LTLR1DEKVJNNH155T Bicolor LED Indicator Datasheet - Right-Angle Bracket - Red/Green - 20mA - Technical Documentation

1. Product Overview

This document details the specifications of a Bi-Color Circuit Board Indicator (CBI). The device consists of a black plastic right-angle housing (mount) designed to accommodate a T-1 sized LED lamp. The integrated LED contains two chip light sources: one emitting a red light spectrum and one emitting a green light spectrum, and is equipped with a white diffused lens to achieve a uniform appearance.

1.1 Core Features and Advantages

• Easy Assembly:The design is optimized for direct assembly onto circuit boards and can be stacked to create arrays.
• Enhanced Contrast:The black housing provides high contrast, improving the visibility of the indicator when illuminated.
• High Energy Efficiency:Kifaa kina sifa ya matumizi ya nishati ya chini.
• Uzingatiaji wa mazingira:Hii ni bidhaa isiyo na risasi inayolingana na maagizo ya RoHS.
• Suluhisho lililojumuishwa:Ufungashaji huu unajumuisha LED ya AlInGaP yenye rangi mbili (nyekundu: 631nm, kijani: 569nm) na lenzi nyeupe ya kutawanyika iliyowekwa tayari ndani ya msaada.
• Usindikaji wa kiotomatiki:Inatumia ufungashaji wa mkanda na gurudumu, unaofaa kwa vifaa vya kiotomatiki vya kusakinisha.

1.2 Target Applications and Market

This indicator light is suitable for a wide range of electronic devices requiring status or signal indication. The primary application markets include:

• Communication Equipment
• Computers and Peripheral Equipment
• Consumer Electronics
• Industrial Control Systems

2. Technical Parameters: In-depth and Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed.

• Power Dissipation (P_d):Both red and green chips are 75 mW. This is the maximum power dissipated as heat by the LED package when the ambient temperature (T_A) is 25°C.
• Forward Current:
  • Continuous DC (I_F):Maksimum ya rangi zote mbili ni 30 mA.
  • Kilele cha msukumo (I_FP):Mwanga wa kijani 60 mA, mwanga mwekundu 90 mA, inaruhusiwa tu chini ya masharti makali (duty cycle ≤1/10, upana wa msukumo ≤10ms).
• Kupunguzwa kwa joto:Wakati halijoto ya mazingira inazidi 50°C, kwa kila ongezeko la 1°C, upeo wa sasa wa moja kwa moja unaoruhusiwa lazima upunguzwe kwa mstari kwa 0.4 mA. Hii ni muhimu kwa uaminifu katika halijoto ya juu.
• Safu ya halijoto:Halijoto ya uendeshaji: -40°C hadi +100°C; Halijoto ya uhifadhi: -55°C hadi +100°C.
• Halijoto ya kuunganisha:Pins can withstand 260°C for a maximum of 5 seconds, measured at a point 1.6mm from the body.

2.2 Electro-Optical Characteristics

These parameters are measured under the conditions of T_A=25°C, I_F=20mA, representing typical operating conditions.

• Luminous Intensity (I_v):The typical axial light output for both colors is 110 mcd. The minimum is 65 mcd, with maximum values of 250 mcd for red and 450 mcd for green. The guaranteed intensity has a test tolerance of ±30%.
• Viewing Angle (2θ_1/2):45 digrii. Hii ndio pembe kamili wakati nguvu inapungua hadi nusu ya thamani ya mhimili, inayofafanua upana wa boriti.
• Urefu wa wimbi:
  • Urefu wa wimbi wa kilele (λ_P):Mwanga mwekundu takriban 639 nm, mwanga kijani takriban 575 nm. Hii ndio sehemu ya wigo ambayo nguvu ya mionzi ni ya juu zaidi.
  • Urefu wa wimbi mkuu (λ_d):Mwanga mwekundu 631 nm, mwanga kijani 569 nm. Hii ndio urefu wa wimbi wa rangi moja unaotambuliwa na jicho la binadamu, unaofafanua nukta ya rangi kwenye chati ya rangi ya CIE.
• Upana wa wigo (Δλ):Mwanga mwekundu 20 nm, mwanga kijani 11 nm. Hii inaashiria usafi wa wigo; upana wa bandi nyembamba zaidi, usawa wa rangi ni mkubwa zaidi.
• Voltage ya mbele (V_F):Katika 20mA, thamani ya kawaida ya mwanga mwekundu ni 2.0V, mwanga kijani ni 2.1V, na thamani ya juu zaidi kwa zote mbili ni 2.4V. Hii ni muhimu kwa hesabu ya upinzani wa kikomo cha sasa.
• Reverse current (I_R):At a reverse voltage (V_R) of 5V, maximum 10 µA.Important Note:This device is not designed for operation under reverse bias; this test is for characterization only.

3. Binning System Specifications

Devices are binned according to key optical parameters to ensure consistency within the same production lot.

3.1 Luminous Intensity Binning

Unit: mcd @ I_F=20mA. The binning boundary tolerance is ±15%.

