White LED SMD 3.00x1.40x0.52mm Data Sheet - Forward Voltage 2.8V - Luminous Flux 23lm - Power 0.192W - Automotive AEC-Q102 Qualified

1. Product Overview

This white LED is fabricated using a blue chip combined with phosphor to achieve a broad white light spectrum. The device comes in a compact EMC (Epoxy Molding Compound) package with dimensions of 3.00 mm x 1.40 mm x 0.52 mm. It is designed for automotive interior and exterior lighting applications, fully compliant with the AEC-Q102 stress test qualification for automotive-grade discrete semiconductors. The LED offers an extremely wide viewing angle of 120°, making it suitable for applications requiring uniform light distribution. With moisture sensitivity level 2 (MSL2) and RoHS compliance, the device is optimized for standard SMT assembly and reflow soldering processes.

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics

At a test condition of IF = 50 mA and Ts = 25 °C, the forward voltage (VF) ranges from 2.6 V (minimum) to 3.2 V (maximum), with a typical value of 2.8 V. The reverse current (IR) at VR = 5 V is typically less than 10 µA, ensuring low leakage. The luminous flux (Φ) is specified between 19.6 lm (min.) and 26.9 lm (max.), with a typical value of 23 lm. The viewing angle (2θ1/2) is typically 120 degrees. Thermal resistance from junction to solder point (RTHJ-S) is a maximum of 50 °C/W, indicating good heat dissipation capability.

2.2 Absolute Maximum Ratings

The maximum power dissipation (PD) is 384 mW. The forward current (IF) should not exceed 120 mA DC, while the peak forward current (IFP) can reach 200 mA at a 1/10 duty cycle and 10 ms pulse width. The reverse voltage (VR) maximum is 5 V. The device can withstand an electrostatic discharge (ESD) of up to 8000 V (HBM) with a yield over 90%. The operating temperature range is from -40 °C to +125 °C, and the storage temperature is identical. The maximum junction temperature (TJ) is 150 °C.

3. Binning System

3.1 Forward Voltage Bins

At IF = 50 mA, forward voltage is sorted into six bins: G1 (2.8–2.9 V), G2 (2.9–3.0 V), H1 (3.0–3.1 V), H2 (3.1–3.2 V), I1 (3.2–3.3 V), and I2 (3.3–3.4 V). This fine binning helps customers select LEDs with tightly controlled voltage for parallel or series circuits.

3.2 Luminous Flux Bins

Luminous flux is sorted into three bins: KA (19.6–21.8 lm), KB (21.8–24.2 lm), and LA (24.2–26.9 lm). Combined with voltage bins, this provides a comprehensive selection for application-specific brightness requirements.

3.3 Chromaticity Bins

The CIE chromaticity diagram shows two color bins: ZG0 and ZG1. ZG0 has coordinate boundaries (0.3059,0.3112), (0.3122,0.3258), (0.3240,0.3258), (0.3177,0.3112). ZG1 is defined by (0.3122,0.3258), (0.3185,0.3404), (0.3303,0.3404), (0.3240,0.3258). These bins ensure consistent color appearance across production lots.

4. Performance Curves Analysis

4.1 Forward Voltage vs. Forward Current

The I-V curve shows that as forward voltage increases from 2.6 V to 3.0 V, the forward current rises from 0 mA to about 60 mA. The curve is exponential, typical for LEDs, indicating that small voltage changes cause large current variations; hence current regulation is critical.

4.2 Relative Intensity vs. Forward Current

Relative luminous intensity increases almost linearly with forward current up to 70 mA. At 50 mA the relative intensity is about 100%, and at 10 mA it drops to approximately 20%. This linear relationship aids in dimming by current adjustment.

4.3 Solder Temperature vs. Relative Intensity

As solder point temperature rises from 20 °C to 120 °C, relative intensity decreases gradually from 100% to about 85%. This highlights the importance of thermal management to maintain light output stability.

