PLCC-2 Super Red LED Datasheet - 2.0x1.25x0.8mm - Voltage 2.0V - Power 40mW - English Technical Document

1. Product Overview

This document details the technical specifications for a high-brightness, surface-mount Super Red LED in a PLCC-2 (Plastic Leaded Chip Carrier) package. Designed primarily for demanding automotive interior applications, this component combines reliable performance with industry-standard compliance. Its compact form factor and robust construction make it suitable for space-constrained yet critical lighting functions within vehicle cabins.

The LED's core advantages include a wide 120-degree viewing angle for uniform illumination, a typical luminous intensity of 600 millicandelas (mcd) at a standard 20mA drive current, and compliance with stringent automotive and environmental standards such as AEC-Q102, RoHS, REACH, and halogen-free requirements. This combination positions it as a dependable choice for designers seeking longevity and performance in automotive environments.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The key operational parameters define the LED's performance envelope. The forward current (IF) has a typical operating point of 20mA, with a minimum of 5mA and an absolute maximum rating of 50mA. At 20mA, the typical forward voltage (VF) is 2.0V, ranging from a minimum of 1.75V to a maximum of 2.75V. This low voltage operation contributes to efficient power usage.

The primary photometric output is characterized by a luminous intensity (IV) of 600 mcd (typical), with a minimum of 450 mcd and a maximum reaching 1120 mcd under the standard test condition. The light emission is in the Super Red spectrum, with a dominant wavelength (λd) typically at 630 nm, varying between 627 nm and 639 nm. The wide viewing angle of 120 degrees (±5° tolerance) ensures broad, even light distribution, which is crucial for panel and indicator lighting.

2.2 Thermal and Absolute Maximum Ratings

Thermal management is critical for LED longevity. The device features two thermal resistance values: a real thermal resistance (Rth JS real) of 160 K/W (max) and an electrical thermal resistance (Rth JS el) of 125 K/W (max). These values indicate the temperature rise per watt of power dissipated from the junction to the solder point.

The absolute maximum ratings define the operational limits that must not be exceeded to prevent permanent damage. The maximum power dissipation (Pd) is 137 mW. The device can withstand a surge current (IFM) of 100 mA for pulses ≤ 10 μs with a very low duty cycle (0.005). The junction temperature (TJ) must not exceed 125°C, while the operating and storage temperature range is specified from -40°C to +110°C, confirming its suitability for automotive applications. The ESD sensitivity (HBM) is rated at 2 kV.

3. Performance Curve Analysis

3.1 Spectral and Current-Voltage Relationship

The relative spectral distribution graph shows a narrow, peaked emission curve centered around 630 nm, which is characteristic of a high-purity red LED. The forward current versus forward voltage (IF-VF) curve demonstrates the diode's exponential characteristic. The relative luminous intensity versus forward current graph shows a near-linear increase in light output with current up to the typical 20mA point, with a gradual roll-off at higher currents due to increased thermal effects.

3.2 Temperature Dependency

The performance relative to temperature is a key design consideration. The graph of relative luminous intensity versus junction temperature shows a negative correlation; as temperature increases, light output decreases. This is a typical behavior for LEDs. Conversely, the forward voltage shows a negative temperature coefficient, decreasing linearly as junction temperature rises. The dominant wavelength also shifts with temperature, typically increasing (a red shift) as the junction gets hotter. These curves are essential for designing circuits with temperature compensation to maintain consistent brightness and color.

3.3 Derating and Pulse Operation

The forward current derating curve is crucial for reliability. It dictates the maximum permissible continuous forward current based on the solder pad temperature (TS). For example, at a solder pad temperature of 110°C, the maximum allowed continuous current is 35mA. The graph also specifies a minimum operating current of 5mA. The permissible pulse handling capability chart provides guidance for pulsed operation, showing the allowable peak pulse current for various pulse widths and duty cycles, which is useful for multiplexing or PWM dimming applications.

4. Binning System Explanation

The LED is sorted into bins based on three key parameters to ensure consistency in production runs and for design matching.

4.1 Luminous Intensity Binning

The luminous intensity is categorized into alphanumeric bins ranging from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). For this specific part number (65-21-SR0200H-AM), the possible output bins are highlighted and fall within the U1 (450-560 mcd) and U2 (560-710 mcd) ranges, aligning with the typical 600 mcd specification. This allows designers to select parts with tighter brightness tolerances if required.

4.2 Dominant Wavelength Binning

The dominant wavelength is binned using a four-digit code. The bins cover a broad spectrum from 459 nm to 639 nm. The relevant bins for this Super Red LED are highlighted in the 627-639 nm range, specifically covering codes 2730 (627-630 nm), 3033 (630-633 nm), 3336 (633-636 nm), and 3639 (636-639 nm). This ensures color consistency across different production batches.

4.3 Forward Voltage Binning

Forward voltage is binned using a four-digit code representing the minimum and maximum voltage in tenths of a volt. Bins range from 1012 (1.00-1.25V) to 2730 (2.70-3.00V). For this LED with a typical VF of 2.0V, the relevant bins are likely 1720 (1.75-2.00V) and 2022 (2.00-2.25V). Matching voltage bins can simplify current-limiting circuit design in parallel arrays.

5. Mechanical and Package Information

The LED is housed in a standard PLCC-2 surface-mount package. The mechanical drawing (implied by the "Mechanical Dimension" section reference) would typically show a package with two leads on opposite sides. Critical dimensions include the overall length, width, and height, lead spacing, and the size/position of the molded lens. The package is designed for compatibility with automated pick-and-place and reflow soldering processes commonly used in high-volume electronics manufacturing.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The datasheet specifies a reflow soldering temperature of 260°C maximum for 30 seconds. This refers to the peak temperature measured at the leads/solder joints. A recommended reflow profile would typically be provided, outlining the preheat, soak, reflow, and cooling stages to prevent thermal shock and ensure reliable solder joints without damaging the LED's internal structure or epoxy lens.

