Ficha Técnica do LED Full Color EMC3030 - Dimensões 3.0x3.0mm - Tensão 1.6-3.4V - Potência 0.468-0.648W - Documento Técnico em Português

1. Visão Geral do Produto

A série EMC3030 é um LED de montagem em superfície (SMD) full-color de alto desempenho, projetado para aplicações de iluminação exigentes. Este componente integra chips vermelho, verde e azul (RGB) dentro de um encapsulamento compacto de 3.0mm x 3.0mm, permitindo a criação de um amplo espectro de cores através da mistura aditiva de cores. O seu foco principal de projeto é fornecer alta saída luminosa e eficácia, mantendo uma operação robusta sob correntes de acionamento elevadas.

Core Advantages: The key strengths of this LED include its high lumen output, suitability for high-current operation, and low thermal resistance. These features contribute to stable performance and long operational life in various environments.

Target Market: This LED is engineered for applications requiring vibrant, dynamic, or tunable white light. Its primary target markets are outdoor lighting and architectural lighting, where color effects, durability, and energy efficiency are paramount.

2. Análise Aprofundada de Parâmetros Técnicos

Esta seção fornece uma interpretação objetiva e detalhada dos principais parâmetros técnicos especificados na ficha técnica.

2.1 Características Eletro-Ópticas

The luminous flux output is measured at a standard test current (I_F) of 150mA and an ambient temperature (T_a) of 25°C. The typical ranges are:

• Red Chip: 22 to 28 lumens (lm)
• Green Chip: 44 to 51 lm
• Blue Chip: 7 to 12 lm

Uma tolerância de medição de ±7% aplica-se a estes valores de fluxo luminoso. A temperatura de cor correlacionada (CCT) para misturas de luz branca é derivada do diagrama de cromaticidade CIE 1931, com base na saída combinada dos chips individuais.

The device features a wide viewing angle (2θ_1/2) of 120 degrees, which is the off-axis angle where luminous intensity drops to half of its peak value. This ensures a broad and even light distribution.

2.2 Parâmetros Elétricos

The forward voltage (V_F) varies by chip color at I_F = 150mA:

• Red: 1.6V to 2.6V (Typical)
• Green: 2.6V to 3.4V (Typical)
• Blue: 2.6V to 3.4V (Typical)

The forward voltage measurement tolerance is ±0.1V. The reverse voltage (V_R) rating for all chips is a maximum of 5V, with a reverse current (I_R) of less than 10µA at this voltage. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

2.3 Classificações Térmicas e Máximas Absolutas

Operar o LED além destes limites pode causar danos permanentes.

• Maximum Forward Current (I_F): 180mA (Continuous) for all colors.
• Maximum Pulse Forward Current (I_FP): 250mA (Pulse width ≤100µs, Duty cycle ≤1/10).
• Maximum Power Dissipation (P_D):
  • Red: 468 mW
  • Verde: 648 mW
  • Azul: 648 mW
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +105°C.
• Thermal Resistance (R_{th j-sp}): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 5°C/W for all colors at I_F=150mA. This low value is crucial for effective heat management.

It is critically important that the total power dissipation in the application does not exceed the specified P_D ratings to ensure reliability.

3. Explicação do Sistema de Binning

The LEDs are sorted (binned) according to key performance parameters to ensure consistency in production runs. The binning is performed at I_F = 150mA and T_a = 25°C.

3.1 Binning de Comprimento de Onda Dominante

Isto define a cor precisa da luz emitida por cada chip.

• Red: Binned into codes RB2 (615-620nm), RC1 (620-625nm), and RC2 (625-630nm).
• Green: Binned into a single code GC3, covering a range from 520nm to 535nm in 2.5nm steps (e.g., 520-522.5nm, 522.5-525nm, etc.).
• Blue: Binned into multiple codes: BB3 (450-452.5nm), BB4 (452.5-455nm), up to BC6 (467.5-470nm).

A tolerância para medição de comprimento de onda é de ±1nm.

3.2 Binning de Fluxo Luminoso

Os LEDs são agrupados com base na sua saída de luz.

• Red: Code DR0 (22-28 lm)
• Green: Code DG0 (44-51 lm)
• Blue: Code DB0 (7-12 lm)

A tolerância para medição de fluxo luminoso é de ±7%.

3.3 Binning de Tensão Direta

Esta classificação garante compatibilidade elétrica no projeto do circuito. As faixas de tensão variam de AB2 (1.8-2.0V) a AF1 (3.2-3.4V), com uma tolerância de medição de ±0.1V.

4. Análise de Curvas de Desempenho

A ficha técnica inclui vários gráficos que ilustram o comportamento do LED sob diferentes condições. Compreender estes gráficos é fundamental para um projeto otimizado.

