Yellow LED 3.2x3.0x0.6mm Specification - Forward Voltage 5.4-6.6V - Power 1.32W - Luminous Flux 83.7-117lm - Automotive Grade

1. Product Overview

This Yellow LED is a high-performance surface-mount device designed for demanding automotive lighting applications. The component is fabricated using a blue chip combined with a yellow phosphor conversion layer, producing a saturated yellow emission with excellent color stability. The package measures 3.2mm x 3.0mm x 0.6mm (length x width x height), making it suitable for space-constrained designs while offering high luminous output. Key specifications include a typical forward voltage of 5.4V to 6.6V at 150mA, luminous flux ranging from 83.7lm to 117lm, and a maximum power dissipation of 1.32W. The LED is qualified according to the AEC-Q101 stress test standard for automotive-grade discrete semiconductors, ensuring reliability under harsh operating conditions. It is supplied in tape and reel packaging with 4000 pieces per reel, compatible with standard SMT assembly processes.

1.1 General Description

The Yellow LED is a surface-mount device (SMD) that utilizes a blue LED chip coated with a phosphor material to convert blue light into yellow light. The package is constructed with an EMC (Epoxy Molding Compound) material, which provides excellent heat resistance, mechanical strength, and optical performance. The product dimensions are precisely 3.20mm x 3.00mm x 0.60mm, with tolerances of ±0.2mm unless otherwise specified. The LED features a wide viewing angle of 120 degrees (half-intensity angle), making it ideal for indicator and illumination applications that require broad light distribution.

1.2 Features

• EMC package for enhanced thermal and mechanical reliability
• Extremely wide viewing angle (2θ1/2 = 120°)
• Suitable for all SMT assembly and solder processes (compatible with reflow soldering)
• Available on tape and reel (4000 pcs/reel)
• Moisture sensitivity level: Level 2 (according to JEDEC)
• Compliant with RoHS and REACH requirements
• Qualified per AEC-Q101 Stress Test Qualification for Automotive Grade Discrete Semiconductors

1.3 Applications

Automotive lighting both interior and exterior applications, including but not limited to: instrument panel indicators, button backlighting, ambient lighting, turn signal indicators, and decorative lighting. The wide operating temperature range (-40°C to +110°C) and high reliability make it suitable for under-hood and exterior lighting where temperature extremes and vibration are present.

2. In-depth Technical Parameters Interpretation

2.1 Electrical & Optical Characteristics (at Ts=25°C)

The forward voltage range is relatively wide (5.4V to 6.6V), which is typical for phosphor-converted yellow LEDs using a blue chip with high forward voltage. The luminous flux binning ensures consistent brightness selection. The thermal resistance of 21°C/W (max) indicates efficient heat transfer from the junction to the solder point, crucial for maintaining junction temperature below the maximum rating of 125°C.

2.2 Absolute Maximum Ratings

The absolute maximum ratings must never be exceeded during operation. The power dissipation limit of 1320mW corresponds to 180mA at an approximate forward voltage of 7.33V; however, actual voltage at 180mA may be higher due to VF characteristics. Designers should ensure adequate heat sinking to keep the junction temperature below 125°C. The ESD rating of 8000V (HBM) provides robust protection against electrostatic discharge, but standard ESD precautions are still recommended during handling.

2.3 Thermal Characteristics and Design Considerations

The thermal resistance RTHJ-S of 21°C/W (maximum) indicates that for each watt of power dissipated, the junction temperature will rise 21°C above the solder point temperature. At the typical operating current of 150mA and typical VF of about 6.0V, power dissipation is 0.9W, resulting in a junction-to-solder temperature rise of approximately 18.9°C. If the ambient temperature is 85°C, the junction temperature would be about 104°C, safely below the 125°C limit. However, at maximum rated current (180mA) with worst-case VF, the power could approach 1.19W, leading to a 25°C rise, which at 85°C ambient would reach 110°C, still acceptable but leaving less margin. Proper PCB thermal design with adequate copper area and thermal vias is essential to maintain low solder point temperature.

3. Binning System Explanation

The LED is sorted into bins based on forward voltage and luminous flux to ensure consistent performance for customers. The binning is performed at IF=150mA.

3.1 Forward Voltage Bins

3.2 Luminous Flux Bins

The chromaticity bin is designated as "5E" with specific CIE coordinates provided in the specification. The color coordinates are tightly controlled within the defined quadrilateral on the CIE 1931 chromaticity diagram, ensuring consistent yellow color appearance. The bins allow customers to select the trade-off between brightness and forward voltage, optimizing driver efficiency and light output uniformity in arrays.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (I-V Curve)

The forward voltage increases with forward current in a typical diode characteristic. At low currents (e.g., 30mA), VF is approximately 5.5V, while at 150mA it reaches around 6.0V (typical). The curve shows a nearly linear relationship in this operating range, which is expected for LEDs driven in the ohmic region. Designers should account for VF variation with current when using constant-voltage drive; a series resistor or constant-current driver is recommended.

