PLCC-2 Cool White LED Datasheet - 3.1mm x 2.8mm x 1.9mm - Voltage 3.1V - Power 0.062W - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount LED utilizing a PLCC-2 (Plastic Leaded Chip Carrier) package. The device is engineered for reliability and performance in demanding environments, featuring a Cool White color temperature. Its primary design targets are automotive interior applications, where consistent light output, wide viewing angles, and robust construction are paramount. The LED is qualified to the AEC-Q102 standard for discrete optoelectronic semiconductors in automotive applications, ensuring it meets stringent quality and reliability requirements for temperature cycling, humidity resistance, and long-term operation.

The core advantages of this component include its compact form factor, excellent luminous efficiency for its package size, and a very wide 120-degree viewing angle, making it suitable for backlighting and indicator applications where light dispersion is important. It is also compliant with major environmental regulations including RoHS, REACH, and halogen-free standards, making it a suitable choice for modern electronic designs with strict material restrictions.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The key operational parameters are defined under a standard test condition of a forward current (I_F) of 20mA. The typical luminous intensity is 1800 millicandelas (mcd), with a minimum specified value of 900 mcd and a maximum up to 3550 mcd depending on the production bin. The forward voltage (V_F) typically measures 3.1V, with a range from 2.5V to 3.75V. This parameter is crucial for designing the current-limiting circuitry. The dominant wavelength is characterized by its CIE 1931 chromaticity coordinates, with typical x and y values around 0.3, defining its Cool White point. A tolerance of ±0.005 is applied to these coordinates.

The device features a wide viewing angle (2φ) of 120 degrees, defined as the off-axis angle where the luminous intensity drops to half of its peak value. This characteristic is vital for applications requiring even illumination over a broad area.

2.2 Absolute Maximum Ratings and Thermal Management

To ensure long-term reliability, the device must not be operated beyond its Absolute Maximum Ratings. The maximum continuous forward current is 30 mA, with a maximum power dissipation of 112 mW. For short pulses (≤10 μs, duty cycle 0.005), a surge current (I_FM) of 250 mA is permissible. The junction temperature (T_J) must never exceed 125°C. The operating and storage temperature range is specified from -40°C to +110°C, confirming its suitability for automotive environments.

Thermal management is critical for LED performance and lifespan. The datasheet specifies two thermal resistance values: the real thermal resistance (R_{th JS real}) from junction to solder point is a maximum of 130 K/W, while the electrical method derived value (R_{th JS el}) is 100 K/W. Proper PCB layout with adequate thermal relief and copper area is necessary to maintain a low solder point temperature, as shown in the forward current derating curve.

2.3 Reliability and Compliance Specifications

The LED demonstrates robust construction with an Electrostatic Discharge (ESD) withstand capability of 8 kV (Human Body Model, HBM). It is rated for Moisture Sensitivity Level (MSL) 3, indicating it can be exposed to factory floor conditions for up to 168 hours prior to reflow soldering. Furthermore, it meets Corrosion Robustness Class B1, enhancing its resistance to corrosive atmospheres. Full compliance with RoHS, EU REACH, and halogen-free standards (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm) is confirmed.

3. Performance Curve Analysis

3.1 IV Curve and Luminous Efficiency

The forward current vs. forward voltage (I-V) graph shows the characteristic exponential relationship. At the typical 20mA operating point, the voltage is approximately 3.1V. Designers use this curve to select appropriate driver components. The relative luminous intensity vs. forward current graph indicates that light output increases sub-linearly with current beyond the typical operating point, and operating above 30mA is not recommended. The forward current derating curve is essential for thermal design, showing how the maximum permissible continuous current must be reduced as the solder pad temperature increases above 25°C.

3.2 Temperature Dependence and Spectral Characteristics

The relative luminous intensity vs. junction temperature graph shows the expected decrease in light output as temperature rises, a common characteristic of LEDs. The relative forward voltage vs. junction temperature curve has a negative slope, which can be used in some circuits for temperature sensing. The chromaticity coordinate shift graphs versus both current and temperature show minimal variation, indicating good color stability under different operating conditions. The wavelength characteristics graph depicts the relative spectral power distribution, typical of a phosphor-converted white LED with a blue pump and broad yellow phosphor emission.

3.3 Pulse Operation Capability

The permissible pulse handling capability graph provides guidance for driving the LED with pulsed currents higher than the DC maximum. It plots forward current amplitude (I_FA) against pulse width (t_p) for various duty cycles (D). This allows designers to achieve higher instantaneous brightness for strobe or signaling applications without exceeding the average power limits.

4. Binning System Explanation

The product is available in sorted groups based on luminous intensity and chromaticity coordinates to ensure consistency in application design.

4.1 Luminous Intensity Binning

The luminous intensity is sorted into numerous bins designated by alphanumeric codes (e.g., L1, L2, M1... up to GA). Each bin defines a specific range of minimum and maximum luminous intensity measured in millicandelas (mcd). For this specific part number, the possible output bins are highlighted and include ranges from 1120 mcd to 3550 mcd (bins AA through CA), with the typical value of 1800 mcd falling within the BA bin (1800-2240 mcd). A measurement tolerance of ±8% applies.

4.2 Chromaticity Coordinate Binning

The Cool White color is sorted according to the CIE 1931 (x, y) coordinate system. The datasheet provides a table listing various bin codes (e.g., PK0, HK0, NK0) and their corresponding quadrilateral areas defined by four sets of (x, y) coordinates. This allows designers to select LEDs with tightly controlled color points for applications where color matching is critical, such as in dashboard clusters or backlit switches.

