Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Maelezo ya Vigezo vya Kiufundi
- 2.1 Viwango vya Juu Kabisa
- 2.2 Electro-Optical Characteristics
- 3. Mfumo wa Uainishaji Maelezo
- 3.1 Uainishaji wa Nguvu ya Mwanga
- 3.2 Forward Voltage Binning
- 3.3 Chromaticity Coordinate Binning
- 4. Mechanical and Packaging Information
- 4.1 Package Dimensions
- 4.2 Packaging and Handling
- 5. Mwongozo wa Uchomaji na Usanikishaji
- 5.1 Mahitaji ya Uhifadhi na Kinga ya Unyevu
- 5.2 Mchakato wa Uchomeleaji
- 6. Mapendekezo ya Utumiaji na Mazingatio ya Ubunifu
- 6.1 Mandhari ya Kawaida ya Utumiaji
- 6.2 Key Design Considerations
- 7. Technical Comparison and Differentiation
- 8. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- 9. Practical Design and Usage Cases
- 10. Working Principles and Technology Trends
- 10.1 Basic Working Principles
- 10.2 Objective Technical Trends
1. Product Overview
17-21/T1D-KQ1R2B5Y/3T is a compact surface-mount device (SMD) LED, specifically designed for modern electronic applications that require miniaturization and high reliability. This monochrome LED emits pure white light, achieved through an InGaN chip encapsulated in yellow diffused resin. Its primary advantage lies in a significantly reduced footprint compared to traditional lead-frame LEDs, thereby increasing component assembly density on printed circuit boards (PCBs), reducing equipment storage space, and ultimately contributing to the development of smaller and lighter end-user devices. This component is fully RoHS compliant, adheres to EU REACH regulations, and is manufactured as a halogen-free product, with bromine and chlorine content strictly controlled below industry standards.
1.1 Core Advantages and Target Market
Dhamira ya muundo wa LED ya 17-21 SMD inazingatia usaidizi wa ufinyu. Ukubwa wake mdogo wa kimwili hubadilishwa moja kwa moja kuwa nafasi ndogo inayohitajika kwenye bodi, na kuwapa wabunifu uwezo wa kuunda bidhaa zenye ukubwa mdogo zaidi. Tabia yake nyepesi ya kufunga inafanya iweze kutumika hasa katika matumizi ya kubebebeka na ya ufinyu, ambapo kila gramu ni muhimu. Kifaa hiki kinapatikana katika umbo la mkanda wa kubeba wa mm 8 uliowekwa kwenye reeli yenye kipenyo cha inchi 7, na kuhakikisha kuwa kinapatana na vifaa vya kasi ya juu, vya kiotomatiki vya kukusanyia vifaa vilivyofungwa kwenye uso, jambo muhimu kwa uzalishaji wa wingi. Upatanishi wake na mchakato wa kuunganishia kwa kutumia mionzi ya infrared na mvuke hutoa mabadiliko katika utengenezaji. Masoko makuu yanayolengwa ni pamoja na vifaa vya matumizi ya kawaida, mambo ya ndani ya magari (hasa taa za nyuma za dashibodi na swichi), vifaa vya mawasiliano kwa ajili ya kuonyesha hali, na taa za nyuma za jumla za LCD na paneli za udhibiti.
2. Maelezo ya Vigezo vya Kiufundi
Sehemu hii inachambua kwa kina na kwa uwazi vigezo muhimu vya umeme, vya nuru na vya joto vilivyobainishwa katika hati ya maelezo, na kuelezea umuhimu wake kwa usanifu wa saketi na uimara.
2.1 Viwango vya Juu Kabisa
Absolute maximum ratings define the stress limits that may cause permanent damage to the LED. These are not normal operating conditions but thresholds that must never be exceeded.
- Reverse Voltage (VR): 5V- Applying a reverse bias exceeding 5V may cause immediate junction breakdown. The datasheet clearly states that this device is not designed for reverse operation; this rating is primarily for IR (reverse current) test conditions. In applications where reverse voltage is possible, external circuit protection (such as a parallel diode) is typically required.
- Forward Current (IF): 10mA- This is the recommended maximum continuous DC current to ensure long-term reliable operation. Exceeding this current will increase the junction temperature, accelerate luminous flux degradation, and significantly shorten the device's lifetime.
- Peak Forward Current (IFP): 100mA- The LED can withstand short-duration current pulses up to 100mA (with a 1/10 duty cycle at 1kHz). This pertains to pulsed operation or transient surges and should not be used for calculating steady-state power dissipation.
- Power Dissipation (Pd): 40mW- This is the maximum power the package can dissipate as heat when the ambient temperature (Ta) is 25°C. The actual power dissipation is calculated as: Forward Voltage (VF) * Forward Current (IF). Careful thermal management is required when operating near or exceeding this limit.
- Operating and Storage Temperature:The device has an operating temperature rating of -40°C to +85°C and a storage temperature range of -40°C to +90°C. This wide range makes it suitable for automotive and industrial environments.
