White LED 2014 PLCC-2 Datasheet - Dimensions 2.0x1.4x1.3mm - Voltage 2.7-3.3V - Power 0.099W - Technical Documentation

1. Product Overview

This document provides detailed specifications for a high-performance white light-emitting diode (LED) designed for surface-mount technology (SMT) applications. The device is constructed using a blue LED chip combined with a phosphor coating to produce white light, encapsulated in a compact and reliable PLCC-2 (Plastic Leaded Chip Carrier) package.

1.1 General Description

The LED features a standard PLCC-2 package with dimensions of 2.0mm in length, 1.4mm in width, and 1.3mm in height. This compact form factor makes it suitable for high-density PCB layouts. The white light generation is achieved through the combination of a blue semiconductor chip and a precise phosphor formulation, enabling consistent color output across various operating conditions.

1.2 Key Features

• PLCC-2 package type for robust mechanical and electrical performance.
• Extremely wide viewing angle of 120 degrees, ensuring uniform light distribution.
• Fully compatible with standard SMT assembly and solder reflow processes.
• Supplied on tape and reel for automated pick-and-place manufacturing.
• Moisture Sensitivity Level (MSL) rated at Level 3, requiring controlled storage.
• Compliant with RoHS (Restriction of Hazardous Substances) directives.

1.3 Applications

This LED is versatile and designed for a broad range of lighting applications, including but not limited to: decorative lighting and accent strips; indicator lights in household appliances and electronic instruments; general illumination in hotels, markets, offices, and residential settings; and any application requiring a reliable, compact white light source.

2. Technical Parameters Deep Analysis

A thorough understanding of the electrical and optical parameters is crucial for successful integration into any design. All values are specified at a standard junction temperature (Ts) of 25°C unless otherwise noted.

2.1 Electrical and Optical Characteristics

The forward voltage (VF) ranges from a minimum of 2.7V to a maximum of 3.3V when driven at the standard test current of 20mA. This parameter is critical for power supply design. The reverse current (IR) is guaranteed to be below 10µA at a reverse voltage of 5V, indicating good diode characteristics. Luminous flux output varies with the correlated color temperature (CCT) bin. For example, LEDs in the 1725-1900K (warm white) bin have a typical luminous flux of 3-7 lumens at 20mA, while cooler white bins (e.g., 5925-7150K) offer 5-9 lumens. The color rendering index (Ra) is specified at a minimum of 90, ensuring excellent color fidelity for the illuminated objects.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. The maximum continuous forward current (IF) is 30mA. The peak forward current (IFP) can reach 100mA under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). The maximum power dissipation (PD) is 99mW. The device can withstand an electrostatic discharge (ESD) of 2000V (Human Body Model), though proper ESD handling procedures are still recommended. The operating temperature range is from -40°C to +85°C, and storage temperature ranges from -40°C to +100°C. The maximum allowable junction temperature (TJ) is 97°C.

2.3 Thermal Characteristics

The thermal resistance from junction to solder point (RTHJ-S) is typically 80°C/W. This value is essential for thermal management calculations. Exceeding the maximum junction temperature will significantly reduce luminous output and operational lifetime. Designers must ensure adequate PCB copper area and possible heat sinking if operating at higher ambient temperatures or drive currents.

3. Binning System Explanation

To ensure color and brightness consistency in mass production, LEDs are sorted into bins based on key parameters.

3.1 Forward Voltage and Luminous Intensity Bins

Forward voltage is binned in 0.1V steps from 2.7-2.8V (J1) up to 3.2-3.3V (I1). Luminous flux is binned in 1-lumen steps, coded from WGD (3-4 lm) to OEA (8-9 lm). This dual-bin system allows designers to select components that match their specific voltage and brightness requirements for circuit balancing and aesthetic uniformity.

3.2 Color Temperature Ranges

The product is available in several pre-defined correlated color temperature (CCT) ranges, each with its own part number suffix. These include warm white (1725-1900K, 2250-2475K), neutral white (2600-2870K, 2780-3110K), and cool white (3760-4330K, 5925-7150K). The specific binning areas are graphically represented on the CIE 1931 chromaticity diagram, showing the tight control over color point variation within each range.

4. Performance Curve Analysis

Graphical data provides insight into device behavior under varying conditions.

4.1 Forward Voltage vs. Forward Current

The characteristic curve shows a non-linear relationship between forward voltage (VF) and forward current (IF). As current increases from 0 to 30mA, the forward voltage rises gradually from approximately 2.8V to just over 3.2V. This curve is vital for designing constant-current drivers to ensure stable light output and avoid thermal runaway.

4.2 Forward Current vs. Relative Intensity

This curve demonstrates the relative light output as a function of drive current. The intensity increases sub-linearly with current. For instance, doubling the current from 15mA to 30mA does not double the light output, indicating efficiency roll-off at higher currents due to increased junction temperature and other factors. Operating near the typical 20mA is recommended for optimal efficacy and longevity.

