61-236-IC Top-Emitting RGB LED Driver Datasheet - P-LCC-6 Package - 5V Supply - 120° Viewing Angle - Simplified Chinese Technical Documentation

1. Product Overview

61-236-IC is a highly integrated surface-mount LED driver specifically designed for full-color RGB applications. It integrates three independent LED chips (red, green, blue) with a dedicated control IC within a single P-LCC-6 package. This integration simplifies PCB design by eliminating the need for external driving components for each color channel. The device is designed for applications requiring vibrant color mixing, dynamic lighting effects, and reliable performance in a compact form factor.

1.1 Core Advantages and Target Market

The primary advantage of the 61-236-IC lies in its system-level simplicity. It employs a single-wire data transmission protocol, which significantly reduces the number of control lines required from a microcontroller or main controller compared to traditional parallel RGB LED interfaces. This makes it a cost-effective solution for scalable designs. Its 120-degree wide viewing angle, achieved through an internal reflector and transparent resin, ensures uniform light distribution, making it an ideal choice for light guide tube applications and decorative lighting where multi-angle visibility is crucial.

The target market includes indoor and outdoor full-color LED displays, decorative and architectural lighting strips, gaming peripherals, and any application requiring addressable, multi-color LED points. The device complies with RoHS, REACH, and halogen-free standards, ensuring it meets stringent international environmental and safety regulations.

2. In-depth Technical Parameter Analysis

This section provides a detailed breakdown of the device's operational limits and performance characteristics under specified conditions.

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed.

• Supply Voltage (Vdd):4.2V to 5.5V. This defines the operating voltage range for the internal control circuitry. A stable 5V supply is typically used.
• Output Voltage (Vout):17V. This is the maximum voltage that the driver output stage can withstand, related to the LED forward voltage.
• Input Voltage (Vin):-0.5V to Vdd+0.5V. This specifies the safe voltage range for the data input (Din) and set pins to prevent latch-up or damage.
• LED output current (Iout):5 mA. This is the maximum constant current for each color channel (red, green, blue). Exceeding this current may cause LED performance degradation or failure.
• Operating temperature (Topr):-25°C to +85°C. The ambient temperature range for reliable device operation.
• Storage temperature (Tstg):-40°C to +90°C. The safe temperature range when the device is not powered.
• ESD (Electrostatic Discharge):2000V (Human Body Model). Indicates the level of electrostatic protection, suggesting careful handling during assembly.
• Soldering Temperature (Tsol):Reflow soldering: maximum 260°C for 10 seconds; Hand soldering: maximum 350°C for 3 seconds. These are critical parameters for PCB assembly to avoid thermal damage to the package or chip.

2.2 Electro-Optical Characteristics

Measured under Ta=25°C, IF=5mA per channel, these parameters define the light output and color characteristics.

• Luminous Intensity (Iv):
  • Red (RQH): 90 mcd (minimum) to 280 mcd (maximum).
  • Green (GR): 280 mcd (minimum) to 900 mcd (maximum).
  • Blue (BY): 71 mcd (min) to 224 mcd (max).
  A tolerance of ±11% applies. The larger range indicates the use of a binning system, where devices are classified according to their output intensity.
• Viewing angle (2θ1/2):120 degrees (typical value). Defined as the full angle at which the luminous intensity drops to half of its peak value. Wide viewing angle is a key characteristic.
• Dominant Wavelength (λd):
  • Red (RQH): 617.5 nm to 629.5 nm.
  • Green (GR): 525 nm to 540 nm.
  • Blue (BY): 462 nm to 474 nm.
  A tolerance of ±1nm is applicable. These ranges define the dominant color points and are also subject to binning.

2.3 Electrical Characteristics

Defined at Ta=-20~+70°C, Vdd=4.5~5.5V, Vss=0V.

• Output Current (IOL):5 mA (Typical). Regulated current supplied to each LED.
• Input Current (II):±1 μA (Maximum). Extremely low leakage current on the data input pin.
• Input voltage logic level:
  • VIH (Logic High): Minimum 3.3V.
  • VIL (Logic Low): Maximum 0.3*Vdd (e.g., 1.65V when Vdd=5.5V).
  These are TTL-compatible levels, suitable for interfacing with most 5V microcontrollers.
• Hysteresis Voltage (VH):0.35V (typical). Provides noise immunity for the data input by creating a voltage gap between the high and low level switching thresholds.
• IDDdyn (Dynamic Power Supply Current):2.5 mA (typical). Current consumed by internal control logic during data transfer and PWM operation.

