LED PLCC4 Red 3.5x2.8x1.85mm 1.8-2.4V 0.168W Specification Datasheet - English Technical Document

1. Product Overview

The RF-RSRA30TS-CD-G is a high-performance red LED in a PLCC4 package, designed for demanding automotive lighting applications. With dimensions of 3.50mm x 2.80mm x 1.85mm, this SMD component delivers exceptional brightness and reliability. The device utilizes AlGaInP (Aluminum Gallium Indium Phosphide) epitaxial technology on a substrate, ensuring efficient light emission at a dominant wavelength range of 627.5nm to 637.5nm. Key advantages include an extremely wide viewing angle of 120°, compliance with AEC-Q101 stress test qualification for automotive-grade discrete semiconductors, and a moisture sensitivity level of 2. The LED is ROHS and REACH compliant, making it suitable for global markets.

Target applications include automotive interior and exterior lighting systems such as dashboard indicators, interior ambient lighting, brake lights, and turn signals. The robust package supports all standard SMT assembly and reflow soldering processes, and is available on tape and reel for automated manufacturing.

2. Technical Parameter Interpretation

2.1 Electrical Characteristics (Ts=25°C)

The forward voltage (VF) at a test current of 50mA is specified with a minimum of 1.8V, typical 2.2V, and maximum 2.4V. This relatively low forward voltage allows for efficient power utilization in automotive 12V systems when combined with appropriate current-limiting resistors. The reverse current (IR) at VR=5V is less than 10µA, indicating excellent junction integrity. The absolute maximum ratings indicate a maximum forward current of 70mA DC and peak forward current of 100mA (at 1/10 duty cycle, 10ms pulse width), providing headroom for pulsed operation. Power dissipation is limited to 168mW, and the junction temperature must not exceed 120°C.

2.2 Optical Characteristics (IF=50mA)

Luminous intensity (IV) ranges from 1200mcd (minimum) to 2800mcd (maximum), with a typical value of 1800mcd. This high brightness enables visibility in direct sunlight. The dominant wavelength (Wd) is tightly binned from 627.5nm to 637.5nm, ensuring color consistency across batches. The viewing angle (2θ1/2) is typically 120°, providing wide illumination coverage suitable for signage and ambient lighting. Thermal resistance (RTHJ-S) is rated at 150°C/W maximum, which must be considered in thermal management design.

2.3 Absolute Maximum Ratings

Operating temperature range is -40°C to +100°C, and storage temperature range is also -40°C to +100°C. Electrostatic discharge (ESD) withstand capability is 2000V (HBM), with over 90% yield at this level, but ESD protection during handling is still recommended. The device is qualified under AEC-Q101 guidelines for automotive discrete semiconductors.

3. Binning System

The product is sorted into bins for forward voltage, luminous intensity, and dominant wavelength to ensure tight performance consistency.

3.1 Forward Voltage Bins (IF=50mA)

Six bins are defined: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V). This fine granularity allows customers to select devices matching their driver circuit design.

3.2 Luminous Intensity Bins (IF=50mA)

Four bins: M1 (1200-1500mcd), M2 (1500-1800mcd), N1 (1800-2300mcd), N2 (2300-2800mcd). Higher bins provide brighter output, enabling design flexibility.

3.3 Dominant Wavelength Bins (IF=50mA)

Four bins: F2 (627.5-630nm), G1 (630-632.5nm), G2 (632.5-635nm), H1 (635-637.5nm). Tight wavelength control ensures uniform color appearance in multi-LED arrays.

