Bayanin Fasaha na LED Fari 3030 - Girma 3.00x3.00x0.55mm - Ƙarfin Wuta 2.8-3.6V - Ƙarfi ~1.5W - Takardar Fasaha

1. Bayani

Wannan takarda tana ba da cikakkun bayanai na fasaha don ɓangaren LED fari mai ƙarfin haske. An ƙera na'urar don Haɗin Fasahar Surface-Mount (SMT), yana nuna ƙirar ƙafafun 3030 na masana'antu.

1.1 Bayyani

An ƙera LED fari ta amfani da fasahar blue chip da phosphor don samar da haske fari. An haɗa ɓangaren a cikin kunshin EMC (Epoxy Molding Compound), wanda ke ba da ingantacciyar kuzari da kwanciyar hankali na injiniya don aiki mai aminci.

1.1.1 Siffofi

• Kunshin EMC don haɓaka amincin aiki.
• Faɗin kusurwar kallo sosai, ya dace da haske mai faɗi.
• Cikakkiyar dacewa da daidaitattun hanyoyin haɗin SMT da sake narkewa.
• Ana bayarwa akan tef da reel don haɗin kai ta atomatik.
• Matakin Hancin Dampi (MSL): Mataki na 3.
• Yana bin umarnin muhalli na RoHS.

1.1.2 Aikace-aikace

• Hasken baya don allunan LCD, talabijin, da na'urori lura.
• Hasken don sauya da alamomi.
• Alamomin gani na gaba ɗaya.
• Aikace-aikacen nuni na cikin gida.
• Na'urorin haske na tubular.
• Amfanin haske na gaba ɗaya.

1.2 Girman Kunshi da Tsarin Injiniya

LED yana da ƙaramin ƙafafun 3030. Manyan girmomin injiniya sune kamar haka:

• Tsawon Kunshi: 3.00 mm (tolerance ±0.2mm).
• Faɗin Kunshi: 3.00 mm (tolerance ±0.2mm).
• Tsayin Kunshi: 0.55 mm (nominal).
• Ruwan tabarau yana da siffar dome tare da diamita na kusan 2.6 mm.
• Anode da cathode pads suna kan gindin kunshin, tare da ba da shawarar girmodin solder pad don ƙira PCB (2.26mm x 1.45mm don kowane pad tare da tazarar 0.69mm a tsakaninsu).

Duk raka'o'in girma suna cikin millimeters, kuma daidaitattun tolerances su ne ±0.2mm sai dai idan an faɗi akasin haka. Ganin polarity daidai yana da muhimmanci; kunshin ya haɗa da alamomin gani don bambanta tashoshin anode da cathode.

1.3 Ma'auni na Samfur: Halayen Lantarki da Gani

An ƙayyade duk ma'auni a yanayin zafi na junction (Tj) na 25°C. Fahimtar waɗannan ƙididdiga yana da muhimmanci don ƙira da'ira mai aminci da sarrafa zafi._JHalayen Lantarki da Gani (Tj =25°C)

Ma'auni na aiki a yanayin aiki na yau da kullun:_SƘarfin Wuta na Gaba (Vf): 2.8V (Min) zuwa 3.6V (Max) a gwajin na'ura na 500mA. Ƙimar ta yau da kullun tana cikin wannan kewayon.

Ƙarfin Wuta na Baya (Ir): Matsakaicin 10 µA a ƙarfin wuta na baya na 5V.

