T3B Series 3014 White LED Specification - Size 3.0x1.4x0.8mm - Voltage 9.2V - Power 0.3W - English Technical Document

1. Product Overview

The T3B series is a surface-mount device (SMD) LED utilizing a 3014 package footprint (3.0mm x 1.4mm x 0.8mm). This specific model, T3B003L(C,W)A, is a white light LED featuring a three-chip series configuration with a nominal power rating of 0.3W. It is designed for general lighting applications requiring high reliability and consistent performance in a compact form factor.

1.1 Core Features

• Package: 3014 (3.0mm x 1.4mm)
• Chip Configuration: Three series-connected chips
• Nominal Power: 0.3W (at 30mA forward current)
• Color: White, available in Warm White (L), Neutral White (C), and Cool White (W) variants.
• Typical Forward Voltage (V_F): 9.2V
• Viewing Angle (2θ_1/2): 115°

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings (T_s=25°C)

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 40 mA (Continuous)
• Forward Pulse Current (I_FP): 120 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (P_D): 408 mW
• Operating Temperature (T_opr): -40°C to +80°C
• Storage Temperature (T_stg): -40°C to +100°C
• Junction Temperature (T_j): 125°C
• Soldering Temperature (T_sld): Reflow soldering at 230°C or 260°C for 10 seconds maximum.

2.2 Electro-Optical Characteristics (T_s=25°C)

These are the typical operating parameters under specified test conditions.

• Forward Voltage (V_F): Typical 9.2V, Maximum 10.8V (at I_F=30mA)
• Reverse Voltage (V_R): 5V
• Reverse Current (I_R): Maximum 10 μA
• Luminous Flux: See binning tables in section 2.4.
• Dominant Wavelength / Correlated Color Temperature (CCT): See binning tables in section 2.3.

3. Binning System Explanation

The product is classified into bins to ensure color and brightness consistency. The model naming convention directly incorporates these bin codes.

3.1 Model Naming Rule

The structure is: T [Shape Code] [Chip Count] [Lens Code] [Internal Code] - [Flux Code] [CCT Code]. For example, T3B003L(C,W)A decodes as: T (product line), 3B (3014 package), 3 (three chips), 00 (no lens), L (internal code), A (internal code), and the final codes for luminous flux and color temperature (C/W for Neutral/Cool White).

3.2 Correlated Color Temperature (CCT) Binning

The 3014 series standard ordering is based on specific chromaticity ellipses (MacAdam ellipses) to control color variation.

Tolerances: Chromaticity coordinate allowance is ±0.005.

3.3 Luminous Flux Binning

Flux is specified as a minimum value at 30mA. The actual shipped flux may be higher than the ordered minimum but will always stay within the ordered CCT chromaticity region.

Tolerances: Luminous flux measurement tolerance is ±7%. CRI test value tolerance is ±2.

3.4 Forward Voltage (V_F) Binning

Tolerances: Voltage measurement tolerance is ±0.08V.

4. Performance Curve Analysis

The datasheet provides several key characteristic curves essential for design.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the relationship between the current flowing through the LED and the voltage drop across it. It is non-linear, typical of a diode. The curve is essential for designing the current-limiting circuitry (e.g., driver or resistor) to ensure the LED operates at the desired current (e.g., 30mA) without exceeding its maximum ratings.

4.2 Forward Current vs. Relative Luminous Flux

This graph illustrates how the light output changes with the drive current. Typically, luminous flux increases with current but not linearly, and efficiency may drop at higher currents due to increased heat. Operating at the recommended 30mA ensures optimal balance between output and longevity.

4.3 Junction Temperature vs. Relative Spectral Power Distribution

This curve demonstrates the effect of junction temperature (T_j) on the LED's spectral output. For white LEDs, increasing temperature often causes a shift in the spectrum and a decrease in overall light output (lumen depreciation). Maintaining a low junction temperature through proper thermal management is critical for consistent color and long-term light output stability.

4.4 Relative Spectral Power Distribution

This plot shows the intensity of light emitted at each wavelength. For phosphor-converted white LEDs (like this one), it typically shows a blue peak from the LED chip and a broader yellow/red emission band from the phosphor. The shape of this curve determines the Color Rendering Index (CRI) and the precise shade of white (e.g., warm, neutral, cool).

4.5 Radiation Pattern (Viewing Angle)

The provided polar plot depicts the spatial distribution of light intensity. The 115° viewing angle (2θ_1/2, the angle at which intensity is half of the peak) indicates a wide, lambertian-like emission pattern suitable for general area lighting where broad illumination is desired.

5. Mechanical and Packaging Information

5.1 Outline Dimensions

The LED has a standard 3014 package size: 3.0mm (L) x 1.4mm (W) x 0.8mm (H). Detailed dimensional drawings with tolerances (e.g., .X: ±0.10mm, .XX: ±0.05mm) are provided for PCB footprint design.

