Orange SMD LED LTSA-G6SVUAETU Datasheet - Automotive Grade - 140mA - 3.2V Typ - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness, surface-mount LED designed for automated assembly processes and space-constrained applications. The primary target market for this component is the automotive industry, specifically for accessory applications where reliability and performance under varying environmental conditions are paramount.

The device is constructed using InGaN (Indium Gallium Nitride) technology to produce a yellow light source, which is then filtered through an orange lens to achieve the final output color. This combination allows for efficient light generation and precise color control. The package is designed to be compatible with standard infrared reflow soldering processes, making it suitable for high-volume manufacturing on printed circuit boards (PCBs).

1.1 Core Features and Advantages

• Automotive Qualification: The device is qualified with reference to the AEC-Q101D standard, which defines stress test qualification for discrete semiconductors in automotive applications. This ensures reliability under the harsh conditions typical in vehicles.
• RoHS Compliance: The materials and manufacturing process comply with the Restriction of Hazardous Substances directive, making it suitable for global markets with strict environmental regulations.
• Manufacturing Readiness: The component is supplied in a standard EIA package format on 12mm tape wound onto 7-inch diameter reels. This packaging is compatible with automated pick-and-place equipment, streamlining the assembly line.
• Thermal Management: The cathode lead frame is designed to also function as a heat sink, aiding in the dissipation of thermal energy from the semiconductor junction, which is critical for maintaining performance and longevity.
• IC Compatibility: The electrical characteristics are designed to be compatible with standard integrated circuit driving voltages and currents.

2. Technical Parameters and Characteristics

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd): 900 mW
• DC Forward Current (IF): 250 mA
• Peak Forward Current: 500 mA (under pulsed conditions: 1/10 duty cycle, 0.1ms pulse width)
• Reverse Voltage (VR): The device is not designed for reverse operation. Applying a reverse bias can cause immediate failure.
• Operating Temperature Range (Topr): -40°C to +110°C
• Storage Temperature Range (Tstg): -40°C to +110°C

2.2 Thermal Characteristics

Thermal resistance is a key parameter that indicates how effectively heat is transferred from the semiconductor junction to the environment. Lower values are better for thermal management.

• Junction-to-Ambient Thermal Resistance (RθJA): 45 °C/W (typical). Measured on an FR4 substrate (1.6mm thick) with a 16mm² copper pad.
• Junction-to-Solder Point Thermal Resistance (RθJS): 25 °C/W (typical). This lower value indicates a more direct thermal path from the chip to the PCB via the leads.
• Maximum Junction Temperature (Tj): 150 °C. The internal temperature of the semiconductor must not exceed this limit.

2.3 Electro-Optical Characteristics at 25°C

These parameters are measured under standard test conditions (Ta=25°C, IF=140mA) and define the core performance of the LED.

• Luminous Intensity (Iv): Ranges from 4.5 cd (minimum) to 11.2 cd (maximum), with a typical value within this range. Intensity is measured using a sensor filtered to match the CIE photopic eye-response curve.
• Viewing Angle (2θ½): 120 degrees (typical). This wide viewing angle indicates a Lambertian or near-Lambertian emission pattern, suitable for applications requiring broad illumination rather than a focused beam.
• Chromaticity Coordinates (Cx, Cy): Typical values are x=0.56, y=0.42. These coordinates on the CIE 1931 chromaticity diagram define the orange color point.
• Forward Voltage (VF): Ranges from 2.8V to 3.6V at 140mA, with a typical value of approximately 3.2V. Tolerance is ±0.1V within its specific bin.
• Reverse Current (IR): 10 µA (maximum) when a reverse voltage of 5V is applied. This test is for characterization only, as the device is not intended for reverse bias operation.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. The batch code format is Vf/Iv/Hue (e.g., 24/EA/A20).

3.1 Forward Voltage (Vf) Binning

LEDs are grouped by their forward voltage drop at the test current of 140mA.

• Bin 24: 2.8V ≤ Vf < 3.0V
• Bin 64: 3.0V ≤ Vf < 3.2V
• Bin A4: 3.2V ≤ Vf < 3.4V
• Bin E4: 3.4V ≤ Vf ≤ 3.6V

Tolerance within each bin is ±0.1V.

3.2 Luminous Intensity (Iv) Binning

LEDs are sorted based on their measured light output.

• Bin DA: 4.5 cd ≤ Iv < 5.6 cd (13.1 lm to 16.0 lm)
• Bin DB: 5.6 cd ≤ Iv < 7.1 cd (16.0 lm to 20.6 lm)
• Bin EA: 7.1 cd ≤ Iv < 9.0 cd (20.6 lm to 26.1 lm)
• Bin EB: 9.0 cd ≤ Iv ≤ 11.2 cd (26.1 lm to 32.5 lm)

Tolerance on each intensity bin is ±11%.