4.4 Solder Temperature vs. Forward Current

The maximum allowable forward current must be derated at higher temperatures. At Ts = 25 °C, IF max is 120 mA; at Ts = 100 °C, it reduces to about 60 mA. Proper heat sinking ensures operation within safe limits.

4.5 Forward Voltage vs. Solder Temperature

Forward voltage decreases slightly with increasing temperature (about -2 mV/°C). This negative temperature coefficient must be considered in constant-voltage drive designs.

4.6 Radiation Diagram

The emission pattern is Lambertian-like with a broad half-intensity angle of ±60°. This provides uniform illumination over a wide area, ideal for automotive interior lighting such as dome lights or reading lamps.

4.7 Color Shift vs. Temperature

At higher solder temperatures (85 °C and 105 °C), the chromaticity coordinates shift slightly toward higher Y values (greener), but the change is within 0.01 units, indicating good color stability over temperature.

4.8 Spectrum Distribution

The white LED exhibits a broad spectrum from 400 nm to 750 nm with a peak around 450 nm (blue chip) and a secondary phosphor peak around 550-600 nm. This yields a high color rendering index suitable for general lighting.

5. Mechanical and Package Information

5.1 Package Dimensions

The package is 3.00 mm x 1.40 mm x 0.52 mm. The top view shows a central emission area dimensioned 2.61 mm x 1.60 mm. Side view shows a thickness of 0.52 mm with a small protrusion of 0.05 mm. Bottom view indicates two solder pads: one cathode (C) and one anode (A). The cathode pad is larger (0.86 mm x 1.40 mm). Polarity marking is shown on the bottom as a '-' symbol.

5.2 Recommended Soldering Pattern

For optimal thermal and electrical connection, the recommended PCB land pattern is 3.50 mm x 2.10 mm with a central pad area of 0.91 mm x 1.00 mm. All dimensions are in millimeters with tolerances of ±0.2 mm.

5.3 Polarity Identification

The positive (anode) and negative (cathode) terminals are clearly marked on the bottom view. Correct orientation is essential for proper operation.

6. Soldering and Assembly Guide

6.1 SMT Reflow Profile

The reflow soldering process must adhere to the following parameters: average ramp-up rate from Tsmin to Tp ≤ 3 °C/s; preheating from 150 °C to 200 °C for 60–120 seconds; time above 217 °C (TL) for a maximum of 60 seconds; peak temperature (Tp) of 260 °C with a dwell time within 5 °C of Tp for a maximum of 10 seconds; cooling rate ≤ 6 °C/s; total time from 25 °C to Tp ≤ 8 minutes. Only two reflow cycles are allowed; if more than 24 hours separate them, the LEDs may absorb moisture and get damaged.

6.2 Repairing

Repair should be avoided after soldering. If necessary, use a double-head soldering iron. Mechanical stress on the silicone lens during heating must be prevented.

6.3 Cautions

The encapsulation material is silicone, which is soft. Excessive pressure on the top surface can damage the internal circuit. Pick-and-place nozzles should apply minimal force. Do not mount LEDs on warped PCB or bend the board after soldering. Avoid rapid cooling after reflow.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel

LEDs are packaged in carrier tape with 5000 pieces per reel. The reel dimensions are: A = 178 ± 1 mm, B = 8.0 ± 0.1 mm, C = 60 ± 1 mm, D = 13.0 ± 0.5 mm. The tape includes empty pockets of 80–100 pieces at both start and end for handling.

7.2 Label Specifications

Each reel carries a label with part number, spec number, lot number, bin code (including luminous flux Φ, chromaticity bin XY, forward voltage VF, and wavelength code WLD), quantity, and date of manufacture.

7.3 Moisture Resistant Packing

Reels are sealed in moisture barrier bags with desiccant and humidity indicator cards. The moisture sensitivity level is 2. After opening, the LEDs should be used within 24 hours. If storage exceeds 24 hours, baking at 60 ± 5 °C for at least 24 hours is required before use.