3. Binning System Description

The datasheet implies a multi-parameter binning system to ensure color and luminance consistency in production applications. While not explicitly detailed in a single table, the following bins can be inferred from the parameter ranges:

• Luminous Intensity (CAT):Devices are binned based on measured light output (mcd) for each color (red, green, blue). This is crucial for achieving uniform brightness among multiple units in a display or light strip.
• Peak Wavelength (HUE):LEDs are binned according to their peak wavelength (nm). This ensures a consistent color point (e.g., the same shade of red or blue) among all devices in an assembly, which is crucial for precise color mixing and display quality.
• Forward Voltage (REF):Although not listed in the main table, the packaging materials section mentions "forward voltage grade," indicating that chips may also be classified based on their forward voltage (Vf) characteristics to ensure uniform power distribution in series/parallel strings.

When ordering, specific bin codes (CAT, HUE, REF) can usually be requested to match application requirements.

4. Performance Curve Analysis

Datasheet contains typical performance curves, providing insights into behavior beyond single-point specifications.

4.1 Spectral Distribution

The provided graph shows the relative luminous intensity of the red (RQH), green (GR), and blue (BY) chips across the visible spectrum. Key observations:

• Kila mkunjo inaonyesha kilele dhahiri na nyembamba kinacholingana na urefu wa wimbi lake kuu, kuthibitisha usawa mzuri wa rangi.
• Mionzi nyekundu inazingatia katika eneo la urefu wa wimbi refu (~620-630nm), kijani katika sehemu ya kati (~525-540nm), na bluu katika eneo la urefu wa wimbi fupi (~462-474nm).
• Mwingiliano kati ya wigo wa rangi ni mdogo sana, jambo linalofaa kwa kuunda anuwai pana ya rangi wakati wa kuchanganya rangi.

4.2 Radiation Pattern

The "Radiation Pattern" illustrates the spatial distribution of light. The curve for a wide-viewing-angle LED like this is typically broad and Lambertian-like (cosine distribution), confirming the 120-degree specification. Intensity is highest when viewed directly along the axis (0 degrees) and smoothly decreases towards the edges (±60 degrees).

5. Mechanical and Packaging Information

5.1 Package Dimensions and Pin Configuration

The device is housed in a P-LCC-6 (Plastic Leaded Chip Carrier, 6-pin) package. The detailed dimension drawing specifies length, width, height, lead pitch, and pad size, with a general tolerance of ±0.1mm. This information is crucial for PCB pad design.

Pin Definition:

1. Vss:Internal circuit grounding connection.
2. NA:Not connected / No internal connection.
3. Di:Control data signal input. Receives serial data stream.
4. Do:Control data signal output. Transmits data stream to the next device in the daisy chain.
5. NA:Not connected / No internal connection.
6. Vdd:Positive power supply input (4.2V to 5.5V).

The pin configuration is symmetrical, which aids in PCB layout. Pin 1 is typically marked by a dot or a notch on the package.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Temperature Profile

The datasheet provides a specific lead-free reflow soldering temperature profile:

• Preheating:150–200°C, for 60–120 seconds. Maximum ramp rate: 3°C/sec.
• Reflow (above liquidus):Temperature must exceed 217°C for 60–150 seconds. Peak temperature must not exceed 260°C, and the time above 260°C must not exceed 10 seconds.
• Cooling:Maximum cooling rate: 6°C/sec. Time above 255°C should not exceed 30 seconds.

Key Considerations:Reflow soldering should not exceed two times to avoid excessive thermal stress on the package and wire bonding.

6.2 Storage and Moisture Sensitivity

The device is packaged in a moisture barrier bag with desiccant.

• Before opening:Store at ≤30°C and ≤90% relative humidity (RH).
• Shop life:After opening the sealed bag, soldering must be completed within 24 hours under shop conditions (typically around 30°C/60% RH).
• Baking:If the bag has been opened for more than 24 hours, or if the desiccant indicator shows saturation, it needs to be baked at 60°C ±5°C for 24 hours to remove absorbed moisture and prevent the "popcorn" phenomenon (package cracking) during the reflow soldering process.

6.3 Nufa'u

• Current Limitation:The internal driver provides constant current. However, the absolute maximum rating for Iout is 5mA. The application circuit must ensure that operating conditions do not exceed this limit. Under normal 5V operation, the driver itself does not require an external series resistor for current limiting, but care must be taken in the power supply design.
• Mechanical Stress:Avoid applying mechanical stress to the package during soldering or handling. Do not bend the PCB near the component after assembly.

7. Packaging and Ordering Information

7.1 Reel and Carrier Tape Specifications

Components are supplied in embossed carrier tape format, wound on reels for automated surface-mount assembly.

• Packaging quantity:800 pieces per reel.
• Detailed drawings of reel dimensions, carrier tape pocket dimensions (width, pitch, depth), and cover tape specifications are provided to ensure compatibility with SMT equipment.