4. Performance Curve Analysis

The datasheet provides several typical curves at Ts=25°C (unless otherwise noted) to guide design:

• Forward Voltage vs. Forward Current (Fig. 1-7): The curve shows a nonlinear relationship typical of LEDs. At 1.8V current is near zero; at 2.2V current reaches ~50mA; at 2.4V current exceeds 70mA. Designers must use current-limiting resistors or constant-current drivers.
• Forward Current vs. Relative Intensity (Fig. 1-8): Relative intensity increases roughly linearly with forward current from 0 to 70mA, reaching ~120% at 70mA relative to the 50mA reference. This allows dimming via PWM.
• Solder Temperature vs. Relative Intensity (Fig. 1-9): As the solder point temperature (Ts) rises from 20°C to 120°C, relative luminous flux decreases to about 80% at 120°C. Thermal management is critical to maintain light output.
• Solder Temperature vs. Forward Current (Fig. 1-10): The maximum permissible forward current must be derated as ambient temperature increases. At Ts=100°C, the recommended maximum current is approximately 40mA (versus 70mA at 25°C).
• Forward Voltage vs. Solder Temperature (Fig. 1-11): Forward voltage decreases with increasing temperature at a rate of about -2mV/°C, which helps prevent thermal runaway in constant-voltage designs but must be accounted for in constant-current circuits.
• Radiation Diagram (Fig. 1-12): The angular intensity distribution is nearly Lambertian with a half-angle of ±60°, confirming the 120° viewing angle. Relative intensity drops to 50% at ±60°.
• Forward Current vs. Dominant Wavelength (Fig. 1-13): As current increases from 0 to 70mA, dominant wavelength shifts slightly towards longer wavelengths (red-shift) by about 2nm. This effect is minimal (<1nm) for currents near the test condition.
• Spectrum Distribution (Fig. 1-14): The spectral power distribution peaks around 630nm with a narrow FWHM (full width at half maximum) of approximately 20nm, characteristic of AlGaInP red LEDs.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED measures 3.50mm x 2.80mm x 1.85mm (length x width x height). A polarity mark is indicated on the top view. The bottom view shows four terminals: pin 1 (Anode), pin 2 (Cathode), and two additional leads (pins 3 and 4 are not connected or may serve as mechanical supports). The recommended soldering pattern (footprint) dimensions are provided: 2.60mm (width) x 1.60mm (height) for each pad, with 4.60mm overall width. All dimensions have a tolerance of ±0.2mm unless otherwise noted.

5.2 Carrier Tape and Reel Specifications

The LED is supplied in carrier tape with a pitch of 4.00mm, width 8.0mm, and pocket dimensions of 3.50mm x 3.50mm. Each reel holds 2000 pieces. The reel has a diameter of 330mm ±1mm, hub diameter 100mm ±1mm, and a width of 13.0mm±0.5mm. A label on the reel indicates part number, lot number, bin code, and quantity.

5.3 Moisture Resistant Packaging

The LEDs are packed in a moisture barrier bag with desiccant and a humidity indicator card to maintain moisture level before opening. Storage conditions: before opening, store at ≤30°C and ≤75%RH for up to one year; after opening, use within 24 hours at ≤30°C and ≤60%RH. If not used within 24 hours, bake at 60±5°C for >24 hours.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile is based on JEDEC standards. Key parameters: preheat from 150°C to 200°C in 60-120 seconds; ramp-up rate ≤3°C/s; time above 217°C (TL) should not exceed 60 seconds; peak temperature (TP) 260°C with a maximum time within 5°C of peak of 10 seconds; cool-down rate ≤6°C/s. Total time from 25°C to peak should be ≤8 minutes. Reflow soldering should not be done more than twice. If more than 24 hours elapse between soldering cycles, the LEDs may be damaged due to moisture absorption.

6.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron at ≤300°C for less than 3 seconds, and only one time. Repair after reflow is not recommended. If unavoidable, use a double-head soldering iron and confirm no damage to the LED characteristics.

6.3 Handling Precautions

The LED encapsulant is silicone, which is soft. Do not apply excessive pressure on the lens surface during pick-and-place or handling. Avoid mounting on warped PCBs. Do not apply mechanical stress or vibration during cooling after soldering. Rapid cooling is not recommended. Sulfur content in the mating materials must not exceed 100PPM; bromine and chlorine each <900PPM, total <1500PPM. Volatile organic compounds (VOCs) from fixture materials can discolor the silicone; use compatible adhesives.

7. Packaging and Ordering Information

Standard packaging: 2000 LEDs per reel. The reel is placed in a moisture barrier bag with label, then packed in a cardboard box. The label includes part number, spec number, lot number, bin code (luminous flux, chromaticity, forward voltage, wavelength), quantity, and date. For ordering, the full part number RF-RSRA30TS-CD-G is used. Custom bin selections may be available upon request.