4.2 Relative Intensity vs. Forward Current

The relative light output increases with current but with less than linear gain at higher currents due to efficiency droop. At 150mA, relative intensity is approximately 100% (reference). Doubling the current to 300mA (not recommended, as max is 180mA) would yield only about 160% relative intensity, demonstrating thermal and efficiency losses. Operating near the maximum rated current provides the best compromise between brightness and efficiency.

4.3 Temperature Dependence

The solder temperature (Ts) has a significant effect on light output and forward voltage. As temperature increases from 25°C to 125°C, relative luminous intensity drops by about 30% (from 100% to approximately 70%). This is due to increased non-radiative recombination at higher junction temperatures. Forward voltage decreases with increasing temperature at a rate of approximately -2 mV/°C (observed from the VF vs. Ts curve). Therefore, thermal management is critical to maintain consistent brightness, especially in automotive environments where ambient temperatures can reach 85°C or higher.

4.4 Radiation Pattern and Chromaticity Shift

The LED has a symmetric radiation pattern with a half-intensity angle of ±60°, providing a wide beam suitable for indicator and area lighting. Chromaticity coordinates shift with drive current; the specification shows that Δx and Δy change by less than 0.015 over the current range from 0 to 200mA, indicating good color stability. The spectral distribution peaks around 590-600 nm (yellow region) with a full-width at half-maximum (FWHM) typical of phosphor-converted LEDs.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED package has a top view dimension of 3.20mm x 3.00mm, with a thickness of 0.60mm. The bottom view shows a central pad for thermal and electrical connection, with dimensions: 2.30mm (width) x 1.80mm (height) and two cathode/anode pads on the sides. The recommended soldering pattern suggests a central thermal pad of 2.6mm x 2.1mm and smaller pads for the terminals. Polarity is clearly marked on the package by a notch on the cathode side. All dimensions have a tolerance of ±0.2mm unless otherwise noted.

5.2 Soldering Footprint Recommendation

The recommended PCB footprint is provided in the specification. It includes a large thermal pad (2.6mm x 2.1mm) to dissipate heat effectively, and smaller pads for the anode and cathode (0.9mm x 0.4mm each). The spacing between the thermal pad and the side pads ensures adequate insulation while allowing solder paste application. The footprint is designed to match the package bottom dimensions with slight overprinting for reliable solder joints.

6. Assembly and Soldering Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile conforms to JEDEC standards for lead-free soldering. Key parameters: preheat from 150°C to 200°C for 60-120 seconds; ramp-up rate ≤3°C/s from Tsmax to peak; time above 217°C (TL) up to 60 seconds; peak temperature 260°C for a maximum of 10 seconds; cooling rate ≤6°C/s. The total time from 25°C to peak should not exceed 8 minutes. The profile ensures proper solder wetting without exceeding the package's temperature tolerance.

6.2 Precautions

• Reflow soldering should not be performed more than twice. If the interval between two soldering processes exceeds 24 hours, the LED may be damaged due to moisture absorption.
• Do not apply mechanical stress to the LED during heating.
• After soldering, do not warp the PCB or apply excessive vibration during cooling.
• Rapid cooling after soldering is not recommended (avoid quenching).
• When repairing with a soldering iron, use a double-head iron and ensure the LED characteristics are not affected.

6.3 Handling and Storage

The LED is moisture-sensitive and classified as MSL Level 2. Unopened vacuum-sealed bags can be stored at ≤30°C and ≤75% RH for up to one year. After opening, the LEDs should be used within 24 hours if stored at ≤30°C and ≤60% RH. If exceeding these conditions or if the desiccant has expired, baking is required at 60±5°C for ≥24 hours. Do not directly touch the silicone lens surface; handle the component by its sides using tweezers.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The LEDs are supplied in tape and reel packaging. Each reel contains 4000 pieces. The carrier tape has dimensions: A0=3.30±0.1mm, B0=3.50±0.1mm, K0=0.90±0.1mm, pitch P0=4.00±0.1mm, P1=4.00±0.1mm, P2=2.00±0.05mm, width W=8.00±0.1mm, thickness T=0.20±0.05mm, E=1.75±0.1mm, F=3.50±0.1mm, D0=1.50±0.1mm, D1=1.10±0.1mm. The reel diameter is 180mm, width 12mm, hub diameter 60mm, and spindle hole diameter 13.0mm. Each reel is placed in a moisture barrier bag with a desiccant and humidity indicator card, then packed in a cardboard box.

7.2 Label Information

The label on each reel includes the part number, specification number, lot number, bin code (including luminous flux and chromaticity bin), forward voltage bin, wavelength code, quantity, and date code. This information allows full traceability and selection of desired bins for production.

8. Application Guidance

8.1 Typical Applications

Primarily designed for automotive interior and exterior lighting, this yellow LED can be used for dashboard indicators, switch backlighting, ambient accent lighting, turn signal indicators (in combination with appropriate reflectors), and rear combination lamp functions. Its wide viewing angle makes it suitable for panel illumination where uniform brightness is required across a large area. It can also be used in non-automotive applications such as traffic signals, warning lights, and decorative lighting where the color and reliability are essential.