- Soldering Temperature:Two temperature profiles are specified: reflow soldering at 260°C for 10 seconds (typical for lead-free processes) and hand soldering at 350°C for 3 seconds. Adhering to these limits is crucial to prevent damage to the internal chip bonding or plastic package.
2.2 Electro-Optical Characteristics
These parameters, measured under standard test conditions (Ta=25°C, IF=5mA), define the LED's performance.
- Luminous intensity (Iv): 72.0 - 180.0 mcd (typical)- This is the amount of visible light emitted in a specific direction. The very wide range (72 to 180 mcd) indicates that the LEDs are sorted into different "bins" based on their measured output, which will be detailed in a later section. The 5mA test current is below the maximum rating, providing a safety margin for measurement.
- Viewing angle (2θ1/2): 150° (typical)- Hii ni pembe inapokuwa nusu ya nguvu ya mwanga kwenye 0° (mhimili). Pembe ya mtazamo ya 150° ni pana sana, hutoa muundo wa utoaji wa mwanga unaofanana na Lambertian, unaofaa kwa taa za eneo na taa za nyuma zinazohitaji usambazaji sawa wa mwanga, na sio mwale uliolengwa.
- Voltage ya Mbele (VF): 2.7V - 3.1V (Thamani ya Juu)- Hii ni punguzo la voltage kwenye LED inapoendeshwa na mkondo wa majaribio wa 5mA. Tofauti hii hutokana na uvumilivu wa mchakato wa semiconductor na pia inasimamiwa kupitia kikundi. Kwa kuwa VF sio thamani maalum, lazima kila wakati utumie kipingamizi cha mfululizo cha kudhibiti mkondo ili kuweka mkondo wa uendeshaji.
- Mkondo wa Nyuma (IR): 50 μA (Thamani ya Juu)- This is the leakage current when a 5V reverse bias is applied. In a healthy device, this current is typically very small.
3. Mfumo wa Uainishaji Maelezo
To ensure consistency in mass production, LEDs are tested and grouped or "binned" according to performance. The 17-21/T1D-KQ1R2B5Y/3T employs a multi-parameter binning system, as indicated by the code "KQ1R2B5Y".
3.1 Uainishaji wa Nguvu ya Mwanga
Nguvu ya mwanga imegawanywa katika vikundi vinne tofauti (Q1, Q2, R1, R2). Wakati wa kubainisha au kuagiza, "R2" kwenye nambari ya sehemu inaashiria kikundi kilichochaguliwa.
- Gear Q1:72.0 - 90.0 mcd
- Gear Q2:90.0 - 112.0 mcd
- Gear R1:112.0 - 140.0 mcd
- Gear R2:140.0 - 180.0 mcd
This allows designers to select the appropriate brightness level based on their application, with higher gears typically used in situations where maximum light output is crucial.
3.2 Forward Voltage Binning
Forward voltage is binned from 2.7V to 3.1V in 0.1V steps. The "B5" in the part number corresponds to one of these bins. Using matched VF bins in a design helps ensure even current distribution when multiple LEDs are connected in parallel.
- Bin 29:2.7 - 2.8V
- Gear 30:2.8 - 2.9V
- Gear 31:2.9 - 3.0V
- Gear 32:3.0 - 3.1V
3.3 Chromaticity Coordinate Binning
The color of white light is defined by its chromaticity coordinates (x, y) on the CIE 1931 chromaticity diagram. The datasheet defines four quadrilateral bins (3, 4, 5, 6) on this chart. The "Y" in the part number may refer to the yellow diffusing resin and the associated color bin (e.g., Bin 5). The specified tolerance is ±0.01 on both the x and y coordinates, which is a standard tolerance for white LEDs, ensuring perceived color consistency within a batch.
4. Mechanical and Packaging Information
4.1 Package Dimensions
The 17-21 SMD LED employs a compact rectangular package. Key dimensions (in mm) include: typical body length of approximately 1.6mm, width of about 0.8mm, and height of around 0.6mm. The detailed package drawing provides precise dimensions, including pad locations and tolerances (typically ±0.1mm unless otherwise specified). The cathode is clearly marked, which is crucial for correct orientation during assembly. The small size necessitates precise PCB pad design to ensure good soldering and mechanical stability.
4.2 Packaging and Handling
Vipengele vinatolewa katika mfumo wa ufungaji wa Moisture Sensitive Device (MSD). Vinatolewa katika umbo la mkanda wa kubeba wenye matuta (pitch ya 8mm), vilivyoviringishwa kwenye reel ya inchi 7, kwa idadi ya vipande 3000 kwa kila reel. Ufungaji unajumuisha draya na kufungwa kwenye mfuko wa alumini usio na unyevu. Lebo ya reel inajumuisha maelezo muhimu: Nambari ya Sehemu ya Mteja (CPN), Nambari ya Sehemu ya Mtengenezaji (P/N), Idadi (QTY) pamoja na msimbo maalum wa kiwango cha mwanga (CAT), rangi (HUE) na voltage ya mbele (REF).
5. Mwongozo wa Uchomaji na Usanikishaji
Uendeshaji sahihi na uchomeaji ni muhimu kwa uaminifu wa vipengele vya SMD.
