SMD LED Orange 609nm Datasheet - 3.2x1.6x1.4mm - Forward Voltage 1.7-2.5V - Power 75mW - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness, surface-mount Orange LED. Designed for automated assembly processes, this component is suitable for a wide range of space-constrained electronic applications requiring reliable status indication or backlighting.

1.1 Core Advantages

• Compliant with RoHS environmental standards.
• Packaged on 8mm tape within 7-inch reels for efficient automated pick-and-place assembly.
• Standardized EIA package footprint ensures design compatibility.
• Logic-level compatible drive requirements.
• Designed to withstand standard infrared (IR) reflow soldering profiles.
• Preconditioned to JEDEC Moisture Sensitivity Level 3 for reliability.

1.2 Target Markets

This LED is engineered for integration into telecommunications equipment, office automation devices, home appliances, and industrial control systems. Its primary functions include status indication, symbolic illumination, and front-panel backlighting.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Operating conditions must not exceed these limits to prevent permanent device damage.

• Power Dissipation (Pd): 75 mW maximum.
• Peak Forward Current (I_F(PEAK)): 80 mA (pulsed at 1/10 duty cycle, 0.1ms pulse width).
• Continuous Forward Current (I_F): 30 mA DC maximum.
• Operating & Storage Temperature Range: -40°C to +100°C.

2.2 Thermal Characteristics

Critical for thermal management design to ensure longevity and stable performance.

• Maximum Junction Temperature (T_j): 115°C.
• Thermal Resistance, Junction-to-Ambient (R_θJA): 140 °C/W (typical). This value indicates the temperature rise per watt of power dissipated.

2.3 Electrical & Optical Characteristics

Typical performance parameters measured at an ambient temperature (T_a) of 25°C and a forward current (I_F) of 20mA.

• Luminous Intensity (I_V): 140 - 450 millicandelas (mcd). The actual value is determined by the bin rank.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This wide angle provides broad, even illumination.
• Peak Emission Wavelength (λ_P): 609 nm (typical).
• Dominant Wavelength (λ_d): 598 - 610 nm. Defines the perceived color of the light.
• Spectral Line Half-Width (Δλ): 15 nm (typical). A measure of color purity.
• Forward Voltage (V_F): 1.7 - 2.5 Volts. Must be considered when designing current-limiting circuits.
• Reverse Current (I_R): 10 μA maximum at a reverse voltage (V_R) of 5V. Note: This device is not designed for reverse-bias operation.

3. Bin Ranking System Explanation

Components are sorted into performance bins to ensure consistency within a production lot.

3.1 Luminous Intensity (I_V) Rank

Binning at I_F = 20mA. Tolerance within each bin is ±11%.

• R2: 140.0 - 180.0 mcd
• S1: 180.0 - 224.0 mcd
• S2: 224.0 - 280.0 mcd
• T1: 280.0 - 355.0 mcd
• T2: 355.0 - 450.0 mcd

3.2 Dominant Wavelength (WD) Rank

Binning at I_F = 20mA. Tolerance within each bin is ±1 nm.

• P: 598 - 601 nm
• Q: 601 - 604 nm
• R: 604 - 607 nm
• S: 607 - 610 nm

4. Performance Curve Analysis

Graphical data provides deeper insight into device behavior under varying conditions. The typical curves included in the datasheet illustrate the relationship between forward current and luminous intensity, forward voltage versus forward current, and the spectral power distribution. Analyzing these curves is essential for predicting performance in real-world applications where temperature and drive current may fluctuate.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The device conforms to a standard surface-mount package with dimensions of approximately 3.2mm x 1.6mm x 1.4mm. All dimensional tolerances are ±0.2mm unless otherwise specified. The lens is clear, and the light source color is Orange using AlInGaP technology.

5.2 Recommended PCB Land Pattern

A suggested pad layout for infrared or vapor phase reflow soldering is provided to ensure proper solder joint formation, mechanical stability, and optimal heat dissipation during assembly.

5.3 Tape and Reel Packaging

The LEDs are supplied in industry-standard embossed carrier tape (8mm width) wound onto 7-inch (178mm) diameter reels. Standard reel quantity is 5000 pieces. The packaging follows ANSI/EIA-481 specifications, with a top cover tape sealing the component pockets.

6. Soldering & Assembly Guidelines

6.1 IR Reflow Soldering Profile

For lead-free (Pb-free) processes, a J-STD-020B compliant profile is recommended. Key parameters include a preheat zone (150-200°C for up to 120 seconds max) and a peak body temperature not exceeding 260°C for a maximum of 10 seconds. The profile should be characterized for the specific PCB assembly.

6.2 Hand Soldering

If manual soldering is necessary, use a soldering iron with a tip temperature not exceeding 300°C. Contact time should be limited to a maximum of 3 seconds, and this should be performed only once per pad to avoid thermal damage to the LED package.

