Fiche de spécifications pour LED jaune SMD 3030 - Dimensions 3,0 x 3,0 x 0,55 mm - Tension 2,0 à 2,6 V - Couleur jaune - Puissance ~0,8 W

. Product Overview

This document details the specifications for a high-performance Yellow Surface-Mount Device (SMD) Light Emitting Diode (LED). The device features a compact 3.0mm x 3.0mm footprint with a low profile of 0.55mm, making it suitable for space-constrained applications requiring high luminous output and reliability.

.1 Core Advantages and Target Market

The primary advantages of this LED include its Epoxy Molding Compound (EMC) package, which offers excellent thermal and environmental stability, and an extremely wide 120-degree viewing angle for uniform illumination. It is designed for automated SMT assembly processes and is supplied on tape and reel. The product is qualified according to the stringent AEC-Q102 stress test guidelines for automotive-grade discrete semiconductors, making its primary target market automotive lighting for both interior and exterior applications. It is also compliant with RoHS and REACH environmental directives.

. In-Depth Technical Parameter Analysis

The following parameters are defined at a standard test condition of a junction temperature (Tj) of 25°C and a forward current (IF) of 350mA, unless otherwise specified.

.1 Electrical and Optical Characteristics

Forward Voltage (VF):Ranges from a minimum of 2.0V to a maximum of 2.6V, with a typical value of 2.31V. This parameter is critical for driver circuit design and power dissipation calculations.

Luminous Flux (Φ):The light output ranges from 37 lm (minimum) to 55.3 lm (maximum), with a typical value of 45 lm. This high brightness is achieved from the AlGaInP semiconductor material.

Dominant Wavelength (Wd):Defines the perceived color of the LED. It ranges from 587 nm to 597 nm, placing it firmly in the yellow region of the visible spectrum, with a typical value of 590 nm.

Viewing Angle (2θ1/2):The full width at half maximum is 120 degrees, providing a very broad and uniform emission pattern.

Thermal Resistance (RthJ-S):The junction-to-solder point thermal resistance is a maximum of 20 °C/W. This is a key parameter for thermal management design to prevent overheating.

Reverse Current (IR):Is limited to a maximum of 10 µA at a reverse voltage of 5V.

.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. Operating the device continuously at these limits is not advised.

• Power Dissipation (PD): mW
• Continuous Forward Current (IF): mA
• Peak Forward Current (IFP): mA (at 1/10 duty cycle, 10ms pulse width)
• Reverse Voltage (VR): V
• Electrostatic Discharge (ESD) HBM: V (with >90% yield)
• Operating Temperature (TOPR):-40°C to +125°C
• Storage Temperature (TSTG):-40°C to +125°C
• Maximum Junction Temperature (TJ):°C

. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters measured at IF=350mA.

.1 Forward Voltage Binning

Voltage is binned in 0.1V steps from 2.0-2.1V (Bin C1) up to 2.5-2.6V (Bin E2). Designers can select bins to match their power supply requirements and thermal design.

.2 Luminous Flux Binning

Light output is binned into four groups: NA (37.0-40.9 lm), NB (40.9-45.3 lm), OA (45.3-50.0 lm), and OB (50.0-55.3 lm). This allows for selection based on required brightness levels.

.3 Dominant Wavelength Binning

The yellow color is binned into four wavelength ranges: B1 (587-589.5 nm), B2 (589.5-592 nm), C1 (592-594.5 nm), and C2 (594.5-597 nm). This ensures precise color matching within an application, crucial for automotive signaling and interior lighting.

. Performance Curve Analysis

The specification includes typical characteristic curves that illustrate device behavior under varying conditions.

.1 IV Characteristic Curve

The Forward Voltage vs. Forward Current curve shows the non-linear relationship typical of diodes. At the rated 350mA, the voltage is typically 2.31V. The curve is essential for understanding the dynamic resistance of the LED and for designing constant-current drivers.

.2 Optical vs. Electrical/Thermal Characteristics

Other curves typically included (and inferred from the binning data) would show:

- Luminous Flux vs. Forward Current:Light output increases with current but will eventually saturate and decrease due to heating.

- Dominant Wavelength vs. Junction Temperature:The peak wavelength of an AlGaInP LED generally shifts with temperature, which can affect color point stability. Proper thermal management is critical to minimize this shift.

- Forward Voltage vs. Junction Temperature:The forward voltage has a negative temperature coefficient, decreasing as temperature rises. This can be used in some temperature-sensing circuits.

. Mechanical and Package Information

.1 Package Dimensions

The device has a standard 3030 (3.0mm x 3.0mm) footprint. The overall height is 0.55mm ± 0.2mm. Detailed top, side, and bottom views define the exact shape and terminal locations.

.2 Polarity Identification and Solder Pad Design

The cathode is clearly marked on the top of the device. A recommended solder land pattern (footprint) is provided for PCB design. The pattern is asymmetrical (2.40mm x 1.55mm for the anode and 0.65mm x 1.55mm for the cathode), which aids in automated optical inspection (AOI) after soldering and provides a larger thermal pad for the anode to improve heat dissipation.

. Soldering and Assembly Guidelines

.1 SMT Reflow Soldering Profile

The device is suitable for standard SMT reflow processes. A specific reflow soldering temperature profile is recommended, typically including:

- Preheat zone to slowly ramp up temperature and activate flux.

- Soak zone to equalize temperature across the PCB.

- Reflow zone with a peak temperature not exceeding 260°C for a limited time (e.g., 10 seconds above 240°C).

- Controlled cooling zone.

Adherence to this profile prevents thermal shock and ensures reliable solder joints.