• Juzu'in Hasken (Φ): 115 lm (Min) zuwa 180 lm (Max) a 500mA._F)Kusurwar Kallo (2θ1/2): Yau da kullun digiri 120, yana ba da tsarin haske mai faɗi sosai.
• Juri na Zafi (Rthj-s): Yau da kullun 12 °C/W, wanda aka auna daga junction zuwa wurin solder._R)Matsakaicin Ƙididdiga (Tj=25°C)
• Waɗannan ƙididdiga suna bayyana iyakokin da za a iya haifar da lalacewa ta dindindin. Kada a taɓa wuce su a cikin aiki.Rushewar Ƙarfi (Pd): Matsakaicin 2160 mW.
• Ci gaba da Ƙarfin Gaba (If): Matsakaicin 600 mA._{Kololuwar Ƙarfin Gaba (Ifp): Matsakaicin 900 mA, a ƙarƙashin yanayin bugun jini (1/10 aikin haɗin gwiwa, 0.1ms faɗin bugun jini).})Ƙarfin Wuta na Baya (Vr): Matsakaicin 5 V.
• Electrostatic Discharge (ESD) HBM: Yana iya jurewa har zuwa 2000V (HBM) tare da samar da sama da 90%, ko da yake ana buƙatar kariya ta ESD yayin sarrafawa._{Yanayin Zafin Aiki (Top): -10°C zuwa +80°C.})Yanayin Ajiya & Zafi: 5°C zuwa 30°C a yanayin zafi na dangi ≤60%.

Matsakaicin Yanayin Zafi na Junction (Tj): 115 °C. Wannan shine iyaka mai muhimmanci don tsawon rayuwar LED._SBayanan Ƙira Mai Muhimmanci:

Dole ne a ƙayyade matsakaicin ƙarfin aiki bayan auna ainihin yanayin zafi na kunshin yayin aiki. Yanayin zafi na junction bai kamata ya wuce matsakaicin ƙimar 115°C ba. Dole ne a kula cewa jimlar rushewar ƙarfi (Vf x If) bai wuce matsakaicin ƙimar 2160mW ba.

• 1.4 Tsarin Rarraba Samfur_D)Don tabbatar da daidaiton launi da haske a aikace-aikacen samarwa, ana rarraba LED cikin kwandon bin bisa manyan ma'auni da aka auna a If = 500mA.
• Rarraba Ƙarfin Wuta na Gaba (Vf): Ana rarraba LED cikin kwandon guda takwas (G1, G2, H1, H2, I1, I2, J1, J2), kowanne yana wakiltar mataki na 0.1V daga 2.8-2.9V har zuwa 3.5-3.6V. Wannan yana bawa masu ƙira damar zaɓar LED tare da ƙananan tolerances na wuta don daidaita na'ura a cikin jerin LED masu yawa._F)Rarraba Juzu'in Hasken (Φ): Ana rarraba LED cikin kwandon juzu'in haske da aka lakafta T115, T120, T125, da sauransu, kowanne yana wakiltar mataki na lumen 5 farawa daga 115-120 lm. Wannan yana ba da damar sarrafa cikakken fitar da haske a aikace-aikace.
• Ta hanyar ƙayyade haɗin Vf da Φ kwandon, injiniyoyi za su iya samun aiki mai daidaito sosai a cikin samfuran ƙarshe. Bayanin yana ba da bayanan tolerance don auna ƙarfin wuta na gaba (±0.1V) da juzu'in haske (±5%)._FP)1.5 Halayen Gani da Launi
• Takardar tana nuni zuwa C.I.E. 1931 Chromaticity Diagram, wanda shine daidaitaccen ƙa'idar duniya don bayyana launi. Don LED fari, an bayyana launi ta hanyar daidaitawar sa (x, y) akan wannan zane. Bayanin ya haɗa da tebur na lambobin kwandon tare da madaidaicin kewayon daidaitawar CIE (x, y) (misali, CIE-X1, CIE-Y1, CIE-X2, CIE-Y2). Matsakaicin tolerance na auna waɗannan daidaitawar launi shine ±0.005. Zaɓin LED daga kwandon launi ɗaya ko kusa yana da mahimmanci don guje wa bambance-bambancen launi na gani (canjin launi) tsakanin LED ɗaya a cikin haɗin gwiwa._R)2. Tattarawa da Bayanin Oda
• Ana bayar da samfurin a cikin tsarin da aka inganta don samarwa mai yawa, atomatik.2.1 Bayanan Tattarawa
• Ana isar da LED akan tef mai ɗagawa da aka narkar da shi zuwa reels. An ba da cikakkun girmomin aljihunan tef ɗin, diamita na reel, da girman cibiya don tabbatar da dacewa da daidaitattun kayan aikin sanya SMT. An kuma ayyana ƙirar lakabin reel. Tsarin tattarawa ya haɗa da matakan hana damɗar da suka dace da matakin MSL 3, kuma ana ƙara tattara raka'a a cikin akwatunan kati don jigilar kaya da ajiya._OPR)2.1.6 Gwajin Aminci
• Samfurin yana ƙarƙashin jerin gwaje-gwaje na aminci don tabbatar da aiki a ƙarƙashin damuwa daban-daban na muhalli. Bayanin ya lissafa abubuwan gwaji da yanayi, waɗanda galibi sun haɗa da gwaje-gwaje kamar ajiyar zafi mai yawa, ajiyar ƙananan zafi, zagayowar zafi, juriya na zafi, da juriya na zafi na solder. An ayyana takamaiman yanayi (misali, zafi, tsawon lokaci, adadin zagayowar) don kowane gwaji.2.1.7 Ma'auni na Lalacewa
• An kafa ma'auni na gani da aiki bayyananne don yin hukunci ko ɓangaren ya lalace bayan gwajin aminci ko sarrafawa. Wannan na iya haɗawa da ma'auni kamar fashewar kunshin, canjin launi, rabuwar jagora, ko babban karkata daga ma'auni na farko na lantarki/gani._J)3. Jagororin Solder Reflow SMT