8. Application Recommendations

This red LED is ideally suited for automotive interior and exterior lighting. In interior applications (e.g., dashboard indicators, ambient lighting), the wide viewing angle ensures uniform illumination. In exterior applications (e.g., brake lights, turn signals), the high luminous intensity (up to 2800mcd) provides necessary brightness. Designers should incorporate thermal management to keep the junction temperature below 120°C. Use constant-current drivers with appropriate current-limiting resistors. For pulsed operation (e.g., PWM dimming), the peak forward current can be up to 100mA at low duty cycles. Ensure ESD protection during assembly and handling.

9. Technical Comparison

Compared to standard epoxy-encapsulated red LEDs, this PLCC4 device offers a wider viewing angle (120° vs typical 90°) and higher reliability for automotive environments. The AEC-Q101 qualification differentiates it from commercial-grade LEDs, guaranteeing performance under thermal cycling, high temperature, and humidity. The silicone encapsulation provides better resistance to thermal stress and UV degradation than epoxy. The tight binning (0.1V steps for VF, 300-500mcd steps for IV, 2.5nm steps for wavelength) ensures superior color and brightness consistency across production batches.

10. Frequently Asked Questions

Q: What is the recommended forward current for this LED?
A: The test current is 50mA, but the absolute maximum DC current is 70mA. For extended lifetime, 50mA is recommended. For pulsed operation, up to 100mA at 10% duty cycle (10ms pulse) is allowed.

Q: Can this LED be used in outdoor automotive applications?
A: Yes. It is qualified under AEC-Q101 for automotive use, with an operating temperature range of -40°C to +100°C, suitable for exterior lighting.

Q: Do I need to bake the LEDs before use?
A: Only if the moisture barrier bag has been opened for more than 24 hours, or if the humidity indicator shows excessive moisture. Baking at 60±5°C for >24 hours is recommended.

Q: How do I select the correct bin for my application?
A: Use the binning tables. For a consistent red color, choose one wavelength bin (e.g., G1 630-632.5nm). For brightness, select M2 or higher. Match the voltage bin to your driver output.

11. Design Case Study: Automotive Interior Ambient Lighting

Consider a design for a car's center console ambient lighting strip using 10 LEDs. Each LED is driven at 50mA (typical). With a forward voltage of 2.2V, total forward voltage for the strip (if series-connected) would be 22V, requiring a boost converter from a 12V battery. Alternatively, using 5 parallel strings of 2 LEDs each, each string voltage ~4.4V, with current-limiting resistors. Thermal analysis: total power dissipation = 10 * 50mA * 2.2V = 1.1W. If ambient is 85°C, junction temperature rise = power * thermal resistance (150°C/W) per LED = 0.11W * 150°C/W = 16.5°C, junction temp = 101.5°C (<120°C). Ensure PCB copper area for heat spreading. The wide 120° viewing angle ensures uniform light distribution without secondary optics.

12. Principle of Operation

This red LED uses an AlGaInP (Aluminum Gallium Indium Phosphide) multiple quantum well (MQW) structure grown on a substrate (typically GaAs or transparent substrate). The active layer emits light via electron-hole recombination when forward biased. The wavelength is determined by the bandgap of the AlGaInP material, which is tuned by the aluminum and indium composition. The PLCC4 package provides a reflective cavity to enhance light extraction, and the silicone lens shapes the radiation pattern to the specified 120° viewing angle.

13. Development Trends

Automotive LED technology continues to advance toward higher luminous efficacy (lm/W) and better thermal management. For red LEDs, improvements in AlGaInP epitaxy have increased efficiency, and new packaging designs (e.g., chip-scale packages) enable smaller form factors. The trend towards adaptive lighting and matrix LED headlamps demands tighter binning and higher reliability. Additionally, the adoption of AEC-Q102 (more stringent than Q101) is emerging. This LED's compliance with AEC-Q101 positions it well for current automotive designs, and future versions may include integrated ESD protection and higher current capabilities.