• Forward Current vs. Relative Intensity (Fig. 3): This curve shows how light output increases with drive current. It is typically non-linear, and operating near the maximum current may reduce efficacy and lifespan.
• Forward Current vs. Forward Voltage (Fig. 4): This IV curve is essential for driver design. The forward voltage increases with current, and the relationship differs slightly between the red, green, and blue chips due to their different semiconductor materials.
• Ambient Temperature vs. Relative Luminous Flux (Fig. 5): This graph demonstrates thermal derating. As the ambient temperature rises, the light output decreases. Designers must account for this to maintain consistent brightness in warm environments.
• Ambient Temperature vs. Relative Forward Voltage (Fig. 6): The forward voltage typically decreases as temperature increases. This characteristic is important for constant-current driver stability.
• Ambient Temperature vs. Maximum Forward Current (Fig. 7): This derating curve is critical. It shows the maximum allowable forward current must be reduced as ambient temperature increases to prevent overheating. For example, at 85°C, the maximum current for the red chip is approximately 136.4mA, and for green/blue chips, it is around 93.7mA and 90.9mA respectively.
• Color Spectrum (Fig. 1) & Viewing Angle Distribution (Fig. 2): These figures provide visual references for the spectral output and beam pattern of the LED.

5. Informações Mecânicas e de Encapsulamento

5.1 Dimensões do Encapsulamento

O LED é alojado em um encapsulamento SMD EMC3030. As dimensões gerais são 3.0mm de comprimento e 3.0mm de largura. O desenho mecânico detalhado especifica a posição exata dos chips LED, as marcações de cátodo/ânodo e a estrutura da lente. A tolerância geral para dimensões é de ±0.2mm, salvo indicação em contrário.

5.2 Projeto Recomendado de Ilhós de Solda

Um padrão de ilhós (footprint) é fornecido para o projeto da PCB. Seguir este layout de ilhós recomendado é essencial para uma soldagem confiável, transferência térmica adequada e prevenção do efeito "tombstoning" durante o refluxo. As dimensões dos ilhós têm uma tolerância de ±0.1mm.

5.3 Identificação de Polaridade

O encapsulamento inclui marcações para identificar o terminal cátodo (negativo) de cada chip de cor. A conexão correta da polaridade é obrigatória para evitar danos ao LED.

6. Diretrizes de Soldagem e Montagem

6.1 Parâmetros de Soldagem por Refluxo

O LED é compatível com processos de soldagem por refluxo sem chumbo (Pb-free). O perfil térmico especificado é crítico:

• Peak Package Body Temperature (T_p): Maximum 260°C.
• Time above Liquidous (T_L=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (T_L to T_p): Maximum 3°C/second.
• Ramp-down Rate (T_p to T_L): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Seguir rigorosamente este perfil previne choque térmico e danos ao encapsulamento do LED e às ligações internas dos fios.

6.2 Precauções de Manuseio e Armazenamento

Os LEDs são sensíveis à descarga eletrostática (ESD). Utilize procedimentos de manuseio seguros contra ESD (pulseiras, tapetes condutores). Armazene em ambiente seco e antiestático dentro da faixa de temperatura especificada (-40°C a +105°C). Evite exposição à umidade antes da soldagem; se necessário, siga as instruções de pré-aquecimento (baking) do fabricante.

7. Informações de Embalagem e Pedido

7.1 Embalagem em Fita e Bobina

Os LEDs são fornecidos em fita transportadora relevada, enrolada em bobinas para montagem automatizada pick-and-place. A bobina pode conter um máximo de 5.000 unidades. O desenho dimensional da fita, incluindo espaçamento dos bolsos e diâmetro da bobina, é fornecido. A tolerância cumulativa ao longo de 10 passos é de ±0.25mm.

7.2 Sistema de Numeração de Peças

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "3C" for the 3030 package.
• CCT/Color Code: "CW" for RGB (full color).
• Number of Serial/Parallel Chips, Component Code, Color Code: These digits specify internal configurations, binning selections (like wavelength and flux), and other product variants.

É necessário consultar a tabela completa de binning para decodificar um número de peça específico e obter as suas características de desempenho exatas.

8. Recomendações de Aplicação

8.1 Cenários de Aplicação Típicos

• Architectural Facade Lighting: Creating dynamic color-changing effects on buildings.
• Outdoor Landscape Lighting: Illuminating pathways, trees, and water features with colored light.
• Signage and Display Backlighting: For vibrant, attention-grabbing signs.
• Entertainment and Stage Lighting: Where programmable color is required.

8.2 Considerações Críticas de Projeto

• Thermal Management: This is the most critical factor for longevity. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder point temperature within safe limits, especially when driving at high currents or in high ambient temperatures.
• Drive Current: Use a constant-current driver tailored for RGB LEDs. The current should be set based on the required brightness and thermal derating curves. Do not exceed the absolute maximum ratings.
• Color Mixing and Control: To achieve consistent white light or specific colors, use pulse-width modulation (PWM) to independently control the intensity of each chip. Consider the different luminous efficacies of the red, green, and blue chips in your control algorithm.
• Optics: Secondary optics (lenses, diffusers) may be needed to achieve the desired beam angle and color mixing uniformity.