Solder daidai yana da mahimmanci don ingantacciyar haɗin kai da aikin zafi. An ƙera ɓangaren don hanyoyin solder reflow marasa gubar.Jagororin sun ƙayyade bayanan yanayin zafi na solder reflow. Wannan bayanin yana ayyana manyan ma'auni kamar yanayin zafi da lokaci, ƙimar hawan zafi, kololuwar zafi, lokacin da ya wuce ruwa, da ƙimar sanyaya. Bin wannan bayanin yana hana girgizar zafi ga LED, wanda zai iya haifar da damuwa na ciki, rabuwa, ko gazawa da wuri. Matsakaicin zafin jiki yayin solder bai kamata ya wuce ƙayyadaddun iyaka ba._F3.1.1 Amfani da Ƙarfe Solder (Don Gyara)_FIdan ana buƙatar gyara da hannu, dole ne a ɗauki takamaiman kariya. Yakamata a sarrafa zafin ƙarshen ƙarfe solder, kuma dole ne a rage lokacin hulɗa tare da tashoshin LED (yawanci ƙasa da dakika 3) don hana zafi mai yawa ya shiga cikin ɗigon LED ya lalata shi ko haɗin gwiwar ciki.

3.1.2 Tsarin Gyara

An ba da shawarar tsarin don cirewa da maye gurbin LED mara kyau. Wannan yawanci ya haɗa da yin amfani da zafi a hankali ga haɗin gwiwar solder don cire tsohon ɓangaren, tsaftace pad, shafa sabon man solder, sannan sanyawa da sake narkewa sabon ɓangaren, bin daidaitaccen bayani._F3.1.3 Gargadi na Gabaɗaya

• Kada ka yi amfani da matsi na injiniya ga ruwan tabarau na LED._FKa guji taɓa saman ruwan tabarau da yatsa ko kayan aiki don hana gurɓatawa.Tabbatar cewa ƙirar PCB pad ta dace da shawarar shirin solder don samun ingantacciyar fillet solder da daidaitawar daidai.
• 4. Gargadi na Sarrafawa da AjiyaDon kiyaye inganci da aminci, an ƙarfafa gargadi da yawa na sarrafawa:

Kariya ta ESD: Ko da yake LED yana da ƙimar ESD HBM na 2000V, har yanzu na'urar semiconductor ce. Dole ne a yi amfani da hanyoyin sarrafa anti-static (misali, tashoshi na ƙasa, abubuwan wuyan hannu) don hana lalacewa daga fitar da electrostatic._FHancin Dampi: A matsayin ɓangaren Matakin MSL 3, kunshin zai iya ɗaukar damɗar daga iska. Idan an buɗe jakar shinge ta damɗar ko ta lalace, dole ne a yi amfani da ɓangaren cikin ƙayyadaddun lokaci (yawanci sa'o'i 168 a <30°C/60% RH) ko a sake gasa bisa ga tsarin da aka ƙayyade kafin solder reflow don hana "popcorning" (fashewar kunshin saboda damɗar da ta tashi yayin reflow).