.2 Handling and Storage Precautions

The Moisture Sensitivity Level (MSL) is rated Level 2. This means the package can be stored at ambient conditions (<30°C/60% RH) for up to one year. If the factory-sealed dry bag is opened, the components must be soldered within 168 hours (1 week) if kept at <30°C/60% RH, or they must be re-baked before use. Proper ESD precautions (using grounded workstations, wrist straps) are mandatory as the device is sensitive to electrostatic discharge.

. Packaging and Reliability

.1 Packaging Specification

The LEDs are supplied on embossed carrier tape mounted on reels for automated pick-and-place machines. Detailed dimensions for the carrier tape pockets (to hold the 3.0x3.0mm component) and the reel (standard or custom size) are specified. Labeling on the reel provides traceability information like part number, quantity, lot number, and date code.

.2 Reliability Testing

The product undergoes a comprehensive suite of reliability tests based on AEC-Q102. These tests are designed to simulate harsh operating environments and long-term use. Key test items include:

- High Temperature Operating Life (HTOL):Operating the LED at high temperature and current to accelerate aging.

- Temperature Cycling (TC):Cycling between extreme high and low temperatures to test for mechanical stress.

- Humidity Resistance Tests:Exposing the device to high humidity, often with bias applied.

- ESD Tests:Verifying robustness against electrostatic discharge.

Specific conditions (temperature, duration, sample size) and pass/fail criteria (e.g., less than a 10% shift in luminous flux, no catastrophic failure) are defined to ensure automotive-grade quality.

. Application Design Considerations

.1 Typical Application Scenarios

The primary application isautomotive lighting. This includes:

- Exterior:Turn signals, daytime running lights (DRLs), side marker lights, center high-mount stop lights (CHMSL).

- Interior:Dashboard backlighting, switch illumination, ambient lighting, warning indicators.

Its reliability, wide viewing angle, and bright yellow output make it ideal for these safety-critical and aesthetic functions.

.2 Critical Design Considerations

• Thermal Management:The maximum junction temperature of 150°C must not be exceeded. Use the thermal resistance (20°C/W) to calculate the temperature rise from solder point to junction (ΔT = Power * Rth). Ensure the PCB has adequate thermal relief, such as thermal vias connecting the anode pad to an internal ground plane, and consider the operating ambient temperature.
• Current Drive:Always drive the LED with a constant current source, not a constant voltage. The recommended operating current is 350mA, but the design must ensure the absolute maximum of 420mA is never exceeded under any condition, including transients.
• ESD Protection:Incorporate ESD protection diodes on PCB lines connected to the LED terminals, especially in handheld or user-accessible applications, even though the device itself has some inherent robustness.

. Technical Comparative Context

Compared to standard plastic SMD LEDs, this EMC-packaged device offers superior thermal performance, allowing it to sustain higher drive currents and brightness without accelerated lumen depreciation. The AlGaInP material system provides high efficiency in the yellow/amber region compared to phosphor-converted white LEDs, resulting in purer color saturation. The AEC-Q102 qualification places it in a higher reliability tier than commercial-grade LEDs, justifying its use in automotive and other demanding applications.

. Frequently Asked Questions (Based on Technical Parameters)

.1 How do I select the right voltage and flux bin?

Choose a voltage bin that aligns with your driver's output voltage range to maximize efficiency. For brightness consistency in an array, specify a tight flux bin (e.g., OA or OB). For cost-sensitive applications where some variation is acceptable, a wider bin (NA-NB) may be suitable.

.2 What is the most critical factor for long-term reliability?

Controlling the junction temperature is paramount. Exceeding the maximum rating not only risks immediate failure but significantly accelerates long-term lumen degradation. Proper heatsinking via the PCB is essential, especially when driving at or near the maximum current.

.3 Can I use a reflow profile for lead-free solder?

Yes, the provided reflow profile is compatible with standard lead-free (SAC) solder pastes. The key is to not exceed the peak temperature and time-above-liquidus specified in the soldering instructions to avoid damaging the internal die attach and wire bonds.

. Design and Use Case Example

Scenario: Automotive Rear Turn Signal.

A design requires a cluster of 6 yellow LEDs for a bright, wide-angle turn signal. The designer would:

. Select LEDs from the same dominant wavelength bin (e.g., C1) to ensure color uniformity.

. Choose a high luminous flux bin (OB) for maximum visibility.

. Design a PCB with a copper pour under the anode pads of all LEDs, connected via thermal vias to a larger internal layer for heat spreading.

. Use a single constant-current driver chip capable of supplying 6 * 350mA = 2.1A, with appropriate fault protection.

. Follow the recommended solder pad layout and reflow profile during assembly.

This approach ensures a reliable, consistent, and bright automotive lighting solution.

. Technical Principle Introduction

This LED emits yellow light through electroluminescence from a semiconductor chip composed of Aluminum Gallium Indium Phosphide (AlGaInP). When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons. The specific ratio of the Al, Ga, In, and P elements in the crystal lattice determines the bandgap energy, which directly corresponds to the wavelength of light emitted—in this case, approximately 590 nm (yellow). The EMC package encapsulates and protects the fragile semiconductor die, provides the primary optical lens to shape the light beam, and offers a path for heat to escape via the solderable terminals.

. Technology Trends

The general trend for such LEDs is towards higher efficacy (more lumens per watt), enabling brighter signals with lower power consumption and reduced thermal load. There is also a push for increased power density in the same or smaller packages. In automotive applications, integration with smart drivers and controllers for dynamic lighting effects (e.g., sequential turn signals) is becoming more common. Furthermore, advancements in package materials and die attach technologies continue to improve long-term reliability and resistance to harsh environmental conditions like thermal cycling and humidity.