Red LED 3.0x3.0x0.55mm SMD Specification - Forward Voltage 2.0-2.6V - Luminous Flux 93.2-130lm - Dominant Wavelength 617.5-625nm - English Technical Datasheet

1. Product Overview

This document provides the complete technical specification for a high-brightness red surface-mount device (SMD) LED. The device is engineered for demanding applications, particularly in the automotive sector, where reliability, performance, and consistency are paramount. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip, which is known for producing efficient and stable red light emission. The product is housed in a compact 3.0mm x 3.0mm x 0.55mm EMC (Epoxy Molding Compound) package, offering a robust solution for automated assembly processes.

1.1 Core Advantages and Target Market

The primary target market for this LED is automotive lighting, encompassing both interior and exterior applications. Its core advantages stem from its design and material composition. The EMC package provides excellent thermal stability and resistance to environmental factors like humidity and temperature cycling, which are critical for automotive electronics. The extremely wide 120-degree viewing angle ensures uniform light distribution. Furthermore, compliance with AEC-Q102 stress test qualification guidelines for automotive-grade discrete semiconductors underscores its suitability for the rigorous operating conditions found in vehicles.

2. In-Depth Technical Parameter Analysis

A thorough understanding of the electrical and optical characteristics is essential for proper circuit design and system integration.

2.1 Electrical and Optical Characteristics

The key parameters are measured at a standard junction temperature (Ts) of 25°C. The forward voltage (VF) ranges from a minimum of 2.0V to a maximum of 2.6V at a test current of 700mA, with a typical value that designers can use for initial calculations. The luminous flux (Φ) output is significant, ranging from 93.2 lumens to 130 lumens under the same 700mA drive condition, indicating high efficiency for a red LED. The dominant wavelength (Wd) specifies the perceived color, falling within the red spectrum between 617.5nm and 625nm. The device features a very low reverse current (IR) of less than 10µA at 5V reverse bias, and a thermal resistance (RTHJ-S) from junction to solder point of 14°C/W, which is crucial for thermal management calculations.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. The absolute maximum forward current (IF) is 840mA DC, with a peak forward current (IFP) of 1000mA allowed under pulsed conditions (1/10 duty cycle, 10ms pulse width). The maximum power dissipation (PD) is 2184mW. The device can withstand a reverse voltage (VR) of up to 5V. The operating and storage temperature range is wide, from -40°C to +125°C, with a maximum junction temperature (TJ) of 150°C. The electrostatic discharge (ESD) withstand level is 2000V (Human Body Model), though proper ESD handling precautions are still necessary as the yield at this level is over 90%.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters measured at IF=700mA.

3.1 Forward Voltage and Luminous Flux Binning

The forward voltage is binned into three codes: C0 (2.0-2.2V), D0 (2.2-2.4V), and E0 (2.4-2.6V). The luminous flux is binned into three codes: RB (93.2-105 lm), SA (105-117 lm), and SB (117-130 lm). The dominant wavelength is binned into D2 (617.5-620 nm), E1 (620-622.5 nm), and E2 (622.5-625 nm). A complete product order code would specify one bin from each of these categories, allowing designers to select LEDs with tightly matched performance for their application.

4. Performance Curve Analysis

While the PDF indicates the presence of typical optical characteristic curves (Fig. 1-7 onwards), the specific graphs for forward voltage vs. forward current, luminous flux vs. forward current, and spectral distribution are not provided in the extracted text. In a full datasheet, these curves are critical. They would typically show how VF increases with IF, how luminous output increases with current before potentially saturating or decreasing at high currents/junction temperatures, and the narrow spectral peak characteristic of AlGaInP LEDs. Designers use these curves to optimize drive current for efficiency and output, and to understand color shift with temperature.

5. Mechanical and Package Information

5.1 Package Dimensions and Drawings

The LED has a footprint of 3.0mm x 3.0mm with a height of 0.55mm. Detailed top, side, and bottom views are provided. All dimension tolerances are ±0.05mm unless otherwise specified. The bottom view clearly shows the anode and cathode pad layout, which is essential for correct PCB footprint design and orientation during placement.

5.2 Polarity Identification and Recommended Solder Pad Pattern

The polarity is clearly marked. The recommended solder pad pattern (land pattern) is provided to ensure reliable soldering and proper thermal connection to the PCB. Adhering to this pattern helps achieve good solder fillets and minimizes stress on the component during thermal cycling.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The product is suitable for all standard SMT assembly and solder processes. The PDF contains a dedicated section for reflow soldering instructions, which would typically include a recommended reflow profile with specific temperature zones (preheat, soak, reflow peak, cooling), maximum peak temperature, and time above liquidus. This ensures the EMC package and internal bonds are not damaged by excessive heat during assembly.