• Red LED:
  • DE bin: 65 – 140 mcd
  • FG bin: 140 – 250 mcd
• Green LED:
  • DE bin: 65 – 140 mcd
  • FG bin: 140 – 250 mcd
  • HJ bin: 250 – 450 mcd

3.2 Dominant Wavelength Binning (Green Only)

Unit: nm @ I_F=20mA. Binning boundary tolerance is ±1 nm.

• Hue Bin H06: 564.0 – 568.0 nm
• Hue Bin H07: 568.0 – 571.0 nm

4. Performance Curve Analysis

The datasheet references typical performance curves, which graphically represent the relationship between key parameters. Although the specific charts are not reproduced in the text, their meaning is analyzed as follows.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve of an AlInGaP LED typically exhibits an exponential relationship. The V_Fvalue provided in the datasheet at 20mA offers a key operating point. Due to the diode's exponential characteristic, a small change in voltage results in a large change in current, so designers must use a series resistor to set the current.

4.2 Luminous Intensity vs. Forward Current

This curve is typically linear over a wide range. Operating at the recommended 20mA ensures optimal brightness and efficiency. Exceeding the maximum DC current reduces lifespan and efficiency due to increased heat.

4.3 Luminous Intensity vs. Ambient Temperature

The light output of an LED decreases as the junction temperature rises. The current thermal derating specification (0.4 mA per degree above 50°C) is directly related to managing this effect. For applications with high ambient temperatures, it is necessary to reduce the drive current or improve board-level heat dissipation to maintain brightness.

.4 Usambazaji wa Wigo

4.4 Spectral Distribution

Urefu wa wimbi la kilele uliobainishwa, urefu wa wimbi kuu, pamoja na upana wa wigo, hufafanua sifa za rangi. Upana wa wigo wa chip ya kijani (11 nm) ni nyembamba kuliko ile ya nyekundu (20 nm), ikionyesha utoaji wa mwanga wa kijani una usafi wa rangi wa juu zaidi.

5. Taarifa za Mitambo na Ufungaji

• 5.1 Outline Dimensions and Notes
• All dimensions are in millimeters, with inches in parentheses.
• Isipokuwa imeelezwa vinginevyo, uvumilivu wa kawaida ni ±0.25mm.
• Nyenzo za msaada: Plastiki nyeusi.

LED iliyojumuishwa: Rangi mbili (Manjano-kijani/Nyekundu), yenye lenzi ya kueneza nyeupe.

5.2 Kutambua Upeo wa Umeme na Uundaji wa Pini

The device features standard LED polarity (anode/cathode). During lead forming for board mounting, the bend point must be at least 2mm from the LED lens/package base. The base of the lead frame must not be used as a fulcrum. Forming must be performed at room temperature and completed prior to the soldering process.

• 5.3 Vipimo vya UfungajiCarrier Tape:
• Black conductive polystyrene alloy, thickness 0.50 ± 0.06 mm.Reel Capacity:
• 450 pieces per standard 13-inch reel.
  • Carton Packaging:
  • One reel is packaged with desiccant and humidity indicator card in a Moisture Barrier Bag (MBB).
  • Two Moisture Barrier Bags are packaged in one inner box (total 900 pieces).

10 inner boxes are packed in one master carton (total 9,000 pieces).

6. Soldering and Assembly Guidelines

• 6.1 Uhifadhi na Uvumilivu wa UnyevuUfungaji Uliofungwa:
• Hifadhi katika mazingira ≤30°C, ≤70% RH. Tumia ndani ya mwaka mmoja.Ufungaji Uliofunguliwa:
• Hifadhi katika mazingira ≤30°C, ≤60% RH. Inashauriwa kukamilisha uchomeaji wa reflow wa infrared ndani ya masaa 168 (wiki 1) baada ya kufungua mfuko wa kuzuia unyevu.Extended Storage/Baking:

Components stored outside their original packaging for more than 168 hours should be baked at approximately 60°C for at least 48 hours prior to SMT assembly to remove absorbed moisture and prevent "popcorn" damage during reflow soldering.

6.2 Cleaning

If cleaning is required, use alcohol-based solvents such as isopropyl alcohol. Avoid harsh or corrosive chemicals.

6.3 Soldering Process Parameters

• A minimum clearance of at least 2mm must be maintained between the solder joint and the lens/mount base.
  • Manual Soldering (Soldering Iron):
  • Joto: hadi 350°C.
  • Muda: sekunde 3 kwa upeo kwa kila mwunganisho.
• Kizuizi cha mzunguko mmoja wa kuunganisha.
  • Ushonaji wa wimbi:
  • Upashio: hadi 120°C, sekunde 100 kwa upeo.
  • Wimbi la solderi: hadi 260°C.

Contact time: Maximum 5 seconds.

7. Application Notes and Design Considerations

7.1 Typical Application Circuit_{The device is driven by a simple DC circuit. A current-limiting resistor (R}in series_{) is required and can be calculated using Ohm's Law: R}in series_{= (V}Power Supply_F- V_FForward_F) / I_FForward_{. For conservative design to ensure the current does not exceed the limit, the maximum V from the datasheet should be used.}Forward

Value (2.4V). For a 5V power supply and target I

Forward

Ni 20mA: R

in series

= (5V - 2.4V) / 0.02A = 130 ohms. Vipinga vya kawaida vya 130 au 150 ohms vinafaa. Kazi ya rangi mbili kawaida huhitaji usanidi wa pini 3 za cathode ya pamoja au anode ya pamoja, inayodhibitiwa na ishara mbili za kujitegemea za kuendesha.

