UVC LED LTPL-G35UV275PR Datasheet - 3.5x3.5x1.2mm - 6.2V Typ - 37mW Radiant Flux - 275nm Peak Wavelength

1. Product Overview

LTPL-G35UV product series ya nuna ci gaba mai muhimmanci a cikin hanyoyin hasken ultraviolet na ƙwaƙƙwalwa. Wannan samfurin an ƙera shi musamman don aikace-aikacen haƙori da na likita, yana ba da madadin aiki mai inganci ga fasahohin UV na al'ada kamar fitilun mercury. Ta hanyar amfani da fasahar Light Emitting Diode (LED), tana haɗa ingantaccen ingantaccen makamashi tare da aminci da dogon rayuwar aiki da ke cikin na'urorin semiconductor. Wannan yana ba masu zane dama mafi girma don ƙirƙirar mafita mai ƙima don tsarkakewa, tsarkake ruwa, da tsarin tsarkake saman.

Babban fa'idar ta ta'allaka ne a cikin ikonsa na isar da ingantaccen radiation na UVC (a cikin kewayon 270-280nm) tare da ƙananan farashin aiki da kulawa. An ƙera na'urar don dacewa da tsarin tuƙi na integrated circuit (IC) kuma tana bin ka'idodin muhalli, kasancewar RoHS mai dacewa kuma ba ta da gubar. Manyan kasuwannin da aka yi niyya sun haɗa da masu kera kayan aikin likita, masu haɗa tsarin tsarkake ruwa da iska, da masu haɓaka na'urorin haƙori na mabukaci ko na masana'antu.

1.1 Core Advantages and Target Market

The transition from traditional UV sources to UVC LEDs offers several distinct benefits. Firstly, the instant-on capability and lack of warm-up time improve system responsiveness. Secondly, the compact form factor enables integration into smaller and more portable devices. The directional nature of LED emission allows for more efficient optical design, focusing energy where it is needed most. Furthermore, the absence of mercury addresses environmental and safety concerns associated with disposal and breakage.

The target application is primarily germicidal irradiation, where UVC light at around 275nm is highly effective at disrupting the DNA and RNA of microorganisms, including bacteria, viruses, and molds, rendering them inactive. This makes the LED suitable for applications such as surface disinfection in healthcare settings, water treatment in point-of-use systems, and air purification in HVAC units.

2. Technical Parameter Deep-Dive Analysis

2.1 Absolute Maximum Ratings

The device is specified for operation under stringent conditions. The absolute maximum ratings define the limits beyond which permanent damage may occur. Key parameters include a maximum power dissipation (P_O) of 2.1W and a maximum continuous forward current (I_F) of 300mA. The operating temperature range (T_opr) is specified from -40°C to +80°C, indicating suitability for both harsh industrial and controlled medical environments. The storage temperature range (T_stg) extends to -40°C to +100°C. A critical parameter is the maximum junction temperature (T_j) of 115°C. Exceeding this temperature will accelerate degradation and significantly reduce the device's lifetime. The datasheet explicitly warns against operating the LED under reverse bias conditions for extended periods, as this can lead to immediate failure.

2.2 Electro-Optical Characteristics

These characteristics are measured at a standard test condition of 25°C ambient temperature (T_a) and provide the expected performance under normal operation.

• Forward Voltage (V_F): At a drive current of 250mA, the typical forward voltage is 6.2V, with a maximum of 7.0V and a minimum of 5.0V. The measurement tolerance is ±0.1V. This parameter is crucial for designing the LED driver circuit, as it determines the required supply voltage and power dissipation.
• Radiant Flux (Φ_e): This is the total optical power output in the UVC spectrum. At 250mA, the typical radiant flux is 37.0mW (min 29.0mW). When driven at the maximum rated current of 300mA, the typical output increases to 43.0mW. The measurement tolerance is ±10%. Radiant flux is the key metric for determining the germicidal efficacy of the LED in a given application.
• Peak Wavelength (λ_P): LED din tana hasken UVC tare da mafi girman tsayin raƙuman ruwa tsakanin 270nm zuwa 280nm, wanda ya ta'allaka a kusa da 275nm. Wannan tsayin raƙuman ruwa yana cikin mafi kyawun kewayon aiki don kashe ƙwayoyin cuta. Ƙimar ma'auni ita ce ±3nm.
• Thermal Resistance (R_{th j-s}): The typical thermal resistance from the semiconductor junction to the solder point is 12.3 K/W. This value, measured on a specific aluminum MCPCB, is vital for thermal management design. A lower thermal resistance allows heat to be conducted away from the junction more efficiently, helping to maintain a lower T_j and ensure long-term reliability.
• Viewing Angle (2θ_1/2): The typical viewing angle is 120 degrees. This wide emission pattern is beneficial for applications requiring broad-area coverage but may necessitate reflectors or lenses for focused applications.
• Electrostatic Discharge (ESD): The device meets a minimum ESD withstand voltage of 2000V according to the JESD22-A114-B standard (Human Body Model). Proper ESD handling procedures must be followed during assembly and installation.

