Spesifikasi LED Warna Penuh EMC3030 - Dimensi 3.0x3.0mm - Voltan 1.6-3.4V - Kuasa 0.468-0.648W - Dokumen Teknikal Bahasa Melayu

1. Gambaran Keseluruhan Produk

Siri EMC3030 ialah LED pemasangan permukaan warna penuh berprestasi tinggi yang direka untuk aplikasi pencahayaan yang menuntut. Komponen ini menggabungkan cip merah, hijau dan biru (RGB) dalam pakej padat 3.0mm x 3.0mm, membolehkan penciptaan spektrum warna yang luas melalui percampuran warna tambahan. Fokus reka bentuk utamanya adalah untuk memberikan output bercahaya dan keberkesanan yang tinggi sambil mengekalkan operasi yang teguh di bawah arus pemacu yang tinggi.

Core Advantages: The key strengths of this LED include its high lumen output, suitability for high-current operation, and low thermal resistance. These features contribute to stable performance and long operational life in various environments.

Target Market: This LED is engineered for applications requiring vibrant, dynamic, or tunable white light. Its primary target markets are outdoor lighting and architectural lighting, where color effects, durability, and energy efficiency are paramount.

2. Analisis Parameter Teknikal Mendalam

Bahagian ini memberikan tafsiran objektif yang terperinci mengenai parameter teknikal utama yang dinyatakan dalam lembaran data.

2.1 Ciri-ciri Elektro-Optik

The luminous flux output is measured at a standard test current (I_F) of 150mA and an ambient temperature (T_a) of 25°C. The typical ranges are:

• Red Chip: 22 to 28 lumens (lm)
• Green Chip: 44 to 51 lm
• Blue Chip: 7 to 12 lm

Toleransi pengukuran ±7% terpakai pada nilai fluks bercahaya ini. Suhu warna berkaitan (CCT) untuk campuran cahaya putih diperoleh daripada rajah kromatisiti CIE 1931 berdasarkan gabungan output cip individu.

The device features a wide viewing angle (2θ_1/2) of 120 degrees, which is the off-axis angle where luminous intensity drops to half of its peak value. This ensures a broad and even light distribution.

2.2 Parameter Elektrik

The forward voltage (V_F) varies by chip color at I_F = 150mA:

• Red: 1.6V to 2.6V (Typical)
• Green: 2.6V to 3.4V (Typical)
• Blue: 2.6V to 3.4V (Typical)

The forward voltage measurement tolerance is ±0.1V. The reverse voltage (V_R) rating for all chips is a maximum of 5V, with a reverse current (I_R) of less than 10µA at this voltage. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

2.3 Penarafan Terma dan Maksimum Mutlak

Mengendalikan LED melebihi had ini boleh menyebabkan kerosakan kekal.

• Maximum Forward Current (I_F): 180mA (Continuous) for all colors.
• Maximum Pulse Forward Current (I_FP): 250mA (Pulse width ≤100µs, Duty cycle ≤1/10).
• Maximum Power Dissipation (P_D):
  • Red: 468 mW
  • Hijau: 648 mW
  • Biru: 648 mW
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +105°C.
• Thermal Resistance (R_{th j-sp}): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 5°C/W for all colors at I_F=150mA. This low value is crucial for effective heat management.

It is critically important that the total power dissipation in the application does not exceed the specified P_D ratings to ensure reliability.

3. Penjelasan Sistem Pembin

The LEDs are sorted (binned) according to key performance parameters to ensure consistency in production runs. The binning is performed at I_F = 150mA and T_a = 25°C.

3.1 Pembin Panjang Gelombang Dominan

Ini mentakrifkan warna cahaya yang tepat yang dipancarkan oleh setiap cip.