5. Mechanical, Packaging, and Assembly Information

5.1 Mechanical Dimensions and Polarity

The LED is housed in a standard PLCC-2 surface-mount package. The mechanical drawing (referenced in the PDF) specifies the exact dimensions, including overall length, width, height, lead spacing, and tolerances. The package typically features a molded lens. Polarity is indicated by a cathode mark, often a notch or a dot on the package, which must be aligned correctly with the PCB footprint.

5.2 Recommended PCB Footprint and Soldering

A recommended soldering pad layout is provided to ensure reliable solder joints and optimal thermal performance. This includes dimensions for the metal pads and the thermal pad (if present). The reflow soldering profile is specified, with a peak temperature of 260°C for a maximum of 30 seconds. Adherence to this profile is necessary to prevent package damage or degradation of the internal materials.

5.3 Packaging and Handling Precautions

The components are supplied in tape-and-reel packaging suitable for automated pick-and-place assembly machines. Precautions for use include standard ESD handling procedures (using grounded wrist straps and workstations), avoiding mechanical stress on the lens, and preventing contamination. Specific sulfur resistance test criteria may also be outlined for applications in environments with high sulfur content.

6. Application Guidelines and Design Considerations

6.1 Typical Application Scenarios

The primary application is automotive interior lighting. This includes backlighting for instrument clusters, infotainment system buttons, climate control panels, and general cabin ambient lighting. It is also suitable for backlighting switches in various electronic devices and general indicator purposes where a wide viewing angle and cool white light are desired.

6.2 Circuit Design and Thermal Considerations

Designers must implement a constant-current driver circuit to ensure stable light output and long LED life, as LED brightness is a function of current, not voltage. A series resistor can be used for simple applications, but an active driver is recommended for automotive voltage environments (e.g., 12V system). Thermal design is non-negotiable. The PCB must provide a sufficient thermal path from the LED's solder pads to a larger copper area or heatsink to keep the junction temperature well below the 125°C maximum, especially when operating at high ambient temperatures or near maximum current.

6.3 Optical Design Considerations

The 120-degree viewing angle means light is emitted in a wide Lambertian pattern. For applications requiring a more focused beam, secondary optics such as lenses or light guides must be employed. The interaction of the LED's emission pattern with these optical elements must be simulated or prototyped to achieve the desired illumination effect.

7. Technical Comparison and Selection Guidance

When selecting an LED for automotive interior applications, key differentiators for this part include its AEC-Q102 qualification, wide viewing angle, and specific luminous intensity bins. Compared to non-automotive grade LEDs, this component offers proven reliability under thermal shock, humidity, and long-term operational stress. The PLCC-2 package offers a good balance between size, light output, and ease of assembly compared to smaller chip-scale packages or larger through-hole devices.

8. Frequently Asked Questions (FAQs)

Q: What is the purpose of the binning information?
A: Binning ensures color and brightness consistency within a production batch. For applications using multiple LEDs side-by-side (like a backlight panel), specifying a tight bin for luminous intensity and chromaticity coordinates prevents visible differences in brightness or color between individual LEDs.

Q: Can I drive this LED directly from a 5V or 12V supply?
A: No. LEDs are current-driven devices. Connecting it directly to a voltage source higher than its forward voltage will cause excessive current to flow, potentially destroying it instantly. You must always use a current-limiting mechanism, such as a resistor or a dedicated LED driver IC.

Q: Why is the thermal resistance specification important?
A: Thermal resistance quantifies how effectively heat can escape from the LED junction. A lower value means better heat dissipation. Exceeding the maximum junction temperature significantly reduces luminous output and drastically shortens the LED's operational lifespan. Proper heat sinking, as guided by the thermal resistance and derating curve, is essential for reliable performance.

Q: What does MSL 3 mean for storage and handling?
A: MSL (Moisture Sensitivity Level) 3 means the package can absorb damaging levels of moisture if exposed to ambient conditions for more than 168 hours (7 days). After this time, or if the original sealed bag is opened, the components must be baked according to a specified profile before they can be safely reflow soldered to prevent "popcorning" or internal delamination.

9. Operational Principles

This is a phosphor-converted white LED. The core semiconductor chip emits blue light when forward biased (electroluminescence). This blue light strikes a layer of yellow (or yellow and red) phosphor material deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broader spectrum of longer wavelengths (yellow, red). The combination of the remaining blue light and the phosphor-converted light results in the perception of white light. The exact ratio of blue to phosphor emission determines the correlated color temperature (CCT), in this case, Cool White.

10. Industry Trends and Context

The trend in automotive interior lighting is towards higher integration, dynamic lighting, and personalized ambient experiences. While discrete LEDs like this PLCC-2 component remain vital for switch backlighting and basic indicators, there is a growing adoption of flexible LED strips, addressable RGB LEDs, and advanced light guide technologies for creating seamless light surfaces. Furthermore, the demand for higher efficiency (more lumens per watt) and improved color rendering index (CRI) continues, pushing advancements in phosphor technology and chip design. The stringent automotive qualifications (AEC-Q102) and environmental compliance (halogen-free) highlighted in this datasheet reflect the industry's overarching focus on reliability, longevity, and environmental responsibility.