3.3 Color (Hue) Binning

LEDs are classified into specific quadrilaterals on the CIE chromaticity diagram to guarantee precise color consistency. The bins (A10, A20, B10, B20) define small, adjacent regions around the target orange color point (typical x=0.56, y=0.42). The tolerance for the (x, y) coordinates within each hue bin is ±0.01, ensuring a very tight color match for applications where uniform appearance is critical.

4. Mechanical and Package Information

4.1 Package Dimensions and Polarity

The device uses a standard surface-mount package. All dimensions are in millimeters with a general tolerance of ±0.2mm unless otherwise specified. A key design note is that the cathode lead frame is internally connected to the primary heat sink of the LED die. Proper identification of the cathode (typically marked on the package or indicated in the footprint) is therefore crucial not only for correct electrical connection but also for optimal thermal management. Mounting the device with an adequate thermal pad connected to the cathode is recommended to maximize heat dissipation.

4.2 Recommended PCB Attachment Pad Layout

A suggested land pattern (footprint) for infrared reflow soldering is provided to ensure reliable solder joint formation, proper self-alignment during reflow, and effective heat transfer from the cathode thermal pad to the PCB copper.

5. Assembly and Handling Guidelines

5.1 Soldering Process: IR Reflow Profile

The component is qualified for lead-free (Pb-free) soldering processes. The recommended reflow profile conforms to the J-STD-020 standard. Key parameters typically include:

• Preheat/Ramp-up: A controlled rise to activate flux and minimize thermal shock.
• Soak Zone: A period at an elevated temperature to ensure uniform heating of the component and board.
• Reflow Zone: Peak temperature must be high enough to form reliable solder joints but must not exceed the maximum temperature tolerance of the LED package (as defined in the absolute maximum ratings and moisture sensitivity level).
• Cooling Rate: A controlled cool-down to solidify the solder joints and minimize stress.

Adhering to this profile is essential to prevent damage from thermal stress or excessive temperature.

5.2 Cleaning

If post-assembly cleaning is required, only specified solvents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable. The use of unspecified or aggressive chemical cleaners can damage the epoxy lens or the package material, leading to reduced light output or premature failure.

5.3 Moisture Sensitivity and Storage

This product is classified as Moisture Sensitivity Level (MSL) 2 per JEDEC standard J-STD-020.

• Sealed Package: When stored in its original moisture-proof bag with desiccant, the shelf life is one year at ≤30°C and ≤70% RH.
• After Opening: Once the protective bag is opened, the components should be stored at ≤30°C and ≤60% RH. It is recommended to complete the IR reflow process within one year of opening.
• Extended Storage/Baking: For components stored out of their original packaging for over a year, a bake at approximately 60°C for at least 48 hours is recommended prior to soldering to remove absorbed moisture and prevent \"popcorning\" (package cracking) during reflow.

6. Packaging and Ordering

The standard packaging configuration is 1000 pieces per 7-inch reel. The components are supplied on 12mm wide embossed carrier tape sealed with a cover tape. The tape and reel dimensions comply with ANSI/EIA-481 specifications. For quantities less than a full reel, a minimum packing quantity of 500 pieces applies for remainder stock. The packaging ensures compatibility with automated assembly equipment feeders.

7. Application Notes and Design Considerations

7.1 Target Applications

This LED is specified for automotive accessory applications. This can include interior ambient lighting, dashboard indicator lights, switch backlighting, or exterior accent lighting where the robust qualification (AEC-Q101) is a requirement. It is not intended for safety-critical applications such as headlights, brake lights, or turn signals without prior consultation and additional qualification.

7.2 Circuit Design Considerations

• Current Driving: An LED is a current-driven device. A constant current source or a current-limiting resistor in series with a voltage source must be used to set the forward current (IF). The typical operating condition is 140mA, but it can be driven up to the maximum DC rating of 250mA with appropriate thermal design.
• Thermal Design: The power dissipated in the LED (Pd ≈ VF * IF) generates heat. Using the thermal resistance values (RθJA, RθJS), the designer can calculate the expected junction temperature rise above ambient (ΔTj = Pd * Rθ). The junction temperature (Tj = Ta + ΔTj) must be kept below 150°C. Maximizing the copper area connected to the cathode pad on the PCB is the most effective way to reduce RθJS and manage temperature.
• ESD Protection: While not explicitly stated in the provided datasheet excerpt, InGaN LEDs can be sensitive to electrostatic discharge (ESD). Standard ESD handling precautions should be observed during assembly.

7.3 Reliability and Lifetime

The qualification to AEC-Q101D involves a series of accelerated stress tests simulating automotive life cycles, including high-temperature operating life (HTOL), temperature cycling, and humidity resistance. This provides confidence in the device's reliability for use in the challenging automotive environment, where temperature extremes, vibration, and humidity are common. The luminous intensity and forward voltage characteristics will gradually shift over tens of thousands of hours of operation; the rate of this shift is highly dependent on maintaining the junction temperature as low as possible during operation.