• Red: Binned into codes RB2 (615-620nm), RC1 (620-625nm), and RC2 (625-630nm).
• Green: Binned into a single code GC3, covering a range from 520nm to 535nm in 2.5nm steps (e.g., 520-522.5nm, 522.5-525nm, etc.).
• Blue: Binned into multiple codes: BB3 (450-452.5nm), BB4 (452.5-455nm), up to BC6 (467.5-470nm).

Toleransi untuk pengukuran panjang gelombang ialah ±1nm.

3.2 Pembin Fluks Bercahaya

LED dikumpulkan berdasarkan output cahaya mereka.

• Red: Code DR0 (22-28 lm)
• Green: Code DG0 (44-51 lm)
• Blue: Code DB0 (7-12 lm)

Toleransi untuk pengukuran fluks bercahaya ialah ±7%.

3.3 Pembin Voltan Kehadapan

Penyusunan ini memastikan keserasian elektrik dalam reka bentuk litar. Bin voltan adalah dari AB2 (1.8-2.0V) ke AF1 (3.2-3.4V), dengan toleransi pengukuran ±0.1V.

4. Analisis Keluk Prestasi

Lembaran data termasuk beberapa graf yang menggambarkan kelakuan LED di bawah keadaan yang berbeza. Memahami ini adalah kunci kepada reka bentuk optimum.

• Forward Current vs. Relative Intensity (Fig. 3): This curve shows how light output increases with drive current. It is typically non-linear, and operating near the maximum current may reduce efficacy and lifespan.
• Forward Current vs. Forward Voltage (Fig. 4): This IV curve is essential for driver design. The forward voltage increases with current, and the relationship differs slightly between the red, green, and blue chips due to their different semiconductor materials.
• Ambient Temperature vs. Relative Luminous Flux (Fig. 5): This graph demonstrates thermal derating. As the ambient temperature rises, the light output decreases. Designers must account for this to maintain consistent brightness in warm environments.
• Ambient Temperature vs. Relative Forward Voltage (Fig. 6): The forward voltage typically decreases as temperature increases. This characteristic is important for constant-current driver stability.
• Ambient Temperature vs. Maximum Forward Current (Fig. 7): This derating curve is critical. It shows the maximum allowable forward current must be reduced as ambient temperature increases to prevent overheating. For example, at 85°C, the maximum current for the red chip is approximately 136.4mA, and for green/blue chips, it is around 93.7mA and 90.9mA respectively.
• Color Spectrum (Fig. 1) & Viewing Angle Distribution (Fig. 2): These figures provide visual references for the spectral output and beam pattern of the LED.

5. Maklumat Mekanikal dan Pakej

5.1 Dimensi Pakej

LED ini ditempatkan dalam pakej pemasangan permukaan EMC3030. Dimensi keseluruhan ialah 3.0mm panjang dan 3.0mm lebar. Lukisan mekanikal terperinci menentukan penempatan tepat cip LED, tanda katod/anod, dan struktur kanta. Toleransi umum untuk dimensi ialah ±0.2mm melainkan dinyatakan sebaliknya.

5.2 Reka Bentuk Pad Pateri yang Disyorkan

Corak landasan (tapak kaki) disediakan untuk reka bentuk PCB. Mematuhi susun atur pad yang disyorkan ini adalah penting untuk pematerian yang boleh dipercayai, pemindahan haba yang betul, dan mencegah "tombstoning" semasa refluks. Dimensi pad mempunyai toleransi ±0.1mm.

5.3 Pengenalpastian Polarity

Pakej ini termasuk tanda untuk mengenal pasti terminal katod (negatif) untuk setiap cip warna. Sambungan polarity yang betul adalah wajib untuk mengelakkan kerosakan pada LED.

6. Garis Panduan Pemasangan dan Pematerian

6.1 Parameter Pematerian Refluks

LED ini serasi dengan proses pematerian refluks bebas plumbum (Pb-free). Profil yang ditentukan adalah kritikal:

• Peak Package Body Temperature (T_p): Maximum 260°C.
• Time above Liquidous (T_L=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (T_L to T_p): Maximum 3°C/second.
• Ramp-down Rate (T_p to T_L): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Mengikuti profil ini dengan ketat menghalang kejutan terma dan kerosakan pada pakej LED dan ikatan wayar dalaman.

