EMC3030 LED Mai Cikakken Launi - Girman 3.0x3.0mm - Ƙarfin Lantarki 1.6-3.4V - Ƙarfin Wutar Lantarki 0.468-0.648W - Takardun Fasaha na Hausa

1. Bayanin Samfurin

Jerin EMC3030 shine babban LED mai hawa a saman, mai cikakken launi wanda aka ƙera don aikace-aikacen haske masu ƙarfi. Wannan bangaren ya haɗa guntayen ja, kore, da shuɗi (RGB) a cikin ƙaramin fakitin 3.0mm x 3.0mm, yana ba da damar ƙirƙirar yalwar launuka ta hanyar haɗa launuka. Babban manufar ƙirarsa shine isar da babban fitar da haske da inganci yayin kiyaye aiki mai ƙarfi a ƙarƙashin manyan igiyoyin kuzari.

Core Advantages: The key strengths of this LED include its high lumen output, suitability for high-current operation, and low thermal resistance. These features contribute to stable performance and long operational life in various environments.

Target Market: This LED is engineered for applications requiring vibrant, dynamic, or tunable white light. Its primary target markets are outdoor lighting and architectural lighting, where color effects, durability, and energy efficiency are paramount.

2. Bincike Mai Zurfi na Sigogi na Fasaha

Wannan sashe yana ba da cikakken fassara, mai ma'ana na mahimman sigogi na fasaha da aka ƙayyade a cikin takardar bayanai.

2.1 Halayen Lantarki da Na Haske

The luminous flux output is measured at a standard test current (I_F) of 150mA and an ambient temperature (T_a) of 25°C. The typical ranges are:

• Red Chip: 22 to 28 lumens (lm)
• Green Chip: 44 to 51 lm
• Blue Chip: 7 to 12 lm

Ƙimar ma'anar ±7% ta shafi waɗannan ƙimar ƙarfin haske. Matsakaicin zafin launi (CCT) don gaurayawan farin haske ana samunsa daga zanen launi na CIE 1931 dangane da haɗakar fitarwa na kowane guntun. Wannan yana nuna cewa launin farin da ake samu ya dogara ne da yadda ake haɗa ƙarfin kowane guntun launi.

The device features a wide viewing angle (2θ_1/2) of 120 degrees, which is the off-axis angle where luminous intensity drops to half of its peak value. This ensures a broad and even light distribution.

2.2 Sigogi na Lantarki

The forward voltage (V_F) varies by chip color at I_F = 150mA:

• Red: 1.6V to 2.6V (Typical)
• Green: 2.6V to 3.4V (Typical)
• Blue: 2.6V to 3.4V (Typical)

The forward voltage measurement tolerance is ±0.1V. The reverse voltage (V_R) rating for all chips is a maximum of 5V, with a reverse current (I_R) of less than 10µA at this voltage. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

2.3 Ƙimar Zafi da Mafi Girma

Aiki da LED fiye da waɗannan iyakoki na iya haifar da lalacewa ta dindindin.

• Maximum Forward Current (I_F): 180mA (Continuous) for all colors.
• Maximum Pulse Forward Current (I_FP): 250mA (Pulse width ≤100µs, Duty cycle ≤1/10).
• Maximum Power Dissipation (P_D):
  • Red: 468 mW
  • Kore: 648 mW
  • Shuɗi: 648 mW
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +105°C.
• Thermal Resistance (R_{th j-sp}): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 5°C/W for all colors at I_F=150mA. This low value is crucial for effective heat management.

It is critically important that the total power dissipation in the application does not exceed the specified P_D ratings to ensure reliability.

3. Bayanin Tsarin Rarrabawa

The LEDs are sorted (binned) according to key performance parameters to ensure consistency in production runs. The binning is performed at I_F = 150mA and T_a = 25°C.

3.1 Rarrabawar Tsawon Tsinkaya

Wannan yana bayyana ainihin launin hasken da kowane guntun ke fitarwa.

