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LED 3.0x1.4x0.8mm White SMD Specification - Forward Voltage 2.7-3.4V - Power 0.136W - Color Temperatures 2650K-6500K

Detailed technical specification for PLCC-2 white SMD LED, 3.0x1.4x0.8mm package, forward current 30mA, luminous flux 9-15lm, color temperatures from 2650K to 6500K, RoHS compliant, 120-degree viewing angle, CRI 80.
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PDF Document Cover - LED 3.0x1.4x0.8mm White SMD Specification - Forward Voltage 2.7-3.4V - Power 0.136W - Color Temperatures 2650K-6500K

1. Product Overview

This white SMD LED is fabricated using a blue chip and phosphors to produce white light. It features a PLCC-2 package with an extremely wide viewing angle, suitable for all SMT assembly and solder processes. The product is available on tape and reel with 4000 pieces per reel, and is RoHS compliant. Moisture sensitivity level is 3.

1.1 Key Features

1.2 Applications

2. Package Dimensions

The package dimensions are 3.0 x 1.4 x 0.8 mm (length x width x height). All dimensions are in millimeters with tolerances of ±0.2 mm unless otherwise noted. The polarity is indicated by a mark on the package body.

3. Electrical and Optical Characteristics (at Ts=25°C)

The following parameters are provided at a forward current of 30 mA unless otherwise stated.

3.1 Forward Voltage (Vf)

The forward voltage is binned into ranks: G1 (2.7-2.8V), G2 (2.8-2.9V), H1 (2.9-3.0V), H2 (3.0-3.1V), I1 (3.1-3.2V), I2 (3.2-3.3V), and J1 (3.3-3.4V).

3.2 Luminous Flux (Φv) at IF=30mA

Depending on the color temperature bin, luminous flux ranges are provided:

Typical luminous flux is approximately 10.9 lm at 6000-6500K and 11.5 lm at 4000K. The measurement tolerance is ±10%.

3.3 Viewing Angle, CRI, and Thermal Resistance

4. Absolute Maximum Ratings

ParameterSymbolRatingUnit
Power DissipationPd136mW
Forward CurrentIF40mA
Peak Forward Current (1/10 duty, 0.1ms pulse)IFP100mA
Reverse VoltageVR5V
ESD (HBM)ESD2000V
Operating TemperatureTopr-40 to +85°C
Storage TemperatureTstg-40 to +100°C
Junction TemperatureTj95°C

Care must be taken that power dissipation does not exceed the absolute maximum rating. The maximum current should be determined based on thermal management to keep junction temperature below 95°C.

5. Binning System

The LEDs are binned according to forward voltage, luminous flux, and chromaticity coordinates. The chromaticity diagram includes multiple bins such as WP2, WK2, WP3, WK3, NP3, NK3, etc., each defined by four CIE xy coordinates. This ensures consistency in color and brightness for each application.

6. Typical Optical Characteristics Curves

6.1 Forward Voltage vs. Forward Current (I-V Curve)

At 30 mA, the forward voltage is approximately 3.0V typical. The curve shows the expected exponential increase in current with voltage above the threshold.

6.2 Forward Current vs. Relative Intensity

Relative intensity increases almost linearly with forward current between 10 mA and 40 mA.

6.3 Pin Temperature Effects

As pin temperature increases from 25°C to 95°C, the relative luminous flux decreases gradually. The forward voltage also decreases slightly with temperature (approximately -2 mV/°C). The forward current should be derated at higher temperatures to avoid exceeding the maximum junction temperature.

6.4 Radiation Pattern

The radiation diagram shows a wide beam angle with relative intensity nearly constant from -60° to +60°, dropping to 50% at about ±60°, consistent with the 120° viewing angle specification.

6.5 Spectral Distribution

The spectrum shows a peak in the blue region (~450 nm) from the chip and a broad yellow emission from the phosphor. For different color temperatures (6500K, 4000K, 3000K), the relative intensity of the blue peak decreases as the CCT decreases, resulting in a warmer appearance.

7. Mechanical and Packaging Information

7.1 Carrier Tape and Reel

The LED is packaged in carrier tape with a pitch of 4 mm and a reel diameter of 180 mm (standard). Polarity is marked on the tape. Each reel contains 4000 pieces.