6.2 Langkah Berjaga-jaga Pengendalian dan Penyimpanan

LED sensitif kepada nyahcas elektrostatik (ESD). Gunakan prosedur pengendalian selamat ESD yang sesuai (tali pergelangan tangan, tikar konduktif). Simpan dalam persekitaran kering, anti-statik dalam julat suhu yang ditentukan (-40°C hingga +105°C). Elakkan pendedahan kepada kelembapan sebelum pematerian; jika perlu, ikuti arahan pembakar pengeluar.

7. Maklumat Pembungkusan dan Pesanan

7.1 Pembungkusan Pita dan Gegelung

LED dibekalkan pada pita pembawa timbul yang dililit pada gegelung untuk pemasangan automatik pick-and-place. Gegelung boleh memuatkan maksimum 5,000 keping. Lukisan dimensi pita, termasuk jarak poket dan diameter gegelung, disediakan. Toleransi kumulatif lebih 10 pic ialah ±0.25mm.

7.2 Sistem Penomboran Bahagian

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "3C" for the 3030 package.
• CCT/Color Code: "CW" for RGB (full color).
• Number of Serial/Parallel Chips, Component Code, Color Code: These digits specify internal configurations, binning selections (like wavelength and flux), and other product variants.

Merujuk jadual pembin penuh adalah perlu untuk mentafsir nombor bahagian tertentu bagi ciri prestasi tepatnya.

8. Cadangan Aplikasi

8.1 Senario Aplikasi Biasa

• Architectural Facade Lighting: Creating dynamic color-changing effects on buildings.
• Outdoor Landscape Lighting: Illuminating pathways, trees, and water features with colored light.
• Signage and Display Backlighting: For vibrant, attention-grabbing signs.
• Entertainment and Stage Lighting: Where programmable color is required.

8.2 Pertimbangan Reka Bentuk Kritikal

• Thermal Management: This is the most critical factor for longevity. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder point temperature within safe limits, especially when driving at high currents or in high ambient temperatures.
• Drive Current: Use a constant-current driver tailored for RGB LEDs. The current should be set based on the required brightness and thermal derating curves. Do not exceed the absolute maximum ratings.
• Color Mixing and Control: To achieve consistent white light or specific colors, use pulse-width modulation (PWM) to independently control the intensity of each chip. Consider the different luminous efficacies of the red, green, and blue chips in your control algorithm.
• Optics: Secondary optics (lenses, diffusers) may be needed to achieve the desired beam angle and color mixing uniformity.

9. Perbandingan dan Pembezaan Teknikal

Walaupun perbandingan pesaing langsung tidak terdapat dalam lembaran data, spesifikasi EMC3030 menyerlahkan kedudukan kompetitifnya:

• vs. Smaller Packages (e.g., 3528): The 3030 package typically offers higher power handling and lumen output due to a larger thermal path and potentially larger chip size.
• vs. Standard 5050 RGB LEDs: The 3030 may offer a more compact solution with similar or better performance, allowing for higher pixel density in dense arrays or finer-pitch displays.
• Key Differentiators: The specified low thermal resistance (5°C/W) and high maximum drive current (180mA) suggest a design optimized for thermal performance, enabling sustained high-brightness operation compared to parts with higher thermal resistance.

10. Soalan Lazim (Berdasarkan Parameter Teknikal)

Q: Can I drive all three chips (RGB) at 180mA simultaneously?
A: No. The absolute maximum power dissipation (P_D) must not be exceeded. Driving red at 180mA (V_F~2.1V) gives ~378mW, which is below its 468mW limit. However, driving green or blue at 180mA (V_F~3.0V) gives ~540mW, which is below their 648mW limit. The total power for all three would be ~1.46W, which must be dissipated by the PCB/heatsink. More importantly, you must consult the derating curve (Fig. 7) which reduces the allowable current at higher ambient temperatures.