3. Bin Code System Explanation

To ensure consistent performance, LEDs are sorted into bins based on key parameters measured during production. The bin code is marked on the packaging.

3.1 Forward Voltage (V_F) Binning

LEDs ana rarraba zuwa kwandon wutar lantarki guda huɗu (V1 zuwa V4) lokacin da ake tuƙa su a 250mA:

• V1: 5.0V – 5.5V
• V2: 5.5V – 6.0V
• V3: 6.0V – 6.5V
• V4: 6.5V – 7.0V

Tolerance within each bin is ±0.1V. This binning allows designers to select LEDs with tighter voltage matching for applications driven in series, ensuring more uniform current distribution.

3.2 Radiant Flux (Φ_e) Binning

Output power is sorted into four flux bins (X1 to X4) at 250mA:

• X1: 29.0mW – 34.0mW
• X2: 34.0mW – 39.0mW
• X3: 39.0mW – 44.0mW
• X4: 44.0mW and above

Tolerance is ±10%. Selecting a higher flux bin provides greater optical output, which can translate to shorter disinfection times or allow the use of fewer LEDs in an array.

3.3 Peak Wavelength (λ_P) Binning

For this product, all devices fall within a single wavelength bin, W1, covering 270nm to 280nm with a tolerance of ±3nm. This ensures consistent germicidal performance across all units, as microbial inactivation rates are highly wavelength-dependent.

4. Performance Curve Analysis

The provided graphs offer insight into the LED's behavior under varying conditions.

4.1 Relative Spectral Distribution

Wannan lanƙwasa yana nuna ƙarfin hasken da aka fitar a cikin bakan ultraviolet. Yana tabbatar da ƙunƙuntaccen band ɗin fitarwa wanda ke tsakiya a 275nm, wanda ya dace don haɓaka tasirin kashe ƙwayoyin cuta yayin rage fitarwa a ƙananan tasiri ko kuma mafi haɗari wavelengths.

4.2 Relative Radiant Flux vs. Forward Current

Wannan jadawali yana kwatanta alaƙar ƙasa-layin tsakanin igiyar tuƙi da fitowar gani. Yayin da ƙara yawan halin yanzu ke haɓaka fitarwa, inganci (radiant flux a kowace naúrar wutar lantarki) yawanci yana raguwa a manyan igiyoyin ruwa saboda ƙarin tasirin zafi da kuma faɗuwa. Wannan yana nuna mahimmancin inganta igiyar tuƙi don daidaitaccen ma'auni na fitarwa, inganci, da tsawon rayuwa.

4.3 Forward Voltage vs. Forward Current & Junction Temperature

The forward voltage has a negative temperature coefficient, meaning it decreases as the junction temperature rises. This characteristic must be considered in constant-current driver designs, as a lower V_F at high temperature could slightly reduce the electrical power dissipation.

4.4 Relative Radiant Flux vs. Junction Temperature

Wannan shine ɗaya daga cikin mahimman mahimman layukan. Fitarwar UVC LED tana da matuƙar hankali ga yanayin zafin jiki na junction. Hoton yana nuna raguwa mai mahimmanci a cikin radiant flux yayin da T_j ya ƙaru. Gudanar da zafi mai inganci don kiyaye junction a matsayin mai sanyi kamar yadda zai yiwu yana da mahimmanci don kiyaye babban fitarwa da cimma ƙayyadaddun rayuwa.

4.5 Forward Current Derating Curve

This curve defines the maximum allowable forward current as a function of the ambient temperature. As ambient temperature rises, the maximum permissible current must be reduced to prevent the junction temperature from exceeding its 115°C limit. This graph is essential for designing systems that operate reliably across their specified temperature range.

5. Mechanical and Package Information

5.1 Outline Dimensions

LED package yana da ƙaramin girma kusan 3.5mm x 3.5mm, tare da tsayin kusan 1.2mm. Duk girmansu suna da ƙarancin ±0.2mm sai dai idan an faɗi akasin haka. Zanen injiniya ya ƙayyade ainihin wurin LED chip, solder pads, da kowane tsarin ruwan tabarau na gani.

5.2 Recommended PCB Attachment Pad

An ƙayyadadden ƙirar ƙasa an ba da shi don kushin haɗawa ta saman. Yin bin wannan shafin da aka ba da shawara yana da mahimmanci don samun haɗin gwiwa mai dogaro, isar da zafi mai kyau zuwa PCB, da daidaitawar da ta dace. Ƙayyadaddun jurewar girman kushin shine ±0.1mm. Ƙirar yawanci ta haɗa da ramukan zafi a ƙarƙashin kushin zafi don canja wurin zafi zuwa filin ƙasa na PCB ko wani Layer na sanyaya da aka keɓe.