Yanayin Ajiya: Ajiye a cikin yanayi mai sanyi, bushewa kamar yadda aka ƙayyade (5-30°C, RH ≤ 60%). Ka guji fallasa zuwa hasken rana kai tsaye, iskar gas mai lalata, ko ƙura mai yawa.

Tsaftacewa: Idan ana buƙatar tsaftacewa bayan solder, yi amfani da ingantattun kaushi da hanyoyin da suka dace da kayan kunshin LED. Ka guji tsaftacewa ta ultrasonic sai dai idan an tabbatar da aminci ga takamaiman ɓangaren.

5. Jagororin Aikace-aikace da La'akari da Ƙira

5.1 Sarrafa Zafi a cikin Ƙira

Abu mafi muhimmanci don aikin LED da tsawon rayuwa shine sarrafa yanayin zafi na junction (Tj). Juriyar zafi daga junction zuwa wurin solder ita ce 12°C/W na yau da kullun. Don ƙididdige Tj = Tsp + (Rthj-s × Rushewar Ƙarfi) inda Tsp shine yanayin zafi a kan sandunan solder akan PCB. Masu ƙira dole ne su tabbatar da isasshen yanki na tagulla PCB (sandunan zafi ko jiragen sama) da yuwuwar ƙarin heatsinking don kiyaye Tj ƙasa da matsakaicin 115°C, zai fi dacewa ƙasa da 85-100°C don tsawon rayuwa. Yin amfani da ƙaramin ƙarfin gaba fiye da matsakaicin 600mA hanya ce mai tasiri don rage rushewar ƙarfi da samar da zafi.

5.2 Ƙira Da'irar Turawa

LED na'urori ne masu turawa na'ura. Ana ba da shawarar turawa mai tsayayye fiye da turawa mai tsayayye don tabbatar da fitar da haske mai kwanciyar hankali da hana guduwar zafi. Yakamata a ƙera turawa don iyakance ƙarfin zuwa matakin da ake buƙata (misali, 500mA don haske na yau da kullun) yayin la'akari da bambancin ƙarfin wuta na gaba (2.8-3.6V). Don jerin LED masu yawa, haɗin gwiwa yana taimakawa tabbatar da daidaita na'ura, yayin da haɗin gwiwa na iya buƙatar zaɓin kwandon a hankali ko iyakance na'ura ɗaya don la'akari da Vf bambancin.

5.3 La'akari da Ƙira ta Gani

Kusurwar kallo na digiri 120 ya sa wannan LED ya dace da aikace-aikacen da ke buƙatar haske mai faɗi, maimakon tabo mai mayar da hankali. Don aikace-aikacen hasken baya, yawanci ana amfani da masu watsawa na gani da jagororin haske don rarraba haske daidai. Dole ne a yi la'akari da juzu'in haske na farko da raguwar sa a hankali akan lokaci (kula da lumen) cikin buƙatun fitar da haske na gabaɗaya na tsarin.

5.4 Da'irorin Aikace-aikace na Yau da Kullun

Da'irar aikace-aikace ta asali ta haɗa da turawa LED mai tsayayye IC ko resistor mai iyakancewa mai sauƙi a cikin jerin tare da LED lokacin da aka kunna daga tushen wuta. An ƙididdige ƙimar resistor a matsayin R = (Vsupply - Vf) / If. Matsakaicin ƙimar ƙarfin resistor dole ne ya isa (P = (If² × R). Wannan hanya ba ta da inganci fiye da turawa LED mai sauya tsayayye amma yana iya karɓuwa don aikace-aikace masu sauƙi, ƙarancin ƙarfi. Don aikin 500mA, kusan ana ba da shawarar turawa LED ta musamman IC don inganci, sarrafawa, da kariya.

Proper soldering is critical for mechanical integrity and thermal performance. The component is designed for lead-free reflow soldering processes.