6.2 Handling and Storage Precautions

The LED has a Moisture Sensitivity Level (MSL) of Level 2. This means the package can be exposed to factory floor conditions (30°C/60% RH) for up to one year before it requires baking prior to reflow soldering. After the bag is opened, it must be soldered within 168 hours (1 week) under the same conditions. Products must be stored in their original moisture-barrier bags with desiccant. Standard ESD precautions should be observed during handling.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are supplied on tape and reel for automated pick-and-place machines. Specifications for the carrier tape dimensions (pocket size, pitch), reel dimensions (diameter, width), and label format are provided in the document. This information is necessary for configuring assembly line equipment.

7.2 Packaging and Reliability

The packaging includes moisture-resistant barrier bags, cardboard boxes, and labels containing lot code, quantity, and part number. A comprehensive reliability test plan based on AEC-Q102 is referenced, including tests like high-temperature storage, temperature cycling, damp heat, and solder heat resistance. Specific test items, conditions, and criteria for judging failure (e.g., allowable changes in forward voltage or luminous flux) are detailed to assure long-term performance.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

The primary application is automotive lighting. This includes exterior functions like rear combination lamps (tail lights, brake lights), center high-mount stop lights (CHMSL), and side marker lights. Interior applications include dashboard backlighting, switch illumination, and ambient lighting. Its high brightness and reliability also make it suitable for other transportation, industrial indicator, and signage applications.

8.2 Critical Design Considerations

• Thermal Management: The maximum forward current must be derated based on the actual operating junction temperature, which must not exceed 150°C. The thermal resistance of 14°C/W means that for every watt dissipated, the junction will be 14°C hotter than the solder point. Adequate PCB copper area (thermal pad) and possibly a heatsink are required for high-current operation.
• Current Driving: LEDs are current-driven devices. A constant-current driver circuit is recommended to maintain stable light output and color, regardless of variations in forward voltage. The driver should be designed to stay within the absolute maximum ratings.
• Optical Design: The 120-degree viewing angle is intrinsic to the package. Secondary optics (lenses, reflectors) may be needed to collimate or shape the light beam for specific applications.

9. Technical Comparison and Differentiation

Compared to standard plastic SMD LEDs, this EMC package offers superior thermal performance and resistance to high-temperature and high-humidity environments, which is a key differentiator for automotive use. The AEC-Q102 qualification is a formal testament to this robustness, going beyond typical commercial-grade specifications. The combination of high luminous flux (up to 130 lm) from a small 3x3mm footprint at 700mA is also a competitive advantage for space-constrained, high-brightness applications.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the recommended operating current?

The datasheet specifies characteristics at 700mA and absolute maximum DC current at 840mA. The recommended operating current depends on the thermal design of your application. For reliable long-term operation, it is advisable to drive the LED at or below 700mA unless exceptional cooling is provided, to keep the junction temperature well below its maximum limit.

10.2 How do I select the right bin for my application?

For applications requiring color consistency (e.g., a multi-LED array), specify a tight dominant wavelength bin (e.g., E1 only). For applications requiring consistent brightness, specify a tight luminous flux bin (e.g., SB only). For power supply design, specifying a forward voltage bin (e.g., D0) can help optimize driver efficiency. Often, a combination is specified.

10.3 Can I use this LED for pulsed operation?

Yes, the datasheet allows a peak forward current (IFP) of 1000mA under pulsed conditions (10ms pulse width, 1/10 duty cycle). This can be used to achieve higher instantaneous brightness than possible with DC operation, but the average power dissipation must still not exceed the maximum rating, and the junction temperature must be managed.

11. Practical Design and Usage Case

Case: Designing a High-Brightness Automotive Brake Light Cluster. A designer is creating a new LED-based high-mounted stop light. They need high brightness for daytime visibility and must meet automotive reliability standards. They select this LED in the SB (highest flux) and E1 (specific red hue) bins. They design a PCB with a large thermal copper pad connected to vias to dissipate heat to other layers. A constant-current driver is selected to provide 700mA per LED. The reflow profile is set according to the datasheet's SMT instructions. After assembly, the cluster undergoes temperature cycling tests to validate the design's robustness, leveraging the LED's inherent AEC-Q102-qualified reliability.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of AlGaInP. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light, in this case, in the 617-625 nm red range. The EMC package encapsulates the chip, provides mechanical protection, and incorporates a phosphor-free lens to shape the light output.

13. Technology Trends and Context

AlGaInP technology is mature and highly optimized for red, orange, and amber LEDs, offering excellent efficiency and stability. The trend in automotive and high-reliability LEDs is towards higher power density and greater efficiency (more lumens per watt) from the same or smaller package sizes. This drives advancements in chip design, package materials (like advanced EMC or ceramic substrates), and thermal management techniques. Furthermore, integration with intelligent drivers and sensors for adaptive lighting systems is an ongoing development. This product sits within this trend, offering a robust, high-performance solution for traditional lighting functions that is compatible with modern automated manufacturing and stringent quality requirements.