5. Mechanical and Package Information

5.1 Package Dimensions

Detailed dimensional drawings are provided, including top, side, bottom, and polarity views. Key dimensions include a body size of 2.0mm x 1.4mm, a total height of 1.3mm, and lead widths of 0.6mm ± 0.05mm. All tolerances are typically ±0.2mm unless specified otherwise. The recommended solder pad land pattern on the PCB is also illustrated to ensure proper soldering and mechanical strength.

5.2 Polarity and Soldering Patterns

The cathode is clearly marked, typically by a notch or a green indicator on the package. Correct polarity must be observed during assembly. The soldering pattern diagram shows the optimal copper pad design for reflow soldering, which helps in achieving reliable solder fillets and managing heat dissipation during the soldering process.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The component is designed for standard infrared or convection reflow soldering processes. A typical reflow profile should be followed, with preheat, soak, reflow, and cooling stages. The peak temperature during reflow must not exceed the maximum allowable temperature for the package (as implied by the storage temperature) to prevent damage to the plastic encapsulation and the internal wire bonds. The specific time above liquidus (TAL) and peak temperature recommendations should be obtained from general SMT guidelines for similar components.

6.2 Handling Precautions

Due to the MSL Level 3 rating, the devices must be baked before soldering if the moisture barrier bag has been opened for more than 168 hours under factory floor conditions (30°C/60%RH). Avoid mechanical stress on the lens. Use vacuum pick-up nozzles of appropriate size during automated handling. Always observe ESD precautions during all handling and assembly stages.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are supplied on embossed carrier tape mounted on reels. The carrier tape dimensions, pocket size, and reel diameter are standardized to fit automatic placement equipment. A detailed label on the reel specifies the part number, quantity, lot number, and bin codes.

7.2 Moisture Resistant Packing

Reels are packaged in sealed, moisture-barrier bags with desiccant and a humidity indicator card to protect the components from ambient moisture during storage and transport, in accordance with the MSL3 requirement.

7.3 Reliability Testing

The product undergoes a series of reliability tests, which may include high-temperature storage, low-temperature storage, temperature cycling, humidity testing, and solder heat resistance. Specific test conditions and pass/fail criteria ensure the component's robustness and longevity in the field.

8. Application Recommendations

For optimal performance, it is recommended to drive the LED with a constant current source rather than a constant voltage. The current should be set according to the desired brightness while staying within the absolute maximum ratings. Consider the thermal path in the PCB design; using thermal vias under the LED's thermal pad (if applicable) can help dissipate heat. For applications requiring specific color consistency, specify the required voltage and flux bin codes during procurement.

9. Technical Comparison

Compared to older LED packages like 5mm through-hole types, this PLCC-2 SMD LED offers a much smaller footprint, better suitability for automated assembly, and a wider viewing angle. Within the PLCC-2 family, this specific variant distinguishes itself with its high color rendering index (Ra>90) and availability in multiple, tightly-binned color temperatures, making it suitable for applications where color quality is critical.

10. Frequently Asked Questions

Q: Can I drive this LED at 30mA continuously?

A: Yes, 30mA is the absolute maximum continuous current. However, for extended lifespan and maintained brightness, operating at or below the typical 20mA is advisable, especially in high ambient temperature environments.



Q: What is the difference between the various color temperature bins?

A: The bins represent different shades of white light, from warm (yellowish) to cool (bluish). The choice depends on the desired aesthetic and application (e.g., warm white for cozy lighting, cool white for task lighting).



Q: How do I interpret the bin codes for ordering?

A: The full part number includes codes for forward voltage (e.g., G1) and luminous flux (e.g., WHB). Consult the binning tables to select the combination that meets your circuit design and brightness requirements.

11. Practical Use Cases

Case Study 1: Appliance Control Panel Backlighting. A series of these LEDs can be used to backlight buttons and displays on a kitchen appliance. The wide viewing angle ensures visibility from various angles, and the high CRI ensures that colored indicators are rendered accurately. The SMT package allows for a slim profile design.



Case Study 2: Decorative LED Strip. Mounted on a flexible PCB, these LEDs can create uniform, continuous lines of light for architectural accent lighting. The availability of different white tones allows designers to match the lighting ambiance to the interior design theme.

12. Principle Introduction

A white LED operates on the principle of electroluminescence in a semiconductor material. When a forward voltage is applied, electrons and holes recombine in the active region of the blue LED chip, emitting photons of blue light. These blue photons then strike a layer of phosphor coating on the chip. The phosphor absorbs a portion of the blue light and re-emits it as light across a broader spectrum (yellow and red wavelengths). The combination of the remaining blue light and the phosphor-emitted light results in the perception of white light. The exact shade (color temperature) is determined by the composition and thickness of the phosphor layer.

13. Development Trends

The general trend in LED technology is towards higher efficacy (more lumens per watt), improved color rendering, and lower cost. For package types like the PLCC-2, advancements include better thermal management materials to allow higher drive currents, more precise phosphor deposition techniques for tighter color binning, and encapsulation materials that offer better resistance to high temperatures and harsh environments. Furthermore, the drive towards miniaturization continues, pushing for even smaller package sizes with maintained or improved optical performance for next-generation compact electronic devices.