6.2 Recommended Soldering Pad Layout

A recommended solder pad footprint is provided to ensure proper mechanical stability and solder fillet formation. This pad design optimizes the solder joint's strength and thermal transfer path from the LED's thermal pad (if present) or leads to the printed circuit board (PCB). Following this layout is essential for manufacturing yield and long-term reliability.

6.3 Precautions for Use

General precautions include avoiding the use of sharp tools during handling to prevent damage to the lens or leads. Storage should be in a dry, anti-static environment as per the MSL (Moisture Sensitivity Level) 3 rating, which requires baking the components if they have been exposed to ambient conditions beyond their floor life before reflow soldering. Direct exposure to high-intensity UV light or certain chemicals should also be avoided.

7. Application Suggestions

7.1 Typical Application Scenarios

As indicated in the PDF, the primary application is Automotive Interior Lighting. This includes illumination for dashboard switches, door handles, gear shift indicators, audio system controls, and ambient lighting. The second key application is Cluster lighting, referring to instrument clusters or dashboard gauges, where consistent, reliable backlighting for icons, needles, and warning symbols is required.

7.2 Design Considerations

When designing with this LED, consider the following: Always use a series current-limiting resistor or a constant-current driver to set the forward current, typically at 20mA for nominal brightness. Account for the forward voltage bin and its tolerance when calculating the resistor value or driver output voltage. Consider thermal management, especially in enclosed spaces or high ambient temperatures; use the derating curve to adjust the maximum drive current. For uniform lighting across multiple LEDs, select components from the same or adjacent luminous intensity and wavelength bins. The wide viewing angle reduces the need for secondary optics in many diffuse lighting applications.

8. Technical Comparison and Differentiation

Compared to generic non-automotive PLCC-2 LEDs, this component's key differentiators are its formal qualifications. The AEC-Q102 qualification signifies it has passed a suite of stress tests defined for discrete optoelectronic devices in automotive applications, including high-temperature operating life, temperature cycling, and humidity resistance. The Corrosion Robustness Class B1 rating indicates enhanced resistance to corrosive gases like sulfur, which can be present in some automotive environments. The combination of a wide 120-degree viewing angle and a typical intensity of 600mcd offers a good balance of brightness and dispersion for interior applications.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA for more brightness?
A: While the absolute maximum rating is 50mA, the typical operating current is 20mA. Driving at 30mA is possible but will increase junction temperature and accelerate lumen depreciation. You must consult the derating curve based on your application's solder pad temperature to ensure the junction temperature stays below 125°C.

Q: What is the difference between real and electrical thermal resistance?
A: Real thermal resistance (Rth JS real) is measured using a physical temperature sensor. Electrical thermal resistance (Rth JS el) is calculated using the LED's forward voltage temperature coefficient. For design purposes, the more conservative (higher) value, 160 K/W in this case, should be used for worst-case thermal analysis.

Q: Is a reverse protection diode necessary?
A: The datasheet states the device is "Not designed for reverse operation." Applying a reverse voltage can damage it. In circuits where reverse voltage is possible (e.g., in automotive load-dump scenarios), external protection such as a series diode or a TVS diode is strongly recommended.

10. Practical Design Case

Consider designing a backlight for an automotive climate control panel with 10 identical indicators. Each indicator uses one LED. The supply voltage is the vehicle's 12V nominal system. To ensure longevity, the design targets a solder pad temperature of 85°C maximum. From the derating curve, at 85°C, the maximum continuous current is approximately 45mA. Choosing a safe operating point of 15mA per LED provides a margin and reduces thermal stress. With a typical VF of 2.0V, the required series resistor value for each LED on a 12V supply is (12V - 2.0V) / 0.015A = 667 Ω (use 680 Ω standard value). The power dissipation per resistor is (10V)^2 / 680Ω ≈ 0.147W, so a 1/4W resistor is sufficient. To ensure color and brightness uniformity, specify LEDs from the same luminous intensity bin (e.g., U1) and dominant wavelength bin (e.g., 2730) during procurement.

11. Operating Principle

This is a light-emitting diode (LED), a semiconductor p-n junction device. When a forward voltage exceeding the junction's built-in potential is applied, electrons and holes are injected across the junction. As these charge carriers recombine, energy is released in the form of photons (light). The specific material composition of the semiconductor layers (typically based on Aluminum Gallium Arsenide - AlGaAs for red LEDs) determines the wavelength (color) of the emitted light. The PLCC-2 package encapsulates the semiconductor chip, provides mechanical protection, incorporates a molded epoxy lens that shapes the light output to achieve the 120-degree viewing angle, and offers leads for electrical connection and thermal dissipation.

12. Industry Trends

The trend in automotive interior lighting continues towards higher integration, smarter control, and enhanced user experience. LEDs are increasingly used not just for functionality but for ambiance and branding. This drives demand for LEDs with higher efficiency (more lumens per watt), tighter color and brightness binning for consistent appearance, and enhanced reliability metrics to match longer vehicle warranties. There is also a growing integration of LEDs with built-in drivers or control ICs (like iC-LEDs) to simplify circuit design and enable advanced features like individual addressability for dynamic lighting effects. The component described here, with its automotive qualifications and consistent performance, fits into the foundational layer of this evolving ecosystem, providing the reliable raw light source for both simple and complex lighting systems.