8.2 Design Considerations

• Thermal management: Ensure adequate heat sinking through PCB thermal vias and copper planes to keep the solder point temperature within limits, especially when multiple LEDs are densely packed.
• Current driving: Use a constant-current driver to maintain stable luminous flux. If using voltage drive, include a series resistor to limit current and account for VF variation.
• ESD protection: Although ESD rating is 8000V, use ESD-safe handling procedures and consider adding TVS diodes in the circuit if long traces are present.
• Optical design: The wide emission angle requires secondary optics if a narrower beam is desired. Avoid placing reflective surfaces too close to the package to prevent unwanted feedback.
• Chemical compatibility: Avoid exposure to sulfur, bromine, chlorine compounds above specified limits (S ≤100ppm, Br <900ppm, Cl <900ppm, total Br+Cl <1500ppm). Do not use adhesives that outgas organic vapors.

9. Technical Comparison with Alternative Products

Compared to conventional yellow LEDs using direct bandgap GaAsP/GaP materials, this phosphor-converted yellow LED offers higher luminous efficacy and better color stability over temperature. However, the forward voltage is higher (5.4-6.6V vs. ~2V for standard yellow LEDs) due to the use of a blue chip and phosphor conversion. This requires a higher supply voltage but provides a more saturated yellow color with improved reliability in high-temperature automotive environments. The AEC-Q101 qualification adds a level of assurance not always available in standard commercial LEDs. Compared to multi-chip RGB solutions, this single-chip yellow LED simplifies drive circuitry and eliminates color mixing inconsistencies. The EMC package provides superior thermal and mechanical performance compared to traditional PPA (polyphthalamide) packages, making it suitable for harsh environments.

10. Frequently Asked Questions

• Q: Can this LED be used in parallel strings? A: Yes, but careful attention must be paid to forward voltage binning to avoid current imbalance. Use individual series resistors or a current mirror for each LED.
• Q: What is the typical lifetime? A: The specification does not explicitly provide L70/B50 life data, but based on the AEC-Q101 qualification and the junction temperature limit, an estimated lifetime of several thousand hours at rated conditions is expected.
• Q: Is the LED compatible with lead-free soldering? A: Yes, the reflow profile is designed for lead-free soldering with a peak temperature of 260°C.
• Q: Can the LED be cleaned after soldering? A: Isopropyl alcohol is recommended. Ultrasonic cleaning is not recommended as it may damage the LED.
• Q: What is the recommended storage condition after opening the bag? A: Store at ≤30°C and ≤60% RH, and use within 24 hours. If not used, bake at 60±5°C for ≥24 hours before use.

11. Practical Usage Cases

Case 1: Automotive interior ambient lighting. A strip of 20 LEDs is placed along the dashboard to provide yellow ambient lighting. The LEDs are driven at 150mA each using a constant-current boost converter (12V input). The total power is about 18W, requiring aluminum PCB for heat dissipation. The wide viewing angle ensures uniform illumination across the cabin.

Case 2: Exterior turn signal module. A reflector-based optical system uses 8 LEDs to achieve required luminous intensity for ECE regulation. The LEDs are binned to tight VF and flux groups (S2 and SA bins) to ensure equal brightness and minimal voltage variation. The module passes thermal shock and humidity tests per automotive standards.

Case 3: Button backlighting in infotainment system. 1-2 LEDs per button provide distinct yellow indication. The low height (0.6mm) allows mounting behind thin light guides. Reliability testing shows no failures after 1000 hours at 105°C ambient.

12. Technical Principle Explanation

This Yellow LED uses a blue-emitting InGaN LED chip as the primary light source. The blue light (peak wavelength ~450 nm) is partially absorbed by a yellow phosphor (typically YAG:Ce3+ or similar) that is embedded in the silicone encapsulation. The phosphor re-emits light in a broad spectral band centered around 550-600 nm (yellow). The combination of the remaining blue light and the yellow emission can produce a perceived yellow color. However, in this product, the phosphor is designed to convert nearly all blue light, resulting in a saturated yellow emission with minimal blue component. The color coordinates defined in the bin "5E" correspond to a specific point in the CIE 1931 color space, ensuring consistent color appearance.

13. Development Trends

The trend in automotive LED lighting is toward higher luminous efficacy, smaller packages, and better thermal management. This product's EMC package represents an evolution from traditional PPA packages, offering improved thermal conductivity and reliability. Future developments may include higher voltage chips to reduce current for the same power, improved phosphor materials to reduce thermal quenching, and integration with smart driver ICs. The adoption of AEC-Q101 qualification as a baseline for automotive LEDs is becoming standard, pushing suppliers to invest in rigorous testing. Additionally, the demand for unique colors and dynamic lighting (e.g., adaptive headlights) is driving advances in multi-chip and tunable solutions, but single-color high-reliability LEDs like this yellow device remain essential for cost-effective and robust designs.