UV LED SMD 6650 Ceramic Package - Dimensions 6.6x6.6x3.85mm - Voltage 6.4-7.6V - Wavelength 365-410nm - English Technical Datasheet

1. Product Overview

This document details the specifications for a high-power Surface Mount Device (SMD) Ultraviolet (UV) Light Emitting Diode (LED). The product is designed for industrial-grade applications requiring robust performance and reliable output in the ultraviolet spectrum. Its core construction utilizes advanced materials to ensure stability and longevity under demanding operating conditions.

1.1 General Description

The LED features a compact ceramic substrate paired with a quartz glass lens for encapsulation. This material combination offers excellent thermal management properties from the ceramic and high UV transparency and durability from the quartz. The overall package dimensions are 6.6 mm in length, 6.6 mm in width, and 3.85 mm in height, making it suitable for automated SMT assembly lines.

1.2 Core Features & Advantages

• Superior Package: Ceramic substrate for efficient heat dissipation and quartz lens for optimal UV light transmission and environmental resistance.
• Wide Viewing Angle: A 120-degree half-intensity angle provides broad irradiation coverage, beneficial for area curing or disinfection.
• SMT Compatibility: Fully compatible with standard Surface Mount Technology assembly and solder reflow processes.
• Automated Handling: Supplied on tape and reel format for high-speed pick-and-place machine compatibility.
• Moisture Sensitivity: Rated at Moisture Sensitivity Level (MSL) 3, requiring baking if exposed beyond 168 hours prior to reflow.
• Environmental Compliance: The product is compliant with RoHS (Restriction of Hazardous Substances) directives.

1.3 Target Applications

This UV LED is engineered for applications leveraging ultraviolet light for chemical processes or germicidal effect. Primary application areas include:

• UV Curing: Instant curing of adhesives, coatings, and inks in printing, electronics assembly, and 3D printing.
• UV Ink Curing: Specifically for drying and polymerizing inks in industrial printing processes.
• Ultraviolet Disinfection: Used in equipment for air, water, or surface purification, targeting microorganisms.
• General Use: Other applications requiring a reliable source of UVA or near-UV light.

2. In-Depth Technical Parameter Analysis

2.1 Electrical & Optical Characteristics

All parameters are specified at a solder point temperature (Ts) of 25°C. The key performance metrics are segmented into different product codes based on specific characteristics.

• Forward Voltage (VF): Measured at a drive current of 1400 mA. The product is offered in three voltage bins: B28 (6.4V to 6.8V), B30 (6.8V to 7.2V), and B32 (7.2V to 7.6V). This allows for design considerations regarding power supply requirements.
• Radiant Flux (Φe): The optical power output in milliwatts (mW). This is the primary measure of UV light intensity. Performance is binned into three flux grades (1B42, 1B43, 1B44) with typical values ranging from approximately 3550 mW to over 7100 mW at 1400mA, depending on the specific wavelength variant.
• Wavelength Variants: The product family covers several peak wavelength ranges: 365-370 nm, 380-390 nm, 390-400 nm, and 400-410 nm. Selection depends on the photo-initiator sensitivity in curing applications or the germicidal effectiveness curve for disinfection.
• Thermal Resistance (RthJ-S): The junction-to-solder point thermal resistance is specified at a typical 4.5 °C/W. This low value is a direct benefit of the ceramic package, indicating efficient heat transfer from the LED chip to the circuit board.
• Reverse Current (IR): Maximum leakage current is 5 μA when a reverse bias of 10V is applied.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. Operation under or at these limits is not guaranteed.

• Maximum Power Dissipation (PD): 15.2 Watts.
• Peak Forward Current (IFP): 2000 mA, allowed under pulsed conditions (0.1ms pulse width, 1/10 duty cycle).
• Reverse Voltage (VR): 10 Volts.
• Electrostatic Discharge (ESD): Withstands 2000V Human Body Model (HBM). ESD precautions during handling are still necessary.
• Temperature Ranges:
  • Operating Temperature (TOPR): -40°C to +80°C.
  • Storage Temperature (TSTG): -40°C to +100°C.
  • Maximum Junction Temperature (TJ): 105°C.

2.3 Binning System Explanation

The product uses a standardized binning system to ensure consistent performance:

• Forward Voltage (VF) Binning: Codes B28, B30, B32 allow designers to select LEDs with similar voltage drops for uniform current distribution in parallel arrays.
• Radiant Flux (Φe) Binning: Codes 1B42, 1B43, 1B44 categorize LEDs based on their optical power output. This enables predictable light intensity in the final application.
• Wavelength Binning: The product part number indicates the dominant wavelength range (e.g., 365-370nm). This precise sorting is critical for applications where specific photoreactions are targeted.

