Hoja de Datos del LED EMC3030 a Todo Color - Dimensiones 3.0x3.0mm - Voltaje 1.6-3.4V - Potencia 0.468-0.648W - Documento Técnico en Español

1. Descripción General del Producto

La serie EMC3030 es un LED de montaje superficial a todo color de alto rendimiento, diseñado para aplicaciones de iluminación exigentes. Este componente integra chips rojo, verde y azul (RGB) dentro de un encapsulado compacto de 3.0mm x 3.0mm, permitiendo crear un amplio espectro de colores mediante mezcla aditiva de color. Su enfoque principal de diseño es ofrecer una alta salida luminosa y eficacia, manteniendo una operación robusta bajo corrientes de accionamiento elevadas.

Core Advantages: The key strengths of this LED include its high lumen output, suitability for high-current operation, and low thermal resistance. These features contribute to stable performance and long operational life in various environments.

Target Market: This LED is engineered for applications requiring vibrant, dynamic, or tunable white light. Its primary target markets are outdoor lighting and architectural lighting, where color effects, durability, and energy efficiency are paramount.

2. Análisis Profundo de Parámetros Técnicos

Esta sección proporciona una interpretación objetiva y detallada de los parámetros técnicos clave especificados en la hoja de datos.

2.1 Características Electro-Ópticas

The luminous flux output is measured at a standard test current (I_F) of 150mA and an ambient temperature (T_a) of 25°C. The typical ranges are:

• Red Chip: 22 to 28 lumens (lm)
• Green Chip: 44 to 51 lm
• Blue Chip: 7 to 12 lm

Se aplica una tolerancia de medición de ±7% a estos valores de flujo luminoso. La temperatura de color correlacionada (CCT) para las mezclas de luz blanca se deriva del diagrama de cromaticidad CIE 1931 basado en la salida combinada de los chips individuales.

The device features a wide viewing angle (2θ_1/2) of 120 degrees, which is the off-axis angle where luminous intensity drops to half of its peak value. This ensures a broad and even light distribution.

2.2 Parámetros Eléctricos

The forward voltage (V_F) varies by chip color at I_F = 150mA:

• Red: 1.6V to 2.6V (Typical)
• Green: 2.6V to 3.4V (Typical)
• Blue: 2.6V to 3.4V (Typical)

The forward voltage measurement tolerance is ±0.1V. The reverse voltage (V_R) rating for all chips is a maximum of 5V, with a reverse current (I_R) of less than 10µA at this voltage. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

2.3 Especificaciones Térmicas y Máximas Absolutas

Operar el LED más allá de estos límites puede causar daños permanentes.

• Maximum Forward Current (I_F): 180mA (Continuous) for all colors.
• Maximum Pulse Forward Current (I_FP): 250mA (Pulse width ≤100µs, Duty cycle ≤1/10).
• Maximum Power Dissipation (P_D):
  • Red: 468 mW
  • Verde: 648 mW
  • Azul: 648 mW
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +105°C.
• Thermal Resistance (R_{th j-sp}): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 5°C/W for all colors at I_F=150mA. This low value is crucial for effective heat management.

It is critically important that the total power dissipation in the application does not exceed the specified P_D ratings to ensure reliability.

3. Explicación del Sistema de Clasificación

The LEDs are sorted (binned) according to key performance parameters to ensure consistency in production runs. The binning is performed at I_F = 150mA and T_a = 25°C.

3.1 Clasificación por Longitud de Onda Dominante

Esto define el color preciso de la luz emitida por cada chip.

• Red: Binned into codes RB2 (615-620nm), RC1 (620-625nm), and RC2 (625-630nm).
• Green: Binned into a single code GC3, covering a range from 520nm to 535nm in 2.5nm steps (e.g., 520-522.5nm, 522.5-525nm, etc.).
• Blue: Binned into multiple codes: BB3 (450-452.5nm), BB4 (452.5-455nm), up to BC6 (467.5-470nm).

La tolerancia para la medición de longitud de onda es de ±1nm.

3.2 Clasificación por Flujo Luminoso

Los LEDs se agrupan en función de su salida de luz.

• Red: Code DR0 (22-28 lm)
• Green: Code DG0 (44-51 lm)
• Blue: Code DB0 (7-12 lm)

La tolerancia para la medición del flujo luminoso es de ±7%.

3.3 Clasificación por Voltaje Directo

Esta clasificación asegura la compatibilidad eléctrica en el diseño del circuito. Los rangos de voltaje van desde AB2 (1.8-2.0V) hasta AF1 (3.2-3.4V), con una tolerancia de medición de ±0.1V.

4. Análisis de Curvas de Rendimiento

La hoja de datos incluye varios gráficos que ilustran el comportamiento del LED bajo diferentes condiciones. Comprenderlos es clave para un diseño óptimo.