• Red: Binned into codes RB2 (615-620nm), RC1 (620-625nm), and RC2 (625-630nm).
• Green: Binned into a single code GC3, covering a range from 520nm to 535nm in 2.5nm steps (e.g., 520-522.5nm, 522.5-525nm, etc.).
• Blue: Binned into multiple codes: BB3 (450-452.5nm), BB4 (452.5-455nm), up to BC6 (467.5-470nm).

Ƙimar ma'anar auna tsawon tsinkaya ita ce ±1nm.

3.2 Rarrabawar Ƙarfin Haske

Ana rarraba LEDs bisa ga ƙarfin hasken da suke fitarwa.

• Red: Code DR0 (22-28 lm)
• Green: Code DG0 (44-51 lm)
• Blue: Code DB0 (7-12 lm)

Ƙimar ma'anar auna ƙarfin haske ita ce ±7%.

3.3 Rarrabawar Ƙarfin Lantarki na Gaba

Wannan rarrabawar tana tabbatar da dacewar lantarki a cikin ƙirar da'ira. Rukunonin ƙarfin lantarki suna kama daga AB2 (1.8-2.0V) zuwa AF1 (3.2-3.4V), tare da ƙimar ma'anar auna ±0.1V.

4. Bincike na Lankwasa Ayyuka

Takardar bayanai ta ƙunshi zane-zane da yawa waɗanda ke kwatanta halayen LED a ƙarƙashin yanayi daban-daban. Fahimtar waɗannan shine mabuɗin ƙira mafi kyau.

• Forward Current vs. Relative Intensity (Fig. 3): This curve shows how light output increases with drive current. It is typically non-linear, and operating near the maximum current may reduce efficacy and lifespan.
• Forward Current vs. Forward Voltage (Fig. 4): This IV curve is essential for driver design. The forward voltage increases with current, and the relationship differs slightly between the red, green, and blue chips due to their different semiconductor materials.
• Ambient Temperature vs. Relative Luminous Flux (Fig. 5): This graph demonstrates thermal derating. As the ambient temperature rises, the light output decreases. Designers must account for this to maintain consistent brightness in warm environments.
• Ambient Temperature vs. Relative Forward Voltage (Fig. 6): The forward voltage typically decreases as temperature increases. This characteristic is important for constant-current driver stability.
• Ambient Temperature vs. Maximum Forward Current (Fig. 7): This derating curve is critical. It shows the maximum allowable forward current must be reduced as ambient temperature increases to prevent overheating. For example, at 85°C, the maximum current for the red chip is approximately 136.4mA, and for green/blue chips, it is around 93.7mA and 90.9mA respectively.
• Color Spectrum (Fig. 1) & Viewing Angle Distribution (Fig. 2): These figures provide visual references for the spectral output and beam pattern of the LED.

5. Bayanin Injiniya da Fakitin

5.1 Girman Fakitin

LED yana cikin fakitin EMC3030 mai hawa a saman. Gabaɗayan girmansa shine 3.0mm tsayi da 3.0mm faɗi. Cikakken zanen injiniya ya ƙayyade ainihin wurin sanya guntayen LED, alamun cathode/anode, da tsarin ruwan tabarau. Gabaɗayan ƙimar ma'anar girman shine ±0.2mm sai dai idan an faɗi akasin haka.

5.2 Tsarin Ƙafar Solder da Ake Shawarwari

An ba da tsarin ƙasa (sawun ƙafa) don ƙirar PCB. Bin wannan shawarar tsarin ƙafar yana da mahimmanci don haɗa abin dogaro, isar da zafi daidai, da hana tashin kabari yayin reflow. Girman ƙafar yana da ƙimar ma'anar ±0.1mm.

5.3 Gano Polarity

Fakitin ya ƙunshi alamomi don gano tashar cathode (maras kyau) na kowane guntun launi. Haɗin polarity daidai ya zama dole don guje wa lalata LED.