Q: Why is the luminous flux for the blue chip lower than red and green?
A: This is related to human eye sensitivity (photopic response). The eye is least sensitive to blue light (~450-470nm). Therefore, a blue LED requires more radiant power to achieve the same perceived brightness (luminous flux) as a green LED, where the eye's sensitivity peaks. The specified values reflect this physiological reality.

Q: How do I select the correct bin codes for my project?
A: For color-critical applications (e.g., uniform white light across multiple LEDs), you must specify tight bins for dominant wavelength (especially for green and blue) and forward voltage. For less critical applications, wider bins may be acceptable and more cost-effective. Always consult the full binning tables when placing an order.

11. Kajian Kes Reka Bentuk Praktikal

Scenario: Designing an outdoor architectural linear light with tunable white light (2700K to 6500K).

Pelaksanaan:

1. LED Selection: Use the EMC3030 RGB LEDs. The red, green, and blue outputs are mixed to simulate various white points along the black body locus.
2. Thermal Design: The fixture is aluminum. The PCB is a metal-core PCB (MCPCB) to efficiently transfer heat from the LED solder point to the fixture body. Calculations are performed to ensure the junction temperature remains below 85°C at the maximum ambient temperature (e.g., 40°C) and drive current.
3. Electrical Design: A constant-current LED driver with three independent PWM channels is used. The current is set to 150mA per chip, providing a good balance of brightness and efficacy. The forward voltage bins are considered to ensure the driver's compliance voltage is sufficient for all units in production.
4. Optical Design: A milky white diffuser cover is placed over the LED array to blend the individual RGB points into a uniform, glare-free linear light source.
5. Control: A microcontroller runs an algorithm that maps desired CCT values to specific PWM duty cycles for the R, G, and B channels, calibrated based on the actual binning of the LEDs used.

12. Pengenalan Prinsip Operasi

EMC3030 ialah LED pelbagai cip. Setiap cip ialah diod semikonduktor yang diperbuat daripada sistem bahan yang berbeza:

• Red: Typically based on Aluminum Gallium Indium Phosphide (AlGaInP).
• Green & Blue: Typically based on Indium Gallium Nitride (InGaN).

Apabila voltan kehadapan dikenakan, elektron dan lubang bergabung semula dalam kawasan aktif semikonduktor, membebaskan tenaga dalam bentuk foton (cahaya). Panjang gelombang (warna) cahaya yang spesifik ditentukan oleh tenaga jurang jalur bahan semikonduktor. Tiga warna utama (Merah, Hijau, Biru) digabungkan secara tambahan dalam pakej tunggal. Dengan mengawal intensiti setiap cip secara bebas, spektrum warna yang luas, termasuk pelbagai warna cahaya putih, boleh dihasilkan.

13. Trend Teknologi

Pembangunan LED warna penuh seperti EMC3030 didorong oleh beberapa trend berterusan dalam industri pencahayaan:

• Increased Efficacy (lm/W): Continuous improvements in epitaxial growth and chip design lead to higher light output per electrical watt, improving energy efficiency.
• Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and tighter binning processes enable more accurate and consistent color production, which is critical for architectural and retail lighting.
• Higher Power Density and Better Thermal Management: Package designs are evolving to extract heat more efficiently, allowing for higher drive currents and sustained lumen output in compact form factors.
• Integration with Smart Controls: LEDs are increasingly designed to be paired with intelligent drivers and IoT connectivity, enabling dynamic color tuning, scheduling, and data collection for human-centric and energy-saving lighting solutions.
• Miniaturization: The push for smaller pixels in fine-pitch direct-view LED displays continues, though this balances against the need for thermal performance and light output.