White LED RF-A3H22-W57P-E5 Specification - Size 3.0x3.0x0.8mm - Voltage 5.8-7.0V - Power 9856mW - AEC-Q102 Qualified

1. Product Overview

The RF-A3H22-W57P-E5 is a high-power white LED designed for demanding automotive exterior lighting applications. Fabricated using a blue chip combined with phosphor, this LED delivers a warm-to-neutral white light with a typical color temperature around 5700K. Housed in a compact 3.0mm x 3.0mm x 0.8mm PLCC package, it offers an extremely wide 120° viewing angle, making it ideal for use in turn signals, daytime running lights, and other exterior signaling functions. The device is AEC-Q102 qualified, ensuring reliability under harsh automotive conditions, and is RoHS compliant. With a maximum forward current of 1500mA and power dissipation up to 9856mW, it provides high luminous flux output of 550-730lm at 1000mA. The moisture sensitivity level is 2, requiring proper handling and storage.

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics

At a test current of 1000mA and solder temperature of 25°C, the forward voltage (VF) ranges from 5.8V (min) to 7.0V (max), with typical values not specified but falling within this range. The reverse current (IR) at VR=5V is extremely low, maximum 10µA, indicating excellent junction quality. Luminous flux (Φ) is binned from 550lm (min) to 730lm (max), providing consistent brightness selection. The viewing angle (2θ1/2) is typically 120°, ensuring wide light distribution suitable for automotive signaling. Thermal resistance from junction to solder pad (RTHJ-S) is typically 2.86K/W, allowing efficient heat transfer to the PCB.

2.2 Absolute Maximum Ratings

The LED can handle a peak forward current of 2000mA (pulse width 0.1ms, 1/10 duty cycle) and continuous forward current up to 1500mA. Power dissipation is limited to 9856mW. Reverse voltage must not exceed 5V. The device is ESD sensitive with an HBM rating of 8000V (yield >90% at 2000V). Operating and storage temperature range is -40°C to +110°C, junction temperature maximum 150°C. These ratings must be strictly observed to prevent damage.

2.3 Thermal Characteristics

With a thermal resistance of 2.86K/W, the LED efficiently conducts heat from the junction to the solder points. Proper thermal management is critical because high temperature reduces luminous efficacy and shifts color coordinates. Designers must ensure that the junction temperature never exceeds 150°C, which may require adequate PCB heat sinking, especially in high-current applications.

3. Binning System

3.1 Forward Voltage Bins

At 1000mA, forward voltage is divided into three bins: R0 (5.8-6.2V), S0 (6.2-6.6V), and T0 (6.6-7.0V). This allows selection of LEDs with similar voltage for parallel or series configurations to ensure uniform current distribution.

3.2 Luminous Flux Bins

Luminous flux is binned into YA (550-610lm), YB (610-670lm), and YC (670-730lm). Higher flux bins provide greater light output, enabling flexibility in meeting brightness requirements.

3.3 Chromaticity Bins

The CIE chromaticity diagram shows three color bins: 65N, 60N, and 57N, each defined by four corner coordinates. These bins correspond to different correlated color temperatures (CCT) approximately around 6500K, 6000K, and 5700K respectively. Tight chromaticity control ensures consistent color appearance across production lots.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

The VF-IF curve (Fig.1-7) shows a typical forward voltage of approximately 6.0V at 1000mA, increasing to about 6.4V at 1400mA. The relationship is approximately linear, with a dynamic resistance around 1Ω. This information is crucial for designing constant-current drivers.

4.2 Relative Intensity vs. Forward Current

Relative luminous output increases nearly linearly with current up to 1400mA, reaching about 140% of the 1000mA value. This indicates good current-to-light conversion efficiency at high currents.

4.3 Temperature Effects

Relative intensity decreases as solder temperature rises, dropping to about 85% at 125°C compared to 25°C. Forward voltage also decreases slightly with temperature (negative temperature coefficient). Color coordinates shift toward yellower regions at higher temperatures. These effects must be compensated in system design to maintain consistent performance.

4.4 Radiation Pattern

The radiation diagram (Fig.1-12) shows a typical Lambertian distribution with half-intensity at ±60°, confirming the 120° viewing angle. This wide pattern is beneficial for automotive signaling requiring broad visibility.

4.5 Spectrum

The spectral distribution (Fig.1-14) shows a broad blue peak around 450nm from the chip and a wide yellow phosphor conversion peak, producing white light. The exact spectrum varies with bin and temperature.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED has a top-view dimension of 3.00mm x 3.00mm, height 0.80mm. Bottom view shows two anode pads (2.75mm x 1.05mm and 2.45mm x 1.05mm) and one cathode pad (1.20mm x 1.05mm). Polarity is marked by a small dot on the top surface near the cathode side. The recommended soldering pattern (Fig.1-5) provides land pads that match the bottom pad layout for optimal thermal and electrical connection.