The guidelines specify a reflow soldering temperature profile. This profile defines key parameters such as preheat temperature and time, the temperature ramp-up rate, the peak temperature, the time above liquidus, and the cooling rate. Adhering to this profile prevents thermal shock to the LED, which can cause internal stress, delamination, or premature failure. The maximum body temperature during soldering should not exceed the specified limit.

.1.1 Soldering Iron Use (For Rework)

If manual rework is necessary, specific precautions must be taken. The soldering iron tip temperature should be controlled, and the contact time with the LED terminals must be minimized (typically less than 3 seconds) to prevent excessive heat from traveling into the LED chip and damaging it or the internal bonds.

.1.2 Repairing Process

A recommended process for removing and replacing a faulty LED is provided. This usually involves carefully applying heat to the solder joints to remove the old component, cleaning the pad, applying new solder paste, and then placing and reflowing the new component, following the standard profile.

.1.3 General Cautions

• Do not apply mechanical stress to the LED lens.
• Avoid touching the lens surface with fingers or tools to prevent contamination.
• Ensure the PCB pad design matches the recommended solder pattern to achieve a reliable solder fillet and proper alignment.

. Handling and Storage Precautions

To maintain quality and reliability, several handling precautions are emphasized:

• ESD Protection: Although the LED has a 2000V HBM ESD rating, it is still a semiconductor device. Anti-static handling procedures (e.g., grounded workstations, wrist straps) must be used to prevent damage from electrostatic discharge.
• Moisture Sensitivity: As an MSL Level 3 component, the package can absorb moisture from the air. If the sealed moisture barrier bag is opened or damaged, the components must be used within a specified time (typically 168 hours at <30\u00b0C/60% RH) or be rebaked according to the prescribed procedure before reflow soldering to prevent \"popcorning\" (package cracking due to vaporized moisture during reflow).
• Storage Conditions: Store in a cool, dry environment as specified (5-30\u00b0C, RH \u2264 60%). Avoid exposure to direct sunlight, corrosive gases, or excessive dust.
• Cleaning: If post-solder cleaning is required, use approved solvents and methods that are compatible with the LED package material. Avoid ultrasonic cleaning unless verified to be safe for the specific component.

. Application Guidelines and Design Considerations

.1 Thermal Management in Design

The most critical factor for LED performance and lifetime is managing the junction temperature (T_J). The thermal resistance from junction to solder point is 12\u00b0C/W typical. To calculate T_J:

T_J= T_PCB+ (R_THJ-S\u00d7 Power Dissipation)

Where T_PCBis the temperature at the solder pads on the PCB. Designers must ensure adequate PCB copper area (thermal pads or planes) and possibly additional heatsinking to keep T_Jwell below the 115\u00b0C maximum, preferably below 85-100\u00b0C for long life. Using a lower forward current than the maximum 600mA is an effective way to reduce power dissipation and heat generation.

.2 Drive Circuit Design

LEDs are current-driven devices. A constant-current driver is strongly recommended over a constant-voltage driver to ensure stable light output and prevent thermal runaway. The driver should be designed to limit the current to the required level (e.g., 500mA for nominal brightness) while accounting for the forward voltage variation (2.8-3.6V). For multi-LED arrays, series connection helps ensure current matching, while parallel connections require careful bin selection or individual current limiting to account for V_F variations.

.3 Optical Design Considerations

The 120-degree viewing angle makes this LED suitable for applications requiring wide, diffuse illumination rather than a focused spot. For backlighting applications, optical diffusers and light guides are typically used to evenly distribute the light. The initial luminous flux and its gradual decrease over time (lumen maintenance) must be factored into the system's overall light output requirements.

.4 Typical Application Circuits

A basic application circuit involves a constant-current LED driver IC or a simple current-limiting resistor in series with the LED when powered from a voltage source. The series resistor value is calculated as R = (V_Supply- V_F) / I_F. The power rating of the resistor must be sufficient (P = (I_F)²\u00d7 R). This method is less efficient than a switching constant-current driver but may be acceptable for simple, low-power applications. For the 500mA operation, a dedicated LED driver IC is almost always recommended for efficiency, control, and protection.