5.2 Pad Layout and Stencil Design

Recommended solder pad patterns and stencil aperture designs are supplied to ensure reliable solder joint formation during reflow soldering. Following these guidelines is crucial for proper alignment, electrical connection, and thermal transfer to the PCB.

5.3 Polarity Identification

The cathode is typically marked, often by a notch, a dot, or a green marking on the package. Correct polarity must be observed during assembly to prevent reverse bias, which is limited to 5V as per the absolute maximum ratings.

6. Soldering and Assembly Guidelines

6.1 Moisture Sensitivity and Baking

The 3014 LED package is moisture-sensitive per IPC/JEDEC J-STD-020C. Exposure to ambient humidity after opening the moisture barrier bag can cause internal delamination or cracking during the high-temperature reflow process (\"popcorn effect\").

• Storage: Store unopened bags at <30°C and <30% RH. No baking is required before use if these conditions are met, confirmed by the humidity indicator card inside the bag.
• Baking Requirement: Bake LEDs that have been removed from their original sealed packaging and exposed to ambient conditions without being soldered.
• Baking Method: Bake at 60°C for 24 hours on the original reel. Do not exceed 60°C. After baking, solder within one hour or store in a dry cabinet (<20% RH).
• Post-Reflow: LEDs that have already undergone reflow soldering do not require re-baking.

6.2 Reflow Soldering Profile

The maximum allowable soldering temperature is 230°C or 260°C for 10 seconds. A standard lead-free reflow profile with a peak temperature within this limit and controlled ramp-up/ramp-down rates should be used to minimize thermal stress on the LED package and the solder joints.

7. Application Notes and Design Considerations

7.1 Thermal Management

With a maximum junction temperature of 125°C and a power dissipation of up to 408mW, effective heat sinking is vital. The LED's primary thermal path is through the solder pads to the PCB. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep T_j as low as possible. High T_j accelerates lumen depreciation and can shift color temperature.

7.2 Current Drive

Operate the LED at or below the recommended 30mA continuous current. A constant current driver is preferred over a constant voltage source with a series resistor for better stability and efficiency, especially when multiple LEDs are used or input voltage varies. The high forward voltage (~9.2V) means series connection of multiple LEDs may require a boost converter topology.

7.3 Optical Design

The wide 115° viewing angle makes it suitable for applications requiring broad, even illumination without secondary optics. For directional lighting, external reflectors or lenses can be used. The absence of a primary lens (code \"00\") in this model provides design flexibility for adding custom optical elements.

8. Typical Application Scenarios

• Backlighting: Edge-lit or direct-lit backlight units for LCD displays, signage, and control panels.
• General Lighting: LED bulbs, tubes, and flat panel lights where multiple LEDs are arrayed to create area lighting.
• Decorative Lighting: Strip lights, contour lighting, and accent lighting.
• Industrial Indicators: Status indicators on machinery and equipment requiring high brightness and reliability.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Why is the forward voltage so high (~9.2V)?

This LED contains three semiconductor chips connected in series inside the package. The forward voltages of each chip add up, resulting in a higher total V_F. This allows the LED to be driven efficiently from higher voltage sources and can simplify driver design when multiple LEDs are connected in a long series string.

9.2 Can I drive this LED with a 12V supply?

Direct connection to a 12V source is not recommended as it would cause excessive current and destroy the LED. You must use a current-limiting mechanism. The simplest method is a series resistor: R = (V_supply - V_F) / I_F. For a 12V supply and 30mA target: R ≈ (12V - 9.2V) / 0.03A ≈ 93 Ohms. A constant current driver is a more stable and efficient solution.

9.3 How critical is the moisture baking process?

It is very critical for reliability. If moisture-sensitive devices are not properly baked before reflow, the rapid vaporization of absorbed moisture during soldering can cause internal package damage, leading to immediate failure or reduced long-term reliability. Always check the humidity indicator card and follow the baking instructions if the \"humidity warning\" level is exceeded.

9.4 What does the luminous flux bin code (e.g., D8, E1) guarantee?

The flux bin code guarantees a minimum luminous flux output when measured at 30mA and 25°C. The actual flux of shipped units will be at or above this minimum value but will not exceed the maximum value listed for that bin. The LED will always conform to the chromaticity (color) region ordered.

10. Technical Comparison and Trends

10.1 Comparison with Similar Packages

Compared to the older 3528 package, the 3014 offers a lower profile (0.8mm vs. ~1.9mm) and often better thermal performance due to a larger thermal pad area relative to its size. It is a common successor to the 3528 in backlighting and general lighting applications requiring slimmer designs.

10.2 Industry Trends

The trend in SMD LEDs continues towards higher efficacy (lumens per watt), improved color consistency (tighter binning), and enhanced reliability. Multi-chip packages like this T3B series allow for higher light output from a single component, simplifying optical design and assembly compared to using multiple single-die LEDs. There is also a focus on improving moisture resistance levels (MSL) to simplify handling in manufacturing.