7.2 Usimamizi wa Joto

• 虽然功耗较低（75mW），但在高环境温度（>50°C）下连续工作时仍需注意。遵循电流降额指南。确保充分通风，并避免将指示灯放置在PCB上其他发热元件附近。7.3 Ubunifu wa Optiki
• Pembe ya maoni ya digrii 45 na lenzi nyepesi nyeupe hutoa mwanga mpana na sawasawa, unaofaa kwa taa za kiashiria za paneli ya mbele. Msaada mweusi hutoa tofauti bora wakati haujawashwa. Kwa kuonekana bora zaidi, zingatia urefu wa usakinishaji kuhusiana na ufunguzi wa paneli.8. Ulinganisho wa Kiufundi na Tofauti
• Bidhaa hii inachanganya sifa kadhaa zinazotoa tofauti na LED za msingi za kujitegemea:Msingi uliounganishwa dhidi ya LED za kipekee:
• Msingi uliokusanywa tayari wa pembe mraba mweusi hauhitaji klipu za kufunga au mabomba ya mwanga tofauti, hurahisisha usakinishaji na kuboresha uthabiti wa kiufundi na tofauti ya mwanga.Ufungashaji mmoja wa rangi mbili:

Inatoa rangi mbili za kiashiria (nyekundu/kijani) katika kifurushi cha pini 3 chenye ukubwa mdogo, na kuokoa nafasi kwenye bodi ya mzunguko ikilinganishwa na kutumia LED mbili za rangi moja.

AlInGaP Technology:

Inatoa mwangaza wa juu, ufanisi wa juu na usawa mzuri wa rangi katika anuwai ya wigo nyekundu-kijani ikilinganishwa na teknolojia za zamani._PUfungashaji wa reeli ya mkanda:_dInasaidia usakinishaji wa kiotomatiki, kupunguza gharama za wafanyikazi na kuboresha uthabiti wa uwekaji katika utengenezaji wa wingi._d9. Maswali Yanayoulizwa Mara Kwa Mara (Kulingana na Vigezo vya Kiufundi)

9.1 What is the difference between peak wavelength and dominant wavelength?

Urefu wa wimbi wa kilele (λ

Peak

No.) ni sehemu ambayo pato la nguvu ya mwanga ni kubwa zaidi katika wigo wa utoaji. Urefu wa wimbi kuu (λ

主

) unatokana na kuratibu za rangi, na unawakilisha urefu wa wimbi mmoja wa mwanga wa wigo safi ambao jicho la binadamu linaona kama rangi ileile. λ

主

Ni muhimu zaidi kwa matumizi ya kiashiria cha rangi.9.2 Kwa nini kuna vipimo vya kupunguza mkondo kwenye joto la juu ya 50°C?

Urefu wa maisha na pato la mwanga la LED hupungua kadri joto la kiungo linavyoongezeka. Mkunjo wa kupunguza mkondo hupunguza mkondo unaoruhusiwa wa juu unaoendeshwa kadri joto la mazingira linavyoongezeka. Hii inazuia matumizi ya nguvu ya ndani (joto), na kuweka joto la kiungo ndani ya mipaka salama ya kufanya kazi, na kuhakikisha uimara wa muda mrefu.
9.3 Je, naweza kutumia chanzo cha voltage kuendesha LED hii bila kutumia upinzani wa kuzuia mkondo?
LED ni kifaa kinachoendeshwa na mkondo. Kuiunganisha moja kwa moja kwenye chanzo cha voltage kinachozidi voltage yake ya mbele husababisha mkondo mwingi kupita, ambao unaweza kuiharibu mara moja. Daima unahitaji upinzani wa mfululizo au kiendesha cha mkondo wa kudumu.
9.4 "Tolerance ya kila mpaka wa daraja ni ±15%" inamaanisha nini?
Hii inamaanisha kuwa mpaka halisi kati ya daraja za nguvu (kwa mfano, kati ya daraja DE na FG) una tolerance ya uzalishaji ya ±15%. Kifaa chenye kipimo cha 140 mcd (mpaka wa kawaida) kinaweza kuainishwa katika daraja yoyote kulingana na urekebishaji wa upimaji na tofauti za kundi. Mhandisi anapaswa kutumia thamani ya chini ya daraja kwa mahesabu ya mwangaza katika hali mbaya zaidi.
10. Uundaji Halisi na Uchambuzi wa Kesi za Matumizi

Scenario:

Design a status indicator panel for industrial routers. The panel requires a compact dual-color (red/green) indicator light for "Power/Activity" and "System Fault" indication.

Implementation Plan:

1. Select LTLR1DEKVJNNH155T for its integrated right-angle bracket (simplifies rear-panel mounting), dual-color function (saves space), and black housing (provides good contrast).