7.2 Label Information

The label includes part number, spec number, lot number, bin code for luminous flux, chromaticity bin, forward voltage rank, quantity, and date code.

7.3 Moisture Resistant Packaging

The product is shipped in moisture barrier bags with desiccant to maintain low humidity. After opening, the LEDs must be used within 24 hours if stored at ≤30°C and ≤60% RH, or they must be baked at 60±5°C for over 24 hours.

8. Soldering and Assembly Guidelines

8.1 Reflow Soldering Profile

Recommended reflow profile: Preheat from 150°C to 200°C for 60-120 seconds; ramp up to 217°C with time above 217°C not exceeding 60 seconds; peak temperature 260°C for no more than 10 seconds; cool down at ≤6°C/s. Reflow should not be performed more than twice, and if the time between reflows exceeds 24 hours, the LEDs must be baked.

8.2 Hand Soldering

Hand soldering should be done with iron temperature below 300°C for less than 3 seconds, only once.

8.3 Mechanical Handling

The encapsulation material is silicone, which is soft. Avoid applying pressure on the top surface. Use proper pick-and-place nozzles with controlled force. Do not bend the PCB after soldering.

9. Storage and Handling Precautions

9.1 Storage Conditions

Before opening the aluminum bag: store at ≤30°C and ≤75% RH for up to one year from delivery. After opening: use within 24 hours at ≤30°C and ≤60% RH. If not used, bake at 60±5°C for 24 hours.

9.2 ESD Protection

The LED is sensitive to electrostatic discharge (ESD) up to 2000V HBM. Proper ESD precautions should be taken during handling and assembly.

9.3 Chemical Compatibility

Avoid exposure to sulfur compounds above 100 ppm. Halogen content (chlorine and bromine) must be controlled. Use only approved cleaning solvents such as isopropyl alcohol; ultrasonic cleaning is not recommended.

9.4 Thermal Design

Heat generation can reduce luminous efficacy and shift color. Ensure adequate thermal management to keep junction temperature below 95°C. The thermal resistance of 115°C/W means that at 30 mA, the power dissipation is about 0.1W, leading to a temperature rise of about 11.5°C above the solder point.

10. Reliability Testing

The product has passed the following reliability tests: reflow soldering (2 times at 260°C), thermal shock (-40°C to 100°C, 300 cycles), high temperature storage (100°C, 1000 hours), low temperature storage (-40°C, 1000 hours), life test at 30 mA and 25°C (1000 hours), and high temperature high humidity life test (60°C/90%RH, 30 mA, 1000 hours). Criteria: Vf change ≤10%, luminous flux maintenance ≥90%, no open/short/flicker.

11. Application Notes

For optimal performance, use constant current driving with appropriate current-limiting resistors. The typical forward current is 30 mA, but it can be adjusted up to 40 mA absolute maximum. Consider the binning tolerance for consistent color and brightness in arrays. The wide viewing angle makes these LEDs suitable for indicator and backlighting applications. Due to the silicone encapsulation, avoid dust contamination and clean with isopropyl alcohol if needed.

12. Working Principle

This white LED uses a blue-emitting InGaN chip that pumps a yellow phosphor (typically YAG:Ce). The combination of blue and yellow light produces white light. Different color temperatures are achieved by adjusting the phosphor composition and concentration.

13. Market Trends and Developments

The industry trend continues towards higher efficacy, smaller packages, and better color quality. This PLCC-2 package offers a good balance of size and thermal performance. Improvements in phosphor technology have enabled wider color gamut and higher CRI values. The product complies with RoHS and is suitable for general lighting applications.

14. Frequently Asked Questions

14.1 Can I drive these LEDs at 60 mA?

No, the absolute maximum forward current is 40 mA. For reliable operation, stay within 30 mA typical or design with proper derating for temperature.

14.2 What is the recommended storage humidity?

Before opening the bag, store at ≤75% RH. After opening, use within 24 hours at ≤60% RH or bake before use.

14.3 How can I ensure color consistency across multiple LEDs?

Use LEDs from the same bin (chromaticity and flux bin) and ensure proper thermal management.

14.4 Is the LED resistant to sulfur environments?

The LED encapsulation is silicone, which is sensitive to sulfur compounds. Keep sulfur concentration below 100 ppm in the environment.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.