7.2 Label Information

Reel labels contain critical information for traceability and correct assembly:

• Customer Part Number (CPN)
• Manufacturer Part Number (P/N): e.g., 61-236-ICRQHGRBYC-A 05-ET-CS
• Quantity (QTY)
• Bin Code: CAT (Intensity), HUE (Wavelength), REF (Voltage)
• LOT No. for traceability

8. Application Design Recommendations

8.1 Typical Application Circuit

The datasheet presents a standard 5V application circuit. A microcontroller (MCU) or dedicated controller sends serial data to the Din pin of the first LED driver. The Dout pin of each driver is connected to the Din pin of the next, forming a daisy chain. A single power supply (5V) powers all Vdd pins, and all Vss pins are connected to ground. It is recommended to use a small RC filter (e.g., 100Ω resistor and 100nF capacitor) on the data line near the MCU to suppress high-frequency noise and improve signal integrity, especially in longer chains or noisy environments.

8.2 Data Protocol and Timing

The device uses a proprietary single-wire return-to-zero protocol.

• Data Frame:Kowane na'ura yana da 24-bit, an tsara shi azaman 8-bit kore, 8-bit ja, da 8-bit shuɗi (G7-G0, R7-R0, B7-B0). Wannan yana ba da damar matakan ƙarfi 256 (0-255) a kowane tashar launi.
• Lokacin bit:
  • Logic '0': Lokacin matakin girma (T0H) = 0.30 µs ±80ns, lokacin matakin ƙasa (T0L) = 0.90 µs ±80ns.
  • Logic '1': High-level time (T1H) = 0.90 µs ±80ns, low-level time (T1L) = 0.30 µs ±80ns.
  • The total bit period for both logic '0' and '1' is 1.2 µs, with a data rate of approximately 833 kHz.
• Reset/Latch signal:A low-level pulse on the Din line lasting longer than 50 µs (RES) indicates the end of a data frame. Upon receiving this reset signal, all devices in the chain simultaneously latch the 24-bit data they have just received into their output registers and update their PWM outputs. This ensures all LEDs in the display update synchronously, preventing "ghosting" or "rainbow" effects during data refresh.

The controller needs to generate precise timing, typically using hardware timers or dedicated peripherals (such as SPI in a specific mode or carefully designed delay loops for bit manipulation).

8.3 Long-chain Design Considerations

For applications with many devices connected in series (e.g., long LED strips):

• Power Injection:5V power must be injected at multiple points along the chain to prevent voltage drop, which can cause LEDs far from the power source to dim or experience color shift. Use thick power traces or separate power wires.
• Data Signal Integrity:Long data lines may suffer from signal degradation (increased rise/fall times, ringing). Using a buffer IC or a low-value series resistor (e.g., 33-100Ω) at the driver input helps match impedance and reduce reflections.
• Refresh Rate:Total Update Time = (Number of LEDs * 24 bits * 1.2 µs) + Reset Time. For a chain of 100 LEDs, it is approximately ~2.88 ms + ~0.05 ms = ~2.93 ms, allowing a refresh rate exceeding 300 Hz, which is sufficient for most visual applications.

9. Technical Comparison and Differentiation

Compared to discrete solutions (separate RGB LED + external constant current driver or resistor + multiplexing logic), the 61-236-IC offers significant advantages:

• Reduced component count:Integrating three LEDs and their drivers into a single package saves PCB space and assembly costs.
• Simplified Control:The single-wire daisy-chain protocol significantly reduces the need for MCU GPIOs—only one pin is required to control hundreds of LEDs, whereas basic PWM control requires three pins per RGB LED.
• Integrated Current Control:Provides stable, regulated current for each LED chip, ensuring consistent brightness and color, unaffected by minor forward voltage (Vf) variations between individual LEDs. This eliminates the need for current-limiting resistors and associated power losses.
• Synchronous Update:The global latch/reset function enables perfectly synchronized color changes across the entire display, a feature difficult to achieve with multiplexed discrete LEDs.

The trade-off is a slightly higher unit cost per pixel and reliance on specific communication protocols.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 How many of these LEDs can be connected in series at most?

The specification does not stipulate rigid electrical limits. The actual limits are determined by the following factors:Data Timing:通过多个器件的累积传播延迟。对于非常长的链 (>500-1000)，数据信号可能会劣化，需要信号调理或分段。 2.Power Distribution:Ensuring sufficient voltage (5V) for each device in the chain requires careful design of the power bus and the placement of multiple injection points.Refresh Rate Requirement:More LEDs mean a longer frame update time, which may become noticeable if the refresh rate for dynamic content drops below 60-100 Hz.

