EMC3030 LED ya Rangi Kamili - Maelezo ya Kiufundi - Urefu 3.0x3.0mm - Voltage 1.6-3.4V - Nguvu 0.468-0.648W

1. Muhtasari wa Bidhaa

Safu ya EMC3030 ni LED ya hali ya juu ya rangi kamili iliyoundwa kwa matumizi magumu ya taa. Kijenzi hiki kinaunganisha vipande vyeupe, vya kijani, na vya buluu (RGB) ndani ya kifurushi kidogo cha 3.0mm x 3.0mm, na kuwezesha uundaji wa anuwai kubwa ya rangi kupitia mchanganyiko wa rangi. Lengo kuu la muundo wake ni kutoa pato kubwa la mwangaza na ufanisi huku ukidumisha uendeshaji thabiti chini ya mikondo ya juu ya kuendesha.

Core Advantages: The key strengths of this LED include its high lumen output, suitability for high-current operation, and low thermal resistance. These features contribute to stable performance and long operational life in various environments.

Target Market: This LED is engineered for applications requiring vibrant, dynamic, or tunable white light. Its primary target markets are outdoor lighting and architectural lighting, where color effects, durability, and energy efficiency are paramount.

2. Uchambuzi wa kina wa Vigezo vya Kiufundi

Sehemu hii inatoa tafsiri ya kina na ya kitu cha vigezo muhimu vya kiufundi vilivyobainishwa kwenye hati ya maelezo.

2.1 Sifa za Umeme na Mwanga

The luminous flux output is measured at a standard test current (I_F) of 150mA and an ambient temperature (T_a) of 25°C. The typical ranges are:

• Red Chip: 22 to 28 lumens (lm)
• Green Chip: 44 to 51 lm
• Blue Chip: 7 to 12 lm

Toleo la kipimo cha ±7% linatumika kwa thamani hizi za mwangaza. Joto la rangi linalohusiana (CCT) kwa mchanganyiko wa mwanga mweupe linatokana na mchoro wa rangi wa CIE 1931 kulingana na pato la pamoja la vipande vya kibinafsi.

The device features a wide viewing angle (2θ_1/2) of 120 degrees, which is the off-axis angle where luminous intensity drops to half of its peak value. This ensures a broad and even light distribution.

2.2 Vigezo vya Umeme

The forward voltage (V_F) varies by chip color at I_F = 150mA:

• Red: 1.6V to 2.6V (Typical)
• Green: 2.6V to 3.4V (Typical)
• Blue: 2.6V to 3.4V (Typical)

The forward voltage measurement tolerance is ±0.1V. The reverse voltage (V_R) rating for all chips is a maximum of 5V, with a reverse current (I_R) of less than 10µA at this voltage. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

2.3 Viwango vya Juu vya Joto na Kabisa

Kuendesha LED zaidi ya mipaka hii kunaweza kusababisha uharibifu wa kudumu.

• Maximum Forward Current (I_F): 180mA (Continuous) for all colors.
• Maximum Pulse Forward Current (I_FP): 250mA (Pulse width ≤100µs, Duty cycle ≤1/10).
• Maximum Power Dissipation (P_D):
  • Red: 468 mW
  • Kijani: 648 mW
  • Buluu: 648 mW
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +105°C.
• Thermal Resistance (R_{th j-sp}): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 5°C/W for all colors at I_F=150mA. This low value is crucial for effective heat management.

It is critically important that the total power dissipation in the application does not exceed the specified P_D ratings to ensure reliability.

3. Maelezo ya Mfumo wa Kugawa kwa Makundi

The LEDs are sorted (binned) according to key performance parameters to ensure consistency in production runs. The binning is performed at I_F = 150mA and T_a = 25°C.

3.1 Kugawa kwa Makundi kulingana na Urefu wa Wimbi Kuu

Hii inafafanua rangi sahihi ya mwanga unaotolewa na kila kipande.

• Red: Binned into codes RB2 (615-620nm), RC1 (620-625nm), and RC2 (625-630nm).
• Green: Binned into a single code GC3, covering a range from 520nm to 535nm in 2.5nm steps (e.g., 520-522.5nm, 522.5-525nm, etc.).
• Blue: Binned into multiple codes: BB3 (450-452.5nm), BB4 (452.5-455nm), up to BC6 (467.5-470nm).