3. Performance Curve Analysis

3.1 Forward Voltage vs. Forward Current (IV Curve)

The datasheet references a typical IV characteristic curve. For this type of high-power UV LED, the curve is expected to show an exponential relationship at very low currents, transitioning to a near-linear region with a series resistance at the nominal operating current of 1400mA. The slope in this operating region relates to the dynamic resistance of the LED. Understanding this curve is essential for designing appropriate constant-current drivers to ensure stable optical output and prevent thermal runaway.

4. Mechanical & Package Information

4.1 Package Dimensions & Drawings

The mechanical outline is strictly defined with a footprint of 6.60 mm x 6.60 mm and an overall height of 3.85 mm. The package includes a thermal pad on the bottom to enhance solder adhesion and heat sinking. The lens is centrally located on the top surface. Dimensional tolerances for all features are generally ±0.2 mm unless otherwise specified.

4.2 Polarity Identification & Soldering Pad Layout

The cathode (-) and anode (+) terminals are clearly marked on the bottom of the package. A recommended solder pad pattern (Land Pattern) is provided, showing the dimensions for the two electrical pads and the larger central thermal pad. Following this recommendation is crucial for achieving reliable electrical connections, maximizing thermal performance, and ensuring proper alignment during reflow soldering.

5. Soldering & Assembly Guidelines

5.1 SMT Reflow Soldering Profile

The product is suitable for infrared or convection reflow soldering processes. A specific temperature profile must be followed, typically including preheat, thermal soak, reflow, and cooling zones. The peak solder temperature must not exceed the maximum rated temperature to avoid damage to the LED die, internal bonds, or the quartz lens. Due to its MSL 3 rating, opened moisture barrier bags require parts to be baked if not used within 168 hours.

5.2 Manual Soldering & Rework

If manual soldering or rework is necessary, it must be performed with great care. A temperature-controlled soldering iron should be used with the tip temperature kept as low as possible (recommended below 350°C) and contact time minimized to prevent thermal shock to the component. Direct contact with the quartz lens must be avoided.

6. Packaging, Storage & Ordering

6.1 Packaging Specification

The LEDs are packaged in embossed carrier tape on reels for automated assembly. Detailed dimensions for the carrier tape pockets and the reel (including hub diameter, flange diameter, and width) are provided to ensure compatibility with SMT equipment. The reel is labeled with product information, quantity, and lot traceability data.

6.2 Moisture Barrier & Dry Packing

To maintain the MSL 3 rating, reels are sealed inside a moisture barrier bag along with a humidity indicator card. The bag is vacuum-sealed or filled with dry nitrogen to protect the components from ambient moisture during storage and transportation.

7. Application Suggestions & Design Considerations

7.1 Design Considerations for Optimal Performance

• Thermal Management: The key to longevity and stable output is effective heat sinking. The low 4.5 °C/W thermal resistance is only effective if the printed circuit board (PCB) has adequate thermal vias and copper area to dissipate heat. The maximum junction temperature of 105°C must not be exceeded.
• Drive Current: Operate at or below the recommended 1400mA DC current. Using a constant current driver is essential to prevent current fluctuations that affect light output and lifespan. The forward voltage bin can help design for voltage headroom in the driver.
• Optics & Materials: For disinfection or curing systems, ensure that any secondary optics or cover materials (like tubes or windows) are transparent to the specific UV wavelength emitted. Many standard plastics degrade under UV exposure.

7.2 Technical Comparison & Differentiation

Compared to plastic-packaged UV LEDs, this ceramic and quartz package offers significantly better thermal performance, higher maximum operating temperature, and superior resistance to UV-induced degradation (yellowing) of the encapsulant. This results in longer lifetime, higher sustained output power, and reliability in harsh environments.

8. Frequently Asked Questions (FAQ)

8.1 What is the difference between the wavelength variants (365nm vs. 400nm)?

The 365-370nm variant emits in the UVA spectrum, ideal for most industrial UV curing applications as it matches common photo-initiators. The 400-410nm variant is near-visible UV and may be used where deeper penetration or different chemical initiation is needed, or where lower-energy UV is sufficient for disinfection.

8.2 How do I interpret the Radiant Flux (mW) value for my application?

Radiant flux is the total optical power emitted. For curing, this relates to the dose (energy per area) delivered. You must calculate the irradiance (mW/cm²) at your target based on distance, optics, and this flux value. For disinfection, the germicidal effectiveness is wavelength-dependent, so the flux must be weighted by an action spectrum.

8.3 Can I drive this LED with a constant voltage source?

It is strongly discouraged. LEDs are current-driven devices. A constant voltage source with a simple series resistor is inefficient and offers poor regulation against temperature and unit-to-unit Vf variations. A dedicated constant-current LED driver is required for stable and reliable operation.

9. Reliability & Testing

The product undergoes a series of reliability tests to ensure performance under stress. Standard test items may include high-temperature operating life, thermal cycling, humidity testing, and solder heat resistance. Specific conditions and pass/fail criteria (such as allowable changes in forward voltage or radiant flux) are defined to guarantee product robustness.