10.2 Can I drive these LEDs with a 3.3V microcontroller?

Spec sheet inabainisha voltage ya chini ya kuingiza kwa kiwango cha juu (VIH) kama 3.3V. Kiwango cha juu cha mantiki cha 3.3V kutoka kwa microcontroller kinakidhi hii spec ya chini haswa. Hata hivyo, kufanya kazi kwenye ukingo wa spec hakuna ukingo wa kelele. Katika mazingira yenye viunganishi vifupi na yaliyodhibitiwa, inaweza kufanya kazi. Kwa utendakazi unaotegemewa, hasa katika mnyororo mrefu au mazingira yenye kelele, inashauriwa kwa nguvu kutumia microcontroller ya 5V au kibadilishaji cha kiwango (mfano, MOSFET rahisi au IC maalum) kubadilisha ishara ya 3.3V kuwa ishara thabiti ya 5V.

10.3 Why is there a 5mA current limit? Can I increase the brightness?

The 5mA limit is determined by the design of the internal constant current driver and the thermal/electrical characteristics of the integrated LED chip. Exceeding this absolute maximum rating risks overheating the driver IC or LED chip, leading to accelerated luminous flux degradation (dimming over time) or catastrophic failure. Brightness should be controlled via the 8-bit PWM duty cycle (0-255), not by increasing the current. For higher brightness requirements, a different LED product with a higher current rating should be selected.

11. Practical Application Examples

Scenario: Design a short addressable LED sign.The designer is creating a small sign with 50 independently controllable RGB pixels for displaying animations and text.

1. Component Selection:61-236-IC i ananima saboda haɗakar direbobi, faɗin kallon gani don tabbatar da kyakkyawan gani da sauƙin sarrafa sarkar daisy.
2. Zane na PCB:Tsarin PCB ya ƙunshi fale-falen gudanarwa 50 na P-LCC-6. Layin bayanai (Din/Do) yana haɗawa daga mai haɗin MCU zuwa kowane pixel a jere. Yi amfani da babban Layer na wutar lantarki 5V da Layer na ƙasa. Sanya babban capacitor na 100µF da ƴan capacitor na 0.1µF na decoupling kusa da wurin shigar wutar lantarki.
3. Firmware:对MCU（例如ARM Cortex-M或ESP32）进行编程，以生成精确的1.2 µs位时序。一个缓冲区数组保存所有50个像素的24位颜色值。固件顺序传输1200位 (50 * 24)，然后发送一个>50µs的低电平脉冲来锁存数据。
4. Assembly:Place components using SMT equipment according to the specified reflow soldering profile. After assembly, test the sign by sending various color patterns to ensure all pixels are correct and respond synchronously.

This example highlights the efficiency of using integrated driver ICs in multi-pixel designs.

12. Working Principles

The 61-236-IC operates based on a simple and straightforward working principle. Internally, it contains a shift register and a latch for each color channel. The serial data stream received at the Din pin is shifted into a 24-bit shift register according to the timing of the signal edges. Once a reset pulse is detected, the contents of the shift register are transferred in parallel to three 8-bit hold latches (one for red, green, and blue). These latched values directly control the duty cycle of three independent PWM generators. Each PWM generator drives a constant current source connected to its respective LED chip (red, green, or blue). The constant current source ensures that when the PWM signal is high, the LED receives a stable 5mA current, unaffected by minor variations in the LED forward voltage. The combination of the three PWM-modulated primary colors at each point produces the desired mixed color. The data is simultaneously shifted out to the Dout pin, allowing the same data stream to propagate to the next device in the chain with minimal delay.

13. Teknoloji Trendleri

Devices like the 61-236-IC represent a mature and widely adopted approach in the field of addressable RGB LEDs. The trend in this field is moving towards higher integration and more intelligent features:

• Higher Bit Depth:Evolving from 8-bit per channel (256 levels) to 10-bit, 12-bit, and even 16-bit PWM to achieve smoother color gradients and professional-grade color accuracy, especially in high-end displays and architectural lighting.
• Integrated Memory & Patterns:Some newer drivers include built-in memory to store pre-programmed lighting patterns or animations, offloading this task from the main controller for standalone operation.
• Higher Data Rates & Protocols:Adoption of faster, more robust serial communication protocols (such as SDI with differential signaling) to support longer cable lengths, higher pixel counts, and refresh rates suitable for high-speed video.
• Improved Efficiency and Thermal Management:Development of more efficient drivers to reduce power lost as heat, enabling the use of brighter LEDs or denser packaging. This includes advanced thermal design within the package.
• Extended Color Gamut:Integrate additional LED colors beyond RGB, such as white (W), amber (A), or lime (L), to create RGBW or RGBAW modules capable of producing a wider range of colors, including more natural whites and pastel tones.

The core principles of integrated control and serial communication remain fundamental, but the implementation methods continue to evolve to achieve higher performance and enable new applications.