6.3 Cleaning

If post-assembly cleaning is required, use only specified solvents such as ethyl alcohol or isopropyl alcohol at room temperature. Immersion time should be less than one minute. Avoid using unspecified chemical cleaners as they may damage the LED package material.

7. Storage & Handling Cautions

7.1 Storage Conditions

• Sealed Package: Store at ≤30°C and ≤70% Relative Humidity (RH). Use within one year of opening the moisture barrier bag.
• Opened Package / Exposed Devices: Store at ≤30°C and ≤60% RH. Devices should be subjected to IR reflow soldering within 168 hours (1 week) of exposure to ambient air to prevent moisture-induced damage ("popcorning") during reflow.
• Extended Storage (Opened): Store in a sealed container with desiccant or in a nitrogen atmosphere.
• Rebaking: LEDs exposed for more than 168 hours require baking at approximately 60°C for at least 48 hours prior to soldering.

7.2 Application Notes

This LED is intended for general-purpose electronic equipment. For applications requiring exceptional reliability or where failure could risk safety (e.g., aviation, medical, transportation), specific qualification and consultation are necessary prior to use.

8. Drive Method & Design Considerations

LEDs are current-driven devices. To ensure consistent luminous intensity and long-term reliability, they must be driven by a constant current source or through a current-limiting resistor in series with a voltage source. The design must account for the forward voltage (V_F) range (1.7V to 2.5V) and the maximum continuous current rating of 30mA. Exceeding the absolute maximum ratings for current, power, or temperature will degrade performance and shorten lifespan. Proper thermal management on the PCB, considering the R_θJA of 140°C/W, is crucial when operating at high ambient temperatures or near maximum current.

9. Typical Application Scenarios

This Orange SMD LED is ideally suited for:

• Status Indicators: Power-on, standby, charging, or fault indicators in consumer electronics, network hardware, and industrial panels.
• Backlighting: Illumination for icons, symbols, or small text on front panels and control interfaces.
• Decorative Lighting: Low-level accent or mood lighting in appliances where a warm orange glow is desired.
• Signal Luminaires: Non-critical visual signaling where high brightness and wide viewing angle are beneficial.

10. Technical Comparison & Differentiation

Key differentiating factors of this LED include its use of AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material, which provides high efficiency and good color stability for orange/red colors compared to older technologies. The 120-degree viewing angle offers a very wide emission pattern, making it superior for applications requiring broad visibility compared to narrower-angle LEDs. Its compatibility with standard IR reflow processes and JEDEC MSL3 rating makes it a robust choice for modern, high-volume SMT assembly lines.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: What resistor value should I use with a 5V supply?
A: Using Ohm's Law (R = (V_supply - V_F) / I_F) and assuming a typical V_F of 2.1V and desired I_F of 20mA: R = (5 - 2.1) / 0.02 = 145 Ohms. Use the nearest standard value (e.g., 150 Ohms) and verify power rating.

Q: Can I drive this LED with a PWM signal for dimming?
A: Yes, pulse-width modulation (PWM) is an effective method for dimming LEDs. Ensure the peak current in each pulse does not exceed the absolute maximum rating of 80mA (for very short pulses) and the average current over time does not exceed 30mA DC.

Q: Why is the storage humidity condition so important?
A> SMD packages can absorb moisture from the air. During the high heat of reflow soldering, this trapped moisture can vaporize rapidly, causing internal delamination or cracking ("popcorning"). Adhering to the specified storage and baking procedures prevents this failure mode.

12. Design-in Case Study Example

Scenario: Designing a status indicator for a portable battery-powered device.
Considerations: Low power consumption is critical. Selecting an LED from the lower intensity bin (e.g., R2: 140-180 mcd) may be sufficient, allowing it to be driven at a current lower than 20mA (e.g., 10mA) to save power while still providing adequate visibility. The wide 120-degree viewing angle ensures the indicator is visible from various angles without needing multiple LEDs. The design must include a suitable current-limiting resistor calculated based on the battery's voltage range (which may vary from fully charged to discharged) and the LED's V_F range to ensure consistent brightness and avoid over-current.

13. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons recombine with holes within the active region (composed of AlInGaP in this case), releasing energy in the form of photons. The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The clear epoxy lens encapsulates the semiconductor die, provides mechanical protection, and shapes the light output beam.

14. Technology Trends

The general trend in SMD LED technology continues toward higher luminous efficacy (more light output per watt of electrical input), improved color rendering, and reduced package sizes enabling higher-density designs. There is also a strong focus on enhancing reliability and thermal performance to support more demanding applications. Furthermore, integration with intelligent drivers and control systems for dynamic lighting effects is becoming more common. The component described here represents a mature, reliable solution within the broader ecosystem of indicator and signaling LEDs.