Toleo la kipimo cha urefu wa wimbi ni ±1nm.

3.2 Kugawa kwa Makundi kulingana na Mwangaza

LED zimegawanywa katika makundi kulingana na pato lao la mwanga.

• Red: Code DR0 (22-28 lm)
• Green: Code DG0 (44-51 lm)
• Blue: Code DB0 (7-12 lm)

Toleo la kipimo cha mwangaza ni ±7%.

3.3 Kugawa kwa Makundi kulingana na Voltage ya Mbele

Uchaguzi huu unahakikisha usawa wa umeme katika muundo wa mzunguko. Makundi ya voltage yanatangaza kutoka AB2 (1.8-2.0V) hadi AF1 (3.2-3.4V), na toleo la kipimo la ±0.1V.

4. Uchambuzi wa Mviringo wa Utendaji

Hati ya maelezo inajumuisha grafu kadhaa zinazoonyesha tabia ya LED chini ya hali tofauti. Kuelewa hizi ni muhimu kwa muundo bora.

• Forward Current vs. Relative Intensity (Fig. 3): This curve shows how light output increases with drive current. It is typically non-linear, and operating near the maximum current may reduce efficacy and lifespan.
• Forward Current vs. Forward Voltage (Fig. 4): This IV curve is essential for driver design. The forward voltage increases with current, and the relationship differs slightly between the red, green, and blue chips due to their different semiconductor materials.
• Ambient Temperature vs. Relative Luminous Flux (Fig. 5): This graph demonstrates thermal derating. As the ambient temperature rises, the light output decreases. Designers must account for this to maintain consistent brightness in warm environments.
• Ambient Temperature vs. Relative Forward Voltage (Fig. 6): The forward voltage typically decreases as temperature increases. This characteristic is important for constant-current driver stability.
• Ambient Temperature vs. Maximum Forward Current (Fig. 7): This derating curve is critical. It shows the maximum allowable forward current must be reduced as ambient temperature increases to prevent overheating. For example, at 85°C, the maximum current for the red chip is approximately 136.4mA, and for green/blue chips, it is around 93.7mA and 90.9mA respectively.
• Color Spectrum (Fig. 1) & Viewing Angle Distribution (Fig. 2): These figures provide visual references for the spectral output and beam pattern of the LED.

5. Taarifa za Mitambo na Kifurushi

5.1 Vipimo vya Kifurushi

LED imewekwa kwenye kifurushi cha EMC3030 cha kushikilia uso. Vipimo vya jumla ni 3.0mm kwa urefu na 3.0mm kwa upana. Mchoro wa kina wa mitambo unabainisha mahali halisi pa vipande vya LED, alama za cathode/anode, na muundo wa lenzi. Toleo la jumla la vipimo ni ±0.2mm isipokuwa ikiwa imebainishwa vinginevyo.

5.2 Muundo Unapendekezwa wa Pad ya Kuuza

Muundo wa ardhi (ukubwa wa mguu) umetolewa kwa muundo wa PCB. Kuzingatia muundo huu wa pad unapendekezwa ni muhimu kwa kuuza kwa kuaminika, uhamisho sahihi wa joto, na kuzuia "kujikunja" wakati wa kuyeyusha tena. Vipimo vya pad vina toleo la ±0.1mm.

5.3 Kutambua Upekee wa Miguu

Kifurushi kinajumuisha alama za kutambua terminali ya cathode (hasi) kwa kila kipande cha rangi. Muunganisho sahihi wa upekee wa miguu ni lazima ili kuepuka kuharibu LED.

6. Miongozo ya Kuuza na Usanikishaji

6.1 Vigezo vya Kuuza kwa Kuyeyusha Tena

LED inafaa na michakato ya kuuza kwa kuyeyusha tena isiyo na risasi (Pb-free). Profaili iliyobainishwa ni muhimu:

• Peak Package Body Temperature (T_p): Maximum 260°C.
• Time above Liquidous (T_L=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (T_L to T_p): Maximum 3°C/second.
• Ramp-down Rate (T_p to T_L): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Kufuata kikamilifu profaili hii inazuia mshtuko wa joto na uharibifu wa kifurushi cha LED na viunganisho vya waya vya ndani.