6. Jagororin Solder da Taro

6.1 Reflow Soldering Profile

An zaɓaɓɓen bayanin reflow maras gubar don hana lalacewa yayin aikin haɗa Surface Mount Technology (SMT). Maɓalli na ma'auni sun haɗa da:

• Preheat: 150-200°C na dakika 60-120.
• Time above liquidus (217°C): 60-150 seconds.
• Peak temperature: Recommended 245°C, maximum 260°C.
• Time within 5°C of peak: 10-30 seconds.
• Matsakaicin ƙimar haɓakawa: 3°C/second.
• Matsakaicin ƙimar saukowa: 6°C/second.

Yawan zafin jiki yana nufin saman fakitin. Ba a ba da shawarar tsarin sanyaya mai sauri ba. LED na iya jure mafi girman sake zagayowar kwarara sau uku.

6.2 Siyayya da Hannu da Tsaftacewa

Idan siyayya da hannu ya zama dole, zafin ƙarshen guntun ƙarfe bai kamata ya wuce 300°C ba, kuma lokacin tuntuɓar ya kamata a iyakance zuwa mafi girman daƙiƙa 2 a kowane fakitin, ana yin sau ɗaya kawai. Don tsaftacewa, kawai masu narkar da barasa kamar isopropyl alcohol ne ya kamata a yi amfani da su. Masu tsaftacewa na sinadarai da ba a bayyana ba na iya lalata ruwan tabarau na silicone ko kayan fakitin.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

Ana LEDs ana ake a kan embossed carrier tape da reels don sarrafa kayan aiki ta atomatik. Girman tef ɗin (girman aljihu, tsayi) da girman reel ɗin (diamita na hub, diamita na flange) sun yi daidai da ƙa'idodin EIA-481-1-B. Reel ɗin inci 7 zai iya ɗaukar iyakar guda 500. Mafi ƙarancin adadin kayan da aka tattara don ragowar kuri'u shine guda 100. An rufe tef ɗin da tef ɗin murfi don kare abubuwan.

8. Application Suggestions and Design Considerations

8.1 Thermal Management

This is the single most critical design factor. The high sensitivity of output to junction temperature necessitates an effective heatsinking strategy. Use a Metal Core PCB (MCPCB) or a standard FR4 PCB with an extensive copper pour and thermal vias connected to an external heatsink. The goal is to minimize the thermal resistance from the LED junction to the ambient environment (R_{th j-a}). Always refer to the forward current derating curve when designing for high ambient temperatures.

8.2 Electrical Drive

A constant current driver is mandatory for stable operation. The driver should be selected to provide the desired current (e.g., 250mA or 300mA) while accommodating the forward voltage range of the selected bin. Consider implementing pulse-width modulation (PWM) for dimming or duty-cycled operation, which can help manage thermal load. Ensure the driver is protected against reverse polarity and voltage transients.

8.3 Optical and Material Considerations

UVC radiation at 275nm is highly energetic and can degrade many common materials, including certain plastics, epoxies, and adhesives. Ensure all materials in the optical path and near the LED (lenses, reflectors, gaskets, wire insulation) are rated for prolonged UVC exposure. Quartz glass is typically used for protective windows. Avoid direct exposure of skin and eyes to the UVC output.

9. Reliability and Lifetime

The datasheet outlines a comprehensive reliability test plan, including Room Temperature Operating Life (RTOL), High/Low Temperature Storage Life (HTSL/LTSL), damp heat testing, and thermal shock. These tests simulate years of operation under various stress conditions. The criteria for failure are defined as a forward voltage shift exceeding 10% or a radiant flux drop below 50% of the initial value. Proper thermal design and electrical operation within the specified limits are essential to achieving the projected lifetime in the field.

10. Technical Comparison and Differentiation

Compared to traditional low-pressure mercury lamps (which emit at 254nm), this UVC LED offers several advantages: instant on/off, compact size, directional emission, robustness (no fragile glass, no mercury), and the potential for wavelength tuning. Compared to other UVC LEDs, the key differentiators of this specific part are its combination of 275nm wavelength, 37mW typical output at 250mA, and the 3.5x3.5mm package format. The wide 120-degree viewing angle may be an advantage or disadvantage depending on the optical design requirements of the application.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: Menene bambanci tsakanin radiant flux (mW) da tasirin kashe kwayoyin cuta?
A: Radiant flux shine jimlar ƙarfin hasken UVC. Tasirin kashe kwayoyin cuta ya dogara da wannan ƙarfin, bakan fitarwa (kololuwar tsayin raƙuman ruwa), nisa zuwa abin da ake hari, lokacin bayyanawa, da kuma saukin kamuwa da ƙwayoyin cuta na musamman. Tsayin raƙuman ruwa na 275nm yana da tasiri sosai akan nau'ikan ƙwayoyin cuta masu yawa.