5.2 Carrier Tape and Reel

The LEDs are supplied on carrier tape (dimensions to be confirmed) and wound on a reel with outer diameter 180±1mm, hub 60±1mm, and tape width 12±0.1mm. Each reel contains a specified quantity (value not given in PDF, typically 1000pcs). The label includes part number, spec number, lot number, bin codes for flux (φ), chromaticity (XY), forward voltage (VF), wavelength (WLD), quantity, and date.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile (Fig.3-1) has a preheat zone from 150°C to 200°C for 60-120 seconds, a ramp-up rate ≤3°C/s to 217°C (TL), and a time above 217°C (tL) up to 60 seconds. Peak temperature (TP) is 260°C with a maximum duration of 10 seconds. Cooling rate ≤6°C/s. The total time from 25°C to peak must not exceed 8 minutes. Reflow soldering should be performed no more than twice; if more than 24 hours elapse between soldering steps, pre-baking is required.

6.2 Hand Soldering and Repair

Hand soldering must be done with iron temperature below 300°C for less than 3 seconds, only once. Repair is discouraged; if unavoidable, use a double-head soldering iron and verify LED characteristics afterward.

6.3 Handling and Storage

The LED encapsulation is silicone, which is soft. Avoid applying pressure to the top surface. Do not mount on warped PCBs or apply mechanical stress after soldering. Storage conditions: before opening the aluminum bag, temperature ≤30°C, humidity ≤75% for up to one year; after opening, use within 24 hours at ≤30°C and ≤60% RH. If moisture absorption is suspected, bake at 60±5°C for over 24 hours before use. ESD protection is required; proper grounding and antistatic equipment should be used.

7. Packaging and Ordering Information

The product is packaged in moisture barrier bags with desiccant and humidity indicator card. Each bag contains one reel. Multiple reels are packed in a cardboard box. The label on each reel includes all necessary identification for traceability. For ordering, the part number RF-A3H22-W57P-E5 specifies the exact configuration. Contact your supplier for detailed packaging quantities and minimum order quantities.

8. Application Recommendations

8.1 Typical Applications

The primary application is automotive exterior lighting, including turn signals, brake lights, daytime running lights, and tail lights. The wide viewing angle and high flux make it suitable for both direct and light guide based designs. The AEC-Q102 qualification ensures reliability under vibration, thermal cycling, and humidity.

8.2 Design Considerations

Thermal management is critical: use adequate copper area on the PCB and consider thermal vias to a heatsink. Constant current driving is mandatory; never drive from a voltage source without current limiting. Series resistors or LED drivers should be used. Ensure that the reverse voltage across the LED never exceeds 5V. For parallel strings, match VF bins to avoid current imbalance.

8.3 Environmental Compatibility

Avoid exposure to sulfur (limit <100ppm in mating materials), bromine (<900ppm), chlorine (<900ppm), and total halogens (<1500ppm). VOCs from adhesives and potting compounds can penetrate silicone and cause discoloration; use compatible materials only. Cleaning with isopropyl alcohol is recommended; ultrasonic cleaning is not advised.

9. Technical Comparison with Alternatives

Compared to standard PLCC LEDs, the RF-A3H22-W57P-E5 offers higher current handling (1500mA vs typical 350-700mA), wider viewing angle (120° vs 90-110°), and automotive-grade reliability (AEC-Q102). Its 3.0x3.0mm footprint is similar to many mid-power packages but with increased power dissipation capability. The flux output of up to 730lm at 1000mA places it in the high-power segment, suitable for replacing multiple lower-power LEDs in signal applications.

10. Frequently Asked Questions

Q: Can this LED be used for interior lighting?
A: While possible, it is designed for exterior applications. For interior use, ensure that the wide viewing angle and high flux are suitable.

Q: What is the recommended drive current for best efficiency?
A: Efficiency is highest at lower currents (e.g., 700mA), but the LED is optimized for 1000mA. For maximum flux, use 1500mA with proper thermal management.

Q: How to handle binning variations?
A: Order specific bins (e.g., S0 for VF, YB for flux, 60N for color) as needed. Mixing bins in the same circuit can cause uneven brightness.

Q: Can I use this LED without a heatsink?
A: Only at low currents. At 1000mA and above, a heatsink or large copper area is essential to keep junction temperature below 150°C.

11. Practical Design Example

Consider a daytime running light module requiring 400lm at 1000mA. Using bin YB (610-670lm) ensures sufficient margin. Design a constant current driver set to 1000mA with a maximum voltage compliance of 7.0V. Place the LED on a 2x2cm copper pad on an aluminum PCB with thermal vias to the backside heatsink. Simulate thermal performance to ensure solder temperature stays below 85°C, resulting in junction temperature below 110°C. Include a 10µF bypass capacitor near the LED to reduce EMI.

12. Working Principle

The white LED operates by converting blue light from an InGaN/GaN chip into white light using a phosphor coating. The blue chip emits photons around 450nm wavelength; these photons partially excite the yellow-green phosphor (Ce:YAG or similar), which emits broad-spectrum light. The combination of blue and yellow light appears white to the human eye. The device is a PLCC package, where the chip is mounted on a leadframe and encapsulated with silicone containing phosphor.

13. Industry Trends and Outlook

The automotive lighting market is moving toward higher power LEDs in smaller packages. The RF-A3H22-W57P-E5 exemplifies this trend with its 3.0x3.0mm PLCC package and 5.8-7.0V forward voltage suitable for 12V automotive systems. Future developments include even higher luminous efficacy (>150lm/W), improved thermal resistance, and tighter color bins. With the adoption of matrix lighting and adaptive driving beams, high-power white LEDs with precise optical control will continue to be in demand.