6.2 Tahadhari za Kushughulikia na Kuhifadhi

LED ni nyeti kwa utokaji umeme tuli (ESD). Tumia taratibu sahihi za kushughulikia salama za ESD (vifungo vya mkono, mati zinazowasilisha). Hifadhi katika mazingira kavu, yasiyo na umeme tuli ndani ya safu maalum ya joto (-40°C hadi +105°C). Epuka kufichuliwa kwa unyevu kabla ya kuuza; ikiwa ni lazima, fuata maelekezo ya kupika ya mtengenezaji.

7. Taarifa za Ufungaji na Kuagiza

7.1 Ufungaji wa Mkanda na Reel

LED hutolewa kwenye mkanda wa kubeba uliochorwa kwenye reeli kwa usanikishaji wa kuchukua-na-kuweka otomatiki. Reeli inaweza kubeba kiwango cha juu cha vipande 5,000. Mchoro wa vipimo vya mkanda, ikiwa ni pamoja na nafasi ya mfuko na kipenyo cha reeli, umetolewa. Toleo la jumla juu ya hatua 10 ni ±0.25mm.

7.2 Mfumo wa Nambari ya Sehemu

The part number follows a structured format: T □□ □□ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "3C" for the 3030 package.
• CCT/Color Code: "CW" for RGB (full color).
• Number of Serial/Parallel Chips, Component Code, Color Code: These digits specify internal configurations, binning selections (like wavelength and flux), and other product variants.

Kushauriana na jedwali kamili la kugawa kwa makundi ni muhimu ili kufafanua nambari maalum ya sehemu kwa sifa zake halisi za utendaji.

8. Mapendekezo ya Matumizi

8.1 Mazingira ya Kawaida ya Matumizi

• Architectural Facade Lighting: Creating dynamic color-changing effects on buildings.
• Outdoor Landscape Lighting: Illuminating pathways, trees, and water features with colored light.
• Signage and Display Backlighting: For vibrant, attention-grabbing signs.
• Entertainment and Stage Lighting: Where programmable color is required.

8.2 Mambo Muhimu ya Kuzingatia katika Ubunifu

• Thermal Management: This is the most critical factor for longevity. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder point temperature within safe limits, especially when driving at high currents or in high ambient temperatures.
• Drive Current: Use a constant-current driver tailored for RGB LEDs. The current should be set based on the required brightness and thermal derating curves. Do not exceed the absolute maximum ratings.
• Color Mixing and Control: To achieve consistent white light or specific colors, use pulse-width modulation (PWM) to independently control the intensity of each chip. Consider the different luminous efficacies of the red, green, and blue chips in your control algorithm.
• Optics: Secondary optics (lenses, diffusers) may be needed to achieve the desired beam angle and color mixing uniformity.

9. Ulinganisho wa Kiufundi na Tofauti

Ingawa kulinganisha na washindani wa moja kwa moja hakuko kwenye hati ya maelezo, vipimo vya EMC3030 vinasisitiza nafasi yake ya ushindani:

• vs. Smaller Packages (e.g., 3528): The 3030 package typically offers higher power handling and lumen output due to a larger thermal path and potentially larger chip size.
• vs. Standard 5050 RGB LEDs: The 3030 may offer a more compact solution with similar or better performance, allowing for higher pixel density in dense arrays or finer-pitch displays.
• Key Differentiators: The specified low thermal resistance (5°C/W) and high maximum drive current (180mA) suggest a design optimized for thermal performance, enabling sustained high-brightness operation compared to parts with higher thermal resistance.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q: Can I drive all three chips (RGB) at 180mA simultaneously?
A: No. The absolute maximum power dissipation (P_D) must not be exceeded. Driving red at 180mA (V_F~2.1V) gives ~378mW, which is below its 468mW limit. However, driving green or blue at 180mA (V_F~3.0V) gives ~540mW, which is below their 648mW limit. The total power for all three would be ~1.46W, which must be dissipated by the PCB/heatsink. More importantly, you must consult the derating curve (Fig. 7) which reduces the allowable current at higher ambient temperatures.