Q: Ina iya tuka wannan LED da tushen ƙarfin lantarki mai dindindin?
A: A'a. LEDs na'urori ne masu amfani da halin yanzu. Tushen ƙarfin lantarki mai dindindin ba zai daidaita halin yanzu ba, wanda zai haifar da guduwar zafi da gazawar sauri. Koyaushe yi amfani da direban halin yanzu mai dindindin.

Q: Ta yaya zan lissafta heatsink da ake buƙata?
A: You need to determine the total thermal resistance path. Start with the junction-to-solder resistance (R_{th j-s} = 12.3 K/W). Add the thermal resistance of your thermal interface material, PCB, and external heatsink. Using the formula T_j = T_a + (P_diss * R_{th j-a}), ensure T_j remains below 115°C at your maximum ambient temperature and drive power (P_diss ≈ I_F * V_F).

Q: Why is the output so sensitive to temperature?
A> This is a fundamental characteristic of semiconductor light sources, particularly in the ultraviolet range. Increased temperature increases non-radiative recombination within the semiconductor material, reducing the internal quantum efficiency and thus the light output.

12. Practical Design and Usage Case

Case: Designing a Portable Surface Sterilizer Wand.
A designer wants to create a handheld wand for disinfecting surfaces like countertops, keyboards, and phones. They select the LTPL-G35UV275PR LED for its compact size and 275nm output. They plan to use an array of 4 LEDs to increase coverage area. Each LED will be driven at 250mA (typical V_F=6.2V, P_diss=1.55W). The total system power is ~6.2W. A lightweight aluminum heatsink with fins is integrated into the wand's body to dissipate the ~6W of heat. A constant-current driver powered by a rechargeable lithium-ion battery is designed. A safety interlock ensures the LEDs only activate when the wand is held at the correct distance from a surface. The optical design uses the native 120-degree beam to create a broad sterilization spot. The designer selects LEDs from the X2 flux bin (34-39mW) for consistent performance and uses PWM to control exposure time (e.g., 10-second cycles).

13. Principle Introduction

UVC LEDs suna dogara ne akan kayan semiconductor, yawanci aluminum gallium nitride (AlGaN). Lokacin da aka yi amfani da ƙarfin lantarki na gaba, electrons da ramuka suna sake haɗuwa a cikin yanki mai aiki na semiconductor, suna sakin makamashi a cikin nau'in photons. Tsawon zangon waɗannan photons an ƙaddara shi ta hanyar makamashin bandgap na kayan semiconductor. Ta hanyar sarrafa abun ciki na aluminum a cikin yadudduka na AlGaN a hankali, za a iya ƙera bandgap don fitar da haske a cikin kewayon UVC (200-280nm). Ana samun fitowar 275nm ta hanyar ingantattun hanyoyin girma na epitaxial. UVC photons da aka samar suna da ƙarfi sosai kuma suna iya karya haɗin gwiwar kwayoyin halitta, mafi mahimmanci a cikin DNA/RNA na microorganisms, suna hana su yin kwafi.

14. Trends na Ci gaba

Fannin UVC LEDs yana ci gaba da sauri. Manyan abubuwan da ke faruwa sun haɗa da:

• Increased Wall-Plug Efficiency (WPE): Ongoing research aims to improve the electrical-to-optical power conversion efficiency, which directly reduces heat generation and system power requirements.
• Higher Output Power: Development of LEDs with higher radiant flux from a single emitter or smaller package, enabling more compact and powerful disinfection systems.
• Longer Lifetime (L70/B50): Improvements in materials, packaging, and thermal management are extending the operational lifetime, making LEDs more competitive with traditional lamps for high-duty-cycle applications.
• Cost Reduction: Yayin samar da kayayyaki ya karu kuma hanyoyin samarwa suka girma, farashin kowane milliwatt na fitarwar UVC yana raguwa a hankali, yana fadada kewayon aikace-aikacen da za a iya aiwatarwa.
• Wavelength Optimization: Bincike yana ci gaba da gudanarwa akan mafi kyawun tsawon zango don takamaiman kwayoyin cuta da aikace-aikace, wanda zai iya haifar da LEDs da aka keɓance don kiwon lafiya, tsabtace ruwa, da tsabtace iska.

Canja zuwa tushen UVC na ƙarfe mai ƙarfi shine bayyanannen yanayi na dogon lokaci wanda aka motsa ta hanyar fa'idodinsu na asali a cikin siffar siffa, aminci, da sarrafawa.