• Forward Current vs. Relative Intensity (Fig. 3): This curve shows how light output increases with drive current. It is typically non-linear, and operating near the maximum current may reduce efficacy and lifespan.
• Forward Current vs. Forward Voltage (Fig. 4): This IV curve is essential for driver design. The forward voltage increases with current, and the relationship differs slightly between the red, green, and blue chips due to their different semiconductor materials.
• Ambient Temperature vs. Relative Luminous Flux (Fig. 5): This graph demonstrates thermal derating. As the ambient temperature rises, the light output decreases. Designers must account for this to maintain consistent brightness in warm environments.
• Ambient Temperature vs. Relative Forward Voltage (Fig. 6): The forward voltage typically decreases as temperature increases. This characteristic is important for constant-current driver stability.
• Ambient Temperature vs. Maximum Forward Current (Fig. 7): This derating curve is critical. It shows the maximum allowable forward current must be reduced as ambient temperature increases to prevent overheating. For example, at 85°C, the maximum current for the red chip is approximately 136.4mA, and for green/blue chips, it is around 93.7mA and 90.9mA respectively.
• Color Spectrum (Fig. 1) & Viewing Angle Distribution (Fig. 2): These figures provide visual references for the spectral output and beam pattern of the LED.

5. Información Mecánica y del Encapsulado

5.1 Dimensiones del Encapsulado

El LED está alojado en un encapsulado de montaje superficial EMC3030. Las dimensiones generales son 3.0mm de largo y 3.0mm de ancho. El dibujo mecánico detallado especifica la ubicación exacta de los chips LED, las marcas de cátodo/ánodo y la estructura de la lente. La tolerancia general para las dimensiones es de ±0.2mm a menos que se indique lo contrario.

5.2 Diseño Recomendado de la Pista de Soldadura

Se proporciona un patrón de pistas (huella) para el diseño de PCB. Adherirse a este diseño de pista recomendado es esencial para una soldadura confiable, una correcta transferencia térmica y para prevenir el efecto "tombstoning" durante el reflujo. Las dimensiones de la pista tienen una tolerancia de ±0.1mm.

5.3 Identificación de Polaridad

El encapsulado incluye marcas para identificar el terminal del cátodo (negativo) de cada chip de color. La conexión correcta de la polaridad es obligatoria para evitar dañar el LED.

6. Pautas de Soldadura y Montaje

6.1 Parámetros de Soldadura por Reflujo

El LED es compatible con procesos de soldadura por reflujo sin plomo (Pb-free). El perfil especificado es crítico:

• Peak Package Body Temperature (T_p): Maximum 260°C.
• Time above Liquidous (T_L=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (T_L to T_p): Maximum 3°C/second.
• Ramp-down Rate (T_p to T_L): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Seguir estrictamente este perfil previene el choque térmico y daños al encapsulado del LED y a las conexiones internas de alambre.

6.2 Precauciones de Manipulación y Almacenamiento

Los LEDs son sensibles a la descarga electrostática (ESD). Utilice procedimientos de manipulación seguros contra ESD (pulseras, tapetes conductores). Almacene en un entorno seco y antiestático dentro del rango de temperatura especificado (-40°C a +105°C). Evite la exposición a la humedad antes de soldar; si es necesario, siga las instrucciones de horneado del fabricante.

7. Información de Embalaje y Pedido

7.1 Embalaje en Cinta y Carrete

Los LEDs se suministran en cinta portadora con relieve enrollada en carretes para el montaje automatizado pick-and-place. El carrete puede contener un máximo de 5,000 piezas. Se proporciona el dibujo dimensional de la cinta, incluyendo el espaciado de los bolsillos y el diámetro del carrete. La tolerancia acumulada sobre 10 pasos es de ±0.25mm.

7.2 Sistema de Numeración de Piezas

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "3C" for the 3030 package.
• CCT/Color Code: "CW" for RGB (full color).
• Number of Serial/Parallel Chips, Component Code, Color Code: These digits specify internal configurations, binning selections (like wavelength and flux), and other product variants.

Es necesario consultar la tabla completa de clasificación para decodificar un número de pieza específico y conocer sus características de rendimiento exactas.

8. Recomendaciones de Aplicación

8.1 Escenarios de Aplicación Típicos

• Architectural Facade Lighting: Creating dynamic color-changing effects on buildings.
• Outdoor Landscape Lighting: Illuminating pathways, trees, and water features with colored light.
• Signage and Display Backlighting: For vibrant, attention-grabbing signs.
• Entertainment and Stage Lighting: Where programmable color is required.

8.2 Consideraciones Críticas de Diseño

• Thermal Management: This is the most critical factor for longevity. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder point temperature within safe limits, especially when driving at high currents or in high ambient temperatures.
• Drive Current: Use a constant-current driver tailored for RGB LEDs. The current should be set based on the required brightness and thermal derating curves. Do not exceed the absolute maximum ratings.
• Color Mixing and Control: To achieve consistent white light or specific colors, use pulse-width modulation (PWM) to independently control the intensity of each chip. Consider the different luminous efficacies of the red, green, and blue chips in your control algorithm.
• Optics: Secondary optics (lenses, diffusers) may be needed to achieve the desired beam angle and color mixing uniformity.