Q: Why is the luminous flux for the blue chip lower than red and green?
A: This is related to human eye sensitivity (photopic response). The eye is least sensitive to blue light (~450-470nm). Therefore, a blue LED requires more radiant power to achieve the same perceived brightness (luminous flux) as a green LED, where the eye's sensitivity peaks. The specified values reflect this physiological reality.

Q: How do I select the correct bin codes for my project?
A: For color-critical applications (e.g., uniform white light across multiple LEDs), you must specify tight bins for dominant wavelength (especially for green and blue) and forward voltage. For less critical applications, wider bins may be acceptable and more cost-effective. Always consult the full binning tables when placing an order.

11. Utafiti wa Kesi ya Ubunifu wa Vitendo

Scenario: Designing an outdoor architectural linear light with tunable white light (2700K to 6500K).

Utendaji:

1. LED Selection: Use the EMC3030 RGB LEDs. The red, green, and blue outputs are mixed to simulate various white points along the black body locus.
2. Thermal Design: The fixture is aluminum. The PCB is a metal-core PCB (MCPCB) to efficiently transfer heat from the LED solder point to the fixture body. Calculations are performed to ensure the junction temperature remains below 85°C at the maximum ambient temperature (e.g., 40°C) and drive current.
3. Electrical Design: A constant-current LED driver with three independent PWM channels is used. The current is set to 150mA per chip, providing a good balance of brightness and efficacy. The forward voltage bins are considered to ensure the driver's compliance voltage is sufficient for all units in production.
4. Optical Design: A milky white diffuser cover is placed over the LED array to blend the individual RGB points into a uniform, glare-free linear light source.
5. Control: A microcontroller runs an algorithm that maps desired CCT values to specific PWM duty cycles for the R, G, and B channels, calibrated based on the actual binning of the LEDs used.

12. Utangulizi wa Kanuni ya Uendeshaji

EMC3030 ni LED yenye vipande vingi. Kila kipande ni diode ya semikondukta iliyotengenezwa kutoka kwa mifumo tofauti ya nyenzo:

• Red: Typically based on Aluminum Gallium Indium Phosphide (AlGaInP).
• Green & Blue: Typically based on Indium Gallium Nitride (InGaN).

Wakati voltage ya mbele inatumika, elektroni na mashimo hujumuishwa tena ndani ya eneo lenye shughuli la semikondukta, na kuachisha nishati kwa njia ya fotoni (mwanga). Urefu maalum wa wimbi (rangi) wa mwanga umedhamiriwa na nishati ya pengo la bendi ya nyenzo ya semikondukta. Rangi tatu za msingi (Nyekundu, Kijani, Buluu) zimechanganywa kwa njia ya kuongeza ndani ya kifurushi kimoja. Kwa kudhibiti kwa kujitegemea ukali wa kila kipande, anuwai kubwa ya rangi, ikiwa ni pamoja na vivuli mbalimbali vya mwanga mweupe, inaweza kutolewa.

13. Mienendo ya Teknolojia

Maendeleo ya LED za rangi kamili kama EMC3030 yanaongozwa na mienendo kadhaa inayoendelea katika tasnia ya taa:

• Increased Efficacy (lm/W): Continuous improvements in epitaxial growth and chip design lead to higher light output per electrical watt, improving energy efficiency.
• Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and tighter binning processes enable more accurate and consistent color production, which is critical for architectural and retail lighting.
• Higher Power Density and Better Thermal Management: Package designs are evolving to extract heat more efficiently, allowing for higher drive currents and sustained lumen output in compact form factors.
• Integration with Smart Controls: LEDs are increasingly designed to be paired with intelligent drivers and IoT connectivity, enabling dynamic color tuning, scheduling, and data collection for human-centric and energy-saving lighting solutions.
• Miniaturization: The push for smaller pixels in fine-pitch direct-view LED displays continues, though this balances against the need for thermal performance and light output.