by modifying the phosphor composition and concentration.

12. Technology Trends and Developments

The mid-power LED segment, represented by packages like the XI3030PF, continues to evolve. Key industry trends focus on increasing luminous efficacy (lumens per watt) through improvements in internal quantum efficiency of the blue chip and phosphor conversion efficiency. There is also a strong drive towards higher color rendering indices (CRI), particularly with improved red spectrum rendering (R9 value), as seen in the \"R\" bin in this datasheet. Another trend is the push for tighter color consistency (smaller MacAdam ellipses) to meet the demands of high-end commercial lighting. Furthermore, the integration of these LEDs into modules with built-in drivers and smart controls is a growing application trend. The emphasis on environmental compliance (Halogen-Free, REACH) is now a standard requirement driven by global regulations and consumer demand for sustainable products.