5.1 Mahitaji ya Uhifadhi na Kinga ya Unyevu
LED hii ni nyeti kwa unyevunyevu (inamaanisha kiwango cha MSL). Mfuko haupaswi kufunguliwa kabla ya kutumia kipengele. Baada ya kufunguliwa, LED zisizotumika lazima zihifadhiwe chini ya hali ya ≤30°C na ≤60% RH, na zitumike ndani ya saa 168 (siku 7). Ikiwa muda huu utazidiwa au kiwango cha unyevunyevu kionyeshaji cha kikaushi kimejaa, basi kabla ya matumizi inahitaji kukaushwa kwa 60±5°C kwa saa 24, ili kuondoa unyevunyevu uliokithiri, na kuzuia tukio la "popcorn" wakati wa upakiaji wa solder.
5.2 Mchakato wa Uchomeleaji
Upakiaji wa Solder:A lead-free reflow temperature profile with a peak temperature of 260°C for a duration not exceeding 10 seconds is specified. Components should not be subjected to more than two reflow cycles. Stress must be avoided on the LED body during the heating process.
Hand Soldering:如有必要,可以使用烙铁头温度≤350°C、每个端子焊接时间≤3秒进行手工焊接,建议使用低功率烙铁(≤25W)。建议端子之间有>2秒的冷却间隔。规格书强烈警告,手工焊接通常会导致损坏。
Rework:Rework after soldering is not encouraged. If unavoidable, a dedicated dual-head soldering iron must be used to heat both terminals simultaneously to prevent thermal stress on the chip. The impact on LED characteristics must be evaluated beforehand.
6. Mapendekezo ya Utumiaji na Mazingatio ya Ubunifu
6.1 Mandhari ya Kawaida ya Utumiaji
- Backlighting:With its wide viewing angle and uniform light distribution, it is ideal for backlighting instrument panel clusters, membrane switches, keyboards, and symbols.
- Onyesho ya Hali:Inafaa kabisa kwa vifaa vya mawasiliano (simu, faksi), bidhaa za elektroniki za watumiaji na udhibiti wa viwanda kwa taa za onyesho la hali ya umeme, muunganisho au utendaji.
- Mwanga wa Nyuma ya LCD:Inaweza kutumika kwa maonyesho ya LCD ndogo za rangi moja au zenye rangi za nyuma za aina ya upande au moja kwa moja.
- Onyesho la jumla:Kwa hali yoyote inayohitaji taa ndogo, ya kuaminika, na nyepesi ya rangi nyeupe ya kuonyesha.
6.2 Key Design Considerations
- Current limiting is mandatory:LEDs are current-driven devices. A series resistor must always be used to set the forward current. The datasheet warns that without a current-limiting resistor, minor variations in the supply voltage can cause large and destructive changes in current. The resistor value is calculated using Ohm's Law: R = (Supply Voltage - LED Forward Voltage) / Desired Current. For conservative design, always use the maximum VF value from the binning or the datasheet.
- Thermal Management:Ingawa kifuniko ni kidogo, matumizi ya nguvu (hadi 40mW) hutoa joto. Kwa uendeshaji endelevu chini ya mkondo mkubwa (karibu 10mA), hakikisha PCB ina muundo wa kutosha wa kutolea joto, hasa wakati LED nyingi zimekusanywa pamoja. Joto la juu la kiungo hupunguza pato la mwanga na maisha ya huduma.
- Ulinzi wa ESD:Kifaa hiki kina kiwango cha ESD HBM cha 150V, ambacho ni cha chini kiasi. Kanuni za kawaida za kuzuia ESD zinapaswa kufuatwa wakati wa uendeshaji na usakinishaji.
- Optical Design:The 150° viewing angle and yellow diffusing resin create a soft, wide beam. For focused illumination, an external lens or light guide is required. When used behind a diffuser panel, the diffusing resin helps achieve a uniform appearance.
7. Technical Comparison and Differentiation
The 17-21 package belongs to the ultra-miniature SMD LED category. Its primary differentiation lies in achieving a relatively high luminous intensity (up to 180 mcd) within an extremely small footprint (1.6x0.8mm). Compared to larger SMD LEDs (e.g., 3528, 5050), it offers superior space savings, but the total light output or power handling capability may be lower. Compared to smaller chip LEDs, operation is more straightforward due to its package form and integrated lens. Clear binning for intensity, voltage, and chromaticity provides a level of performance consistency that is crucial for applications requiring a uniform appearance, such as backlight arrays.
8. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
Q: Since it can withstand 100mA pulses, why is the forward current limited to 10mA?
Jibu: Ukadiriaji wa 10mA unatumika kwa uendeshaji endelevu, ili kuhakikisha uimara wa muda mrefu na kudumisha utendakazi maalum wa optiki. Ukadiriaji wa msukumo wa 100mA unatumika kwa misukumo ya muda mfupi (mfano, 0.1ms katika kila 1ms). Uendeshaji endelevu kwa mkondo wa juu