8. Application Recommendations

This LED is primarily intended for automotive interior and exterior lighting, such as dashboard indicators, interior ambient lighting, brake lights, turn signals, and side markers. The wide 120° viewing angle and high brightness (up to 26.9 lm) make it suitable for both direct and indirect illumination. For best performance, thermal design must ensure that the solder point temperature stays below 125 °C. Use current-limiting resistors or constant-current drivers to avoid exceeding the maximum forward current. ESD protection measures, such as grounding wrist straps and anti-static workstations, are mandatory during assembly.

9. Reliability and Testing

9.1 Reliability Tests

The product qualification follows AEC-Q102. Conducted tests include: Reflow conditioning (260 °C, 10 s, 2×), MSL2 preconditioning (85 °C/60% RH for 168 h), Thermal Shock (-40 °C to 125 °C, 1000 cycles), Life Test (Ta = 105 °C, IF = 50 mA, 1000 h), and High Temperature Humidity Life Test (85 °C/85% RH, IF = 50 mA, 1000 h). Acceptance criteria: 0 failures allowed in 20 samples.

9.2 Failure Criteria

A device is considered failed if forward voltage exceeds 1.1 times the upper spec limit (USL), reverse current exceeds 2.0 times USL, or luminous flux falls below 0.7 times the lower spec limit (LSL).

10. Handling Precautions and Storage

Avoid exposure to environments with sulfur content exceeding 100 PPM. Bromine and chlorine single contents must be less than 900 PPM, and their total less than 1500 PPM. VOCs from fixture materials can penetrate the silicone encapsulant and cause discoloration; compatibility testing is recommended. Do not use adhesives that outgas organic vapor. Handle the component by the side with tweezers; never touch the silicone lens directly. Store unopened bags at ≤ 30 °C / ≤ 75% RH for up to one year. After opening, use within 24 hours or bake before use.

11. Common Technical Questions

Q: Can I drive this LED with a constant voltage? A: Constant voltage driving is possible only with a series resistor to limit current, because the forward voltage varies with temperature and bin. A constant-current source is recommended.

Q: What is the typical lifetime? A: The LED is qualified for 1000 h at 105 °C and 50 mA, but typical lifetime at lower temperatures (85 °C) can exceed 10,000 hours with gradual lumen depreciation.

Q: Can multiple LEDs be connected in parallel? A: Yes, but due to VF binning differences, each LED should have its own current-limiting resistor to avoid current hogging.

12. Design Case Studies

Case: Interior dome light replacement – Six LEDs of bin LA (24.2-26.9 lm) at 50 mA each can produce over 150 lm, sufficient for a 12V dome light. Using a constant-current driver with 300 mA total and proper thermal management on an aluminum-core PCB ensures reliable operation at 85 °C ambient.

Case: Exterior side marker – Two LEDs in series (6.4 V total) with a 120 ohm resistor on a 12 V line give ~47 mA, staying within the 50 mA rating. The wide viewing angle meets ECE regulations for side markers.

13. Technology Principles

White light is produced by combining a blue InGaN LED chip (emitting around 450 nm) with a yellow-emitting phosphor (typically YAG:Ce). The blue light partially excites the phosphor, which down-converts some of the blue photons to yellow. The mixture of blue and yellow light appears white. The EMC package provides high temperature resistance and mechanical robustness compared to conventional silicone packages.

14. Development Trends

Automotive lighting continues to shift from incandescent to LED, driven by energy efficiency, long life, and design flexibility. Future trends include higher luminance (over 30 lm per die at 50 mA), smaller packages (e.g., 2.0x1.0 mm), and integration into adaptive lighting systems. The use of automotive-grade LEDs with AEC-Q102 qualification is becoming standard for exterior and interior functions. Improved phosphor technology will enhance color consistency and reduce thermal quenching.