3.0mm x 3.0mm x 0.55mm SMD Yellow LED Datasheet - 2.0-2.6V Forward Voltage - ~1.09W Power Dissipation - English Technical Documentation

1. Product Overview

This document provides comprehensive technical data for a high-brightness yellow Surface-Mount Device (SMD) Light Emitting Diode (LED). The device utilizes an AlGaInP semiconductor chip to produce yellow light and is housed in a compact 3.0 mm x 3.0 mm x 0.55 mm package. Primarily engineered for the demanding requirements of the automotive industry, this LED offers a combination of performance, reliability, and suitability for automated assembly processes.

1.1 Technical Parameter Deep Dive

The core specifications define the operational boundaries and performance of the LED under standard conditions (Ts=25°C). The absolute maximum ratings are critical for ensuring long-term reliability and must not be exceeded. The forward voltage (VF) is specified between 2.0V and 2.6V at a test current of 350mA, indicating the voltage drop across the diode when illuminated. The luminous flux output ranges from 40.9 lm to 55.3 lm at the same current, defining its brightness. The dominant wavelength (λD) falls within the yellow spectrum, specifically between 587.5 nm and 595 nm. A wide viewing angle of 120 degrees (typical) ensures broad, even illumination. Key absolute maximums include a forward current (IF) of 420 mA, a peak forward current (IFP) of 700 mA under pulsed conditions, a reverse voltage (VR) of 5V, and an electrostatic discharge (ESD) tolerance of 2000V (HBM). The operating and storage temperature range is specified from -40°C to +125°C, with a maximum junction temperature (TJ) of 150°C.

1.2 Core Advantages and Target Market

The LED is designed with several key features that make it suitable for high-reliability applications. It uses an Epoxy Molding Compound (EMC) package, which offers superior resistance to heat and ultraviolet light compared to traditional plastics, enhancing long-term color stability and lumen maintenance. Its extremely wide viewing angle is ideal for applications requiring uniform area lighting. The product is fully compatible with standard Surface-Mount Technology (SMT) assembly and soldering processes, facilitating high-volume manufacturing. It is supplied on tape and reel for automated pick-and-place equipment. It meets Moisture Sensitivity Level (MSL) 2 requirements and is compliant with RoHS directives. Crucially, its qualification testing is aligned with the AEC-Q102 guideline for stress test qualification of automotive-grade discrete semiconductors, making it a robust choice for the primary target market: automotive lighting, both for interior and exterior applications.

2. In-Depth Technical Specifications

2.1 Photometric and Electrical Characteristics

The photometric performance is centered around a test current of 350mA. The forward voltage binning structure is divided into three ranges: C0 (2.0-2.2V), D0 (2.2-2.4V), and E0 (2.4-2.6V). The luminous flux is similarly binned into NB (40.9-45.3 lm), OA (45.3-50.0 lm), and OB (50.0-55.3 lm). The dominant wavelength is categorized into D2 (587.5-590 nm), E1 (590-592.5 nm), and E2 (592.5-595 nm). This three-dimensional binning (Voltage, Flux, Wavelength) allows designers to select components with tightly grouped characteristics for consistent performance in their applications. The thermal resistance, a key parameter for thermal management, is specified as Rth JS real = 11°C/W (typical) and Rth JS electrical = 9°C/W (typical), measured from the junction to the solder point. These values are critical for calculating the junction temperature under operating conditions to ensure it remains below the 150°C maximum.

2.2 Performance Curve Analysis

While specific graphical data is referenced in the source document, typical optical characteristic curves for such a product would include several key plots essential for circuit and thermal design. The Forward Current vs. Forward Voltage (I-V) curve shows the nonlinear relationship between current and voltage, crucial for designing the driving circuit. The Relative Luminous Flux vs. Forward Current curve illustrates how light output increases with current, typically in a sub-linear manner at higher currents due to heating effects. The Relative Luminous Flux vs. Junction Temperature curve is vital, showing the depreciation of light output as the LED's junction temperature rises; effective heat sinking is necessary to minimize this drop. The Spectral Power Distribution curve would show the peak at the dominant yellow wavelength and the shape of the emitted light spectrum. Finally, the Viewing Angle Pattern would depict the spatial distribution of light intensity, confirming the 120-degree wide beam angle.

3. Mechanical, Packaging & Assembly

3.1 Mechanical and Package Information

The LED features a compact footprint with dimensions of 3.0 mm in length, 3.0 mm in width, and a height of 0.55 mm. Detailed dimensional drawings include top, side, and bottom views. The bottom view clearly shows the anode and cathode pad layout, which is asymmetrical to ensure correct polarity during placement. A recommended solder pad pattern (land pattern) is provided for Printed Circuit Board (PCB) design, with dimensions of 2.40 mm x 1.55 mm for the cathode pad and 0.55 mm x 0.65 mm for the anode pad, with a gap of 0.50 mm between them. Adhering to this land pattern is essential for achieving a reliable solder joint and proper self-alignment during reflow.

3.2 Solder Reflow and Assembly Guidelines

The component is designed for standard SMT reflow soldering processes. Specific instructions are provided to ensure reliability. The Moisture Sensitivity Level (MSL) is classified as Level 2. This means the device can be exposed to factory ambient conditions (≤ 30°C / 60% RH) for up to one year. If the protective moisture barrier bag is opened, the components must be soldered within 168 hours (1 week) under the same conditions, unless they are baked according to standard procedures (e.g., 125°C for 24 hours) to remove absorbed moisture. Failure to follow MSL handling can lead to popcorn cracking or delamination during the high-temperature reflow soldering process. A standard lead-free reflow profile with a peak temperature not exceeding 260°C is applicable.