9. Comparação e Diferenciação Técnica

Embora comparações diretas com concorrentes não estejam na ficha técnica, as especificações do EMC3030 destacam o seu posicionamento competitivo:

• vs. Smaller Packages (e.g., 3528): The 3030 package typically offers higher power handling and lumen output due to a larger thermal path and potentially larger chip size.
• vs. Standard 5050 RGB LEDs: The 3030 may offer a more compact solution with similar or better performance, allowing for higher pixel density in dense arrays or finer-pitch displays.
• Key Differentiators: The specified low thermal resistance (5°C/W) and high maximum drive current (180mA) suggest a design optimized for thermal performance, enabling sustained high-brightness operation compared to parts with higher thermal resistance.

10. Perguntas Frequentes (Baseadas em Parâmetros Técnicos)

Q: Can I drive all three chips (RGB) at 180mA simultaneously?
A: No. The absolute maximum power dissipation (P_D) must not be exceeded. Driving red at 180mA (V_F~2.1V) gives ~378mW, which is below its 468mW limit. However, driving green or blue at 180mA (V_F~3.0V) gives ~540mW, which is below their 648mW limit. The total power for all three would be ~1.46W, which must be dissipated by the PCB/heatsink. More importantly, you must consult the derating curve (Fig. 7) which reduces the allowable current at higher ambient temperatures.

Q: Why is the luminous flux for the blue chip lower than red and green?
A: This is related to human eye sensitivity (photopic response). The eye is least sensitive to blue light (~450-470nm). Therefore, a blue LED requires more radiant power to achieve the same perceived brightness (luminous flux) as a green LED, where the eye's sensitivity peaks. The specified values reflect this physiological reality.

Q: How do I select the correct bin codes for my project?
A: For color-critical applications (e.g., uniform white light across multiple LEDs), you must specify tight bins for dominant wavelength (especially for green and blue) and forward voltage. For less critical applications, wider bins may be acceptable and more cost-effective. Always consult the full binning tables when placing an order.

11. Estudo de Caso Prático de Projeto

Scenario: Designing an outdoor architectural linear light with tunable white light (2700K to 6500K).

Implementação:

1. LED Selection: Use the EMC3030 RGB LEDs. The red, green, and blue outputs are mixed to simulate various white points along the black body locus.
2. Thermal Design: The fixture is aluminum. The PCB is a metal-core PCB (MCPCB) to efficiently transfer heat from the LED solder point to the fixture body. Calculations are performed to ensure the junction temperature remains below 85°C at the maximum ambient temperature (e.g., 40°C) and drive current.
3. Electrical Design: A constant-current LED driver with three independent PWM channels is used. The current is set to 150mA per chip, providing a good balance of brightness and efficacy. The forward voltage bins are considered to ensure the driver's compliance voltage is sufficient for all units in production.
4. Optical Design: A milky white diffuser cover is placed over the LED array to blend the individual RGB points into a uniform, glare-free linear light source.
5. Control: A microcontroller runs an algorithm that maps desired CCT values to specific PWM duty cycles for the R, G, and B channels, calibrated based on the actual binning of the LEDs used.

12. Introdução ao Princípio de Funcionamento

O EMC3030 é um LED multi-chip. Cada chip é um díodo semicondutor feito de diferentes sistemas de materiais:

• Red: Typically based on Aluminum Gallium Indium Phosphide (AlGaInP).
• Green & Blue: Typically based on Indium Gallium Nitride (InGaN).

Quando uma tensão direta é aplicada, elétrons e lacunas se recombinam dentro da região ativa do semicondutor, liberando energia na forma de fótons (luz). O comprimento de onda específico (cor) da luz é determinado pela energia da banda proibida (bandgap) do material semicondutor. As três cores primárias (Vermelho, Verde, Azul) são combinadas de forma aditiva dentro do único encapsulamento. Ao controlar independentemente a intensidade de cada chip, um vasto espectro de cores, incluindo vários tons de luz branca, pode ser produzido.

13. Tendências Tecnológicas

O desenvolvimento de LEDs full-color como o EMC3030 é impulsionado por várias tendências em curso na indústria de iluminação:

• Increased Efficacy (lm/W): Continuous improvements in epitaxial growth and chip design lead to higher light output per electrical watt, improving energy efficiency.
• Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and tighter binning processes enable more accurate and consistent color production, which is critical for architectural and retail lighting.
• Higher Power Density and Better Thermal Management: Package designs are evolving to extract heat more efficiently, allowing for higher drive currents and sustained lumen output in compact form factors.
• Integration with Smart Controls: LEDs are increasingly designed to be paired with intelligent drivers and IoT connectivity, enabling dynamic color tuning, scheduling, and data collection for human-centric and energy-saving lighting solutions.
• Miniaturization: The push for smaller pixels in fine-pitch direct-view LED displays continues, though this balances against the need for thermal performance and light output.