6. Jagororin Haɗawa da Tari

6.1 Sigogi na Haɗa ta Reflow

LED ya dace da hanyoyin haɗa reflow marasa gubar (Pb-free). Ƙayyadaddun bayanin martaba yana da mahimmanci:

• Peak Package Body Temperature (T_p): Maximum 260°C.
• Time above Liquidous (T_L=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (T_L to T_p): Maximum 3°C/second.
• Ramp-down Rate (T_p to T_L): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Bin wannan bayanin martaba da gaske yana hana girgizar zafi da lalacewa ga fakitin LED da haɗin wayoyi na ciki.

6.2 Kula da Sarrafawa da Ajiyewa

LEDs suna da hankali ga zubar da lantarki na tsaye (ESD). Yi amfani da hanyoyin sarrafawa masu aminci na ESD (belun wuyan hannu, tabarmi masu ɗaukar lantarki). Ajiye a cikin yanayi mai bushewa, maras lantarki a cikin ƙayyadadden kewayon zafi (-40°C zuwa +105°C). Guji bayyanar da danshi kafin haɗawa; idan ya cancanta, bi umarnin gasa na masana'anta.

7. Bayanin Fakitin da Oda

7.1 Fakitin Kaset da Reel

Ana samar da LEDs akan kaset mai ɗaukar kaya da aka yi da zane a kan reels don haɗawa ta atomatik ta hanyar ɗauka da sanyawa. Reel na iya ɗaukar mafi girman guda 5,000. An ba da zanen girman kaset, gami da tazarar aljihu da diamita na reel. Ƙimar ma'anar tarin sama da 10 matakan shine ±0.25mm.

7.2 Tsarin Lambar Bangare

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "3C" for the 3030 package.
• CCT/Color Code: "CW" for RGB (full color).
• Number of Serial/Parallel Chips, Component Code, Color Code: These digits specify internal configurations, binning selections (like wavelength and flux), and other product variants.

Tuntuɓar cikakken teburin rarrabawa ya zama dole don fassara takamaiman lambar bangare don ainihin halayen ayyukansa.

8. Shawarwarin Aikace-aikace

8.1 Yanayin Aikace-aikace na Al'ada

• Architectural Facade Lighting: Creating dynamic color-changing effects on buildings.
• Outdoor Landscape Lighting: Illuminating pathways, trees, and water features with colored light.
• Signage and Display Backlighting: For vibrant, attention-grabbing signs.
• Entertainment and Stage Lighting: Where programmable color is required.

8.2 Muhimman Abubuwan Ɗauka a Zaman Ƙira

• Thermal Management: This is the most critical factor for longevity. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder point temperature within safe limits, especially when driving at high currents or in high ambient temperatures.
• Drive Current: Use a constant-current driver tailored for RGB LEDs. The current should be set based on the required brightness and thermal derating curves. Do not exceed the absolute maximum ratings.
• Color Mixing and Control: To achieve consistent white light or specific colors, use pulse-width modulation (PWM) to independently control the intensity of each chip. Consider the different luminous efficacies of the red, green, and blue chips in your control algorithm.
• Optics: Secondary optics (lenses, diffusers) may be needed to achieve the desired beam angle and color mixing uniformity.

9. Kwatancen Fasaha da Bambance-bambance

Duk da yake kwatancen abokan hamayyar kai tsaye ba su cikin takardar bayanai ba, ƙayyadaddun EMC3030 suna nuna matsayinsa na gasa:

• vs. Smaller Packages (e.g., 3528): The 3030 package typically offers higher power handling and lumen output due to a larger thermal path and potentially larger chip size.
• vs. Standard 5050 RGB LEDs: The 3030 may offer a more compact solution with similar or better performance, allowing for higher pixel density in dense arrays or finer-pitch displays.
• Key Differentiators: The specified low thermal resistance (5°C/W) and high maximum drive current (180mA) suggest a design optimized for thermal performance, enabling sustained high-brightness operation compared to parts with higher thermal resistance.