3.3 Packaging and Ordering Information

The LEDs are supplied packaged for automated assembly. They are housed in embossed carrier tape with specified pocket dimensions to securely hold the 3.0x3.0mm component. This tape is wound onto standard reels. The reel dimensions (such as outer diameter, hub diameter, and width) conform to common industry standards (like EIA-481) to ensure compatibility with automated placement equipment. Labeling on the reel provides traceability information, including part number, quantity, lot number, and date code. For storage and shipping, multiple reels are packed in moisture barrier bags with desiccant and humidity indicator cards to maintain the MSL 2 rating, and then placed in cardboard boxes.

4. Application Engineering & Design Considerations

4.1 Application Suggestions and Design Notes

The primary application is automotive lighting. This includes interior applications such as dashboard backlighting, switch illumination, and ambient lighting, as well as exterior applications like side marker lights, turn signal indicators, and daytime running lights (often in combination with other colors). When designing with this LED, thermal management is paramount. The maximum forward current of 420mA should not be used continuously without verifying that the junction temperature remains below 150°C. Designers must calculate the junction temperature (Tj) using the formula: Tj = Ts + (Rth JS * PD), where Ts is the solder point temperature, Rth JS is the thermal resistance, and PD is the power dissipation (VF * IF). Adequate PCB copper area (thermal pad) and potential heat sinking are necessary to dissipate heat. The driver circuit should be current-controlled, not voltage-controlled, to ensure stable light output and prevent thermal runaway.

4.2 Technical Comparison and Differentiation

Compared to other yellow LEDs or traditional incandescent bulbs for automotive use, this device offers distinct advantages. Against other SMD yellows, its AEC-Q102 qualification is a key differentiator for automotive-grade reliability. The use of an EMC package provides better performance retention under high-temperature and high-humidity conditions compared to standard PPA or PCT plastics. Its 3.0x3.0mm footprint is a common size, offering a balance between light output and board space. When compared to through-hole LEDs, the SMD format enables smaller, lighter, and more automatable designs. The wide 120-degree viewing angle reduces the number of LEDs needed for uniform illumination compared to narrower-angle devices.

4.3 Frequently Asked Questions (Based on Technical Parameters)

Q: What is the recommended operating current?

A: While the absolute maximum is 420mA, the standard test and binning condition is 350mA. This is a typical recommended operating point that balances good light output with manageable heat generation. The actual operating current should be determined based on the thermal design of the application.

Q: How do I interpret the VF, Flux, and WD bins?

A: The product is characterized into bins for forward voltage (C0/D0/E0), luminous flux (NB/OA/OB), and dominant wavelength (D2/E1/E2). The specific part number ordered will include codes specifying its bin combination, ensuring you receive LEDs with consistent electrical and optical properties.

Q: Why is the thermal resistance given as two different values (\"real\" and \"electrical\")?

A: The \"real\" thermal resistance is measured using a temperature sensor. The \"electrical\" method infers the junction temperature from changes in the LED's forward voltage, which is temperature-dependent. Both are valid; the electrical method is often more practical for in-situ measurement, while the real method is a direct calibration.

Q: Can I drive this LED with a 5V supply?

A: Not directly without a current-limiting circuit. The forward voltage is only 2.0-2.6V. Connecting it directly to 5V would cause excessive current to flow, immediately damaging the device. A series resistor or, preferably, a constant-current driver circuit must be used.

5. Technical Deep Dive: Principles and Context

5.1 Operating Principle Introduction

The yellow light emission is based on the electroluminescence principle in aluminum gallium indium phosphide (AlGaInP) semiconductors. When a forward voltage is applied across the p-n junction of the diode, electrons and holes are injected into the active region. These charge carriers recombine, releasing energy in the form of photons. The specific bandgap energy of the AlGaInP material composition determines the wavelength (color) of the emitted light. In this case, the bandgap is engineered to produce photons in the yellow region of the visible spectrum (approximately 590 nm). The epoxy molding compound (EMC) encapsulant protects the semiconductor chip, provides mechanical stability, and shapes the light output through its lens design to achieve the wide viewing angle.

5.2 Application Case Study

Consider the design of an automotive door puddle light, which projects light onto the ground when the door is opened. A designer might select 2-4 of these yellow LEDs for a warm, welcoming effect. They would design a small PCB with the recommended solder pad layout. The LEDs would be driven by a simple constant-current circuit, perhaps integrated into the body control module, set to 300-350mA per LED. The wide 120-degree viewing angle of the LED ensures a broad, even pool of light without dark spots, reducing the number of components needed. The AEC-Q102 qualification ensures the lights will function reliably across the vehicle's entire temperature range, from freezing cold winters to hot summer days, and throughout the vehicle's lifespan. The EMC package ensures the yellow color does not shift significantly over time due to heat from the LED itself or exposure to sunlight.

5.3 Industry Trends and Context

p>The use of LEDs in automotive lighting continues to grow, driven by advantages in energy efficiency, design flexibility, compact size, and long lifespan. There is a clear trend towards more sophisticated and dynamic lighting functions, such as animated turn signals and adaptive ambient lighting. Yellow LEDs remain essential for specific signal functions (turn indicators) and for aesthetic ambient lighting. The industry demands increasingly higher reliability and performance standards, which is reflected in the adoption of guidelines like AEC-Q102. Furthermore, there is ongoing development to improve the efficiency (lumens per watt) and color consistency of LEDs, as well as to enhance package materials for even better thermal performance and longevity in harsh automotive environments. The move towards smaller, more powerful packages also continues, enabling sleeker light designs.