9. Comparación y Diferenciación Técnica

Aunque la hoja de datos no incluye comparaciones directas con competidores, las especificaciones del EMC3030 destacan su posicionamiento competitivo:

• vs. Smaller Packages (e.g., 3528): The 3030 package typically offers higher power handling and lumen output due to a larger thermal path and potentially larger chip size.
• vs. Standard 5050 RGB LEDs: The 3030 may offer a more compact solution with similar or better performance, allowing for higher pixel density in dense arrays or finer-pitch displays.
• Key Differentiators: The specified low thermal resistance (5°C/W) and high maximum drive current (180mA) suggest a design optimized for thermal performance, enabling sustained high-brightness operation compared to parts with higher thermal resistance.

10. Preguntas Frecuentes (Basadas en Parámetros Técnicos)

Q: Can I drive all three chips (RGB) at 180mA simultaneously?
A: No. The absolute maximum power dissipation (P_D) must not be exceeded. Driving red at 180mA (V_F~2.1V) gives ~378mW, which is below its 468mW limit. However, driving green or blue at 180mA (V_F~3.0V) gives ~540mW, which is below their 648mW limit. The total power for all three would be ~1.46W, which must be dissipated by the PCB/heatsink. More importantly, you must consult the derating curve (Fig. 7) which reduces the allowable current at higher ambient temperatures.

Q: Why is the luminous flux for the blue chip lower than red and green?
A: This is related to human eye sensitivity (photopic response). The eye is least sensitive to blue light (~450-470nm). Therefore, a blue LED requires more radiant power to achieve the same perceived brightness (luminous flux) as a green LED, where the eye's sensitivity peaks. The specified values reflect this physiological reality.

Q: How do I select the correct bin codes for my project?
A: For color-critical applications (e.g., uniform white light across multiple LEDs), you must specify tight bins for dominant wavelength (especially for green and blue) and forward voltage. For less critical applications, wider bins may be acceptable and more cost-effective. Always consult the full binning tables when placing an order.

11. Caso Práctico de Diseño

Scenario: Designing an outdoor architectural linear light with tunable white light (2700K to 6500K).

Implementación:

1. LED Selection: Use the EMC3030 RGB LEDs. The red, green, and blue outputs are mixed to simulate various white points along the black body locus.
2. Thermal Design: The fixture is aluminum. The PCB is a metal-core PCB (MCPCB) to efficiently transfer heat from the LED solder point to the fixture body. Calculations are performed to ensure the junction temperature remains below 85°C at the maximum ambient temperature (e.g., 40°C) and drive current.
3. Electrical Design: A constant-current LED driver with three independent PWM channels is used. The current is set to 150mA per chip, providing a good balance of brightness and efficacy. The forward voltage bins are considered to ensure the driver's compliance voltage is sufficient for all units in production.
4. Optical Design: A milky white diffuser cover is placed over the LED array to blend the individual RGB points into a uniform, glare-free linear light source.
5. Control: A microcontroller runs an algorithm that maps desired CCT values to specific PWM duty cycles for the R, G, and B channels, calibrated based on the actual binning of the LEDs used.

12. Introducción al Principio de Funcionamiento

El EMC3030 es un LED multichip. Cada chip es un diodo semiconductor hecho de diferentes sistemas de materiales:

• Red: Typically based on Aluminum Gallium Indium Phosphide (AlGaInP).
• Green & Blue: Typically based on Indium Gallium Nitride (InGaN).

Cuando se aplica un voltaje directo, los electrones y huecos se recombinan dentro de la región activa del semiconductor, liberando energía en forma de fotones (luz). La longitud de onda específica (color) de la luz está determinada por la energía de la banda prohibida del material semiconductor. Los tres colores primarios (Rojo, Verde, Azul) se combinan de forma aditiva dentro del único encapsulado. Al controlar independientemente la intensidad de cada chip, se puede producir un vasto espectro de colores, incluyendo varios tonos de luz blanca.

13. Tendencias Tecnológicas

El desarrollo de LEDs a todo color como el EMC3030 está impulsado por varias tendencias en curso en la industria de la iluminación:

• Increased Efficacy (lm/W): Continuous improvements in epitaxial growth and chip design lead to higher light output per electrical watt, improving energy efficiency.
• Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and tighter binning processes enable more accurate and consistent color production, which is critical for architectural and retail lighting.
• Higher Power Density and Better Thermal Management: Package designs are evolving to extract heat more efficiently, allowing for higher drive currents and sustained lumen output in compact form factors.
• Integration with Smart Controls: LEDs are increasingly designed to be paired with intelligent drivers and IoT connectivity, enabling dynamic color tuning, scheduling, and data collection for human-centric and energy-saving lighting solutions.
• Miniaturization: The push for smaller pixels in fine-pitch direct-view LED displays continues, though this balances against the need for thermal performance and light output.