10. Tambayoyin da Ake Yawan Yi (Dangane da Sigogi na Fasaha)

Q: Can I drive all three chips (RGB) at 180mA simultaneously?
A: No. The absolute maximum power dissipation (P_D) must not be exceeded. Driving red at 180mA (V_F~2.1V) gives ~378mW, which is below its 468mW limit. However, driving green or blue at 180mA (V_F~3.0V) gives ~540mW, which is below their 648mW limit. The total power for all three would be ~1.46W, which must be dissipated by the PCB/heatsink. More importantly, you must consult the derating curve (Fig. 7) which reduces the allowable current at higher ambient temperatures.

Q: Why is the luminous flux for the blue chip lower than red and green?
A: This is related to human eye sensitivity (photopic response). The eye is least sensitive to blue light (~450-470nm). Therefore, a blue LED requires more radiant power to achieve the same perceived brightness (luminous flux) as a green LED, where the eye's sensitivity peaks. The specified values reflect this physiological reality.

Q: How do I select the correct bin codes for my project?
A: For color-critical applications (e.g., uniform white light across multiple LEDs), you must specify tight bins for dominant wavelength (especially for green and blue) and forward voltage. For less critical applications, wider bins may be acceptable and more cost-effective. Always consult the full binning tables when placing an order.

11. Nazarin Aikin Ƙira na Aiki

Scenario: Designing an outdoor architectural linear light with tunable white light (2700K to 6500K).

Ai watarwa:

1. LED Selection: Use the EMC3030 RGB LEDs. The red, green, and blue outputs are mixed to simulate various white points along the black body locus.
2. Thermal Design: The fixture is aluminum. The PCB is a metal-core PCB (MCPCB) to efficiently transfer heat from the LED solder point to the fixture body. Calculations are performed to ensure the junction temperature remains below 85°C at the maximum ambient temperature (e.g., 40°C) and drive current.
3. Electrical Design: A constant-current LED driver with three independent PWM channels is used. The current is set to 150mA per chip, providing a good balance of brightness and efficacy. The forward voltage bins are considered to ensure the driver's compliance voltage is sufficient for all units in production.
4. Optical Design: A milky white diffuser cover is placed over the LED array to blend the individual RGB points into a uniform, glare-free linear light source.
5. Control: A microcontroller runs an algorithm that maps desired CCT values to specific PWM duty cycles for the R, G, and B channels, calibrated based on the actual binning of the LEDs used.

12. Gabatarwa da Ka'idar Aiki

EMC3030 LED ne mai guntaye da yawa. Kowane guntun diode ne na semiconductor da aka yi daga tsarin kayan daban-daban:

• Red: Typically based on Aluminum Gallium Indium Phosphide (AlGaInP).
• Green & Blue: Typically based on Indium Gallium Nitride (InGaN).

Lokacin da aka yi amfani da ƙarfin lantarki na gaba, electrons da ramuka suna sake haɗuwa a cikin yanki mai aiki na semiconductor, suna sakin makamashi a cikin nau'in photons (haske). Takamaiman tsawon tsinkaya (launi) na hasken an ƙaddara shi ta hanyar makamashin bandgap na kayan semiconductor. Ana haɗa launuka uku na asali (Ja, Kore, Shuɗi) a cikin fakitin guda ɗaya. Ta hanyar sarrafa ƙarfin kowane guntun da kansa, ana iya samar da yalwar launuka, gami da inuwa daban-daban na farin haske.

13. Trends na Fasaha

Ci gaban LEDs masu cikakken launi kamar EMC3030 yana motsa shi da yawancin trends masu gudana a cikin masana'antar haske:

• Increased Efficacy (lm/W): Continuous improvements in epitaxial growth and chip design lead to higher light output per electrical watt, improving energy efficiency.
• Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and tighter binning processes enable more accurate and consistent color production, which is critical for architectural and retail lighting.
• Higher Power Density and Better Thermal Management: Package designs are evolving to extract heat more efficiently, allowing for higher drive currents and sustained lumen output in compact form factors.
• Integration with Smart Controls: LEDs are increasingly designed to be paired with intelligent drivers and IoT connectivity, enabling dynamic color tuning, scheduling, and data collection for human-centric and energy-saving lighting solutions.
• Miniaturization: The push for smaller pixels in fine-pitch direct-view LED displays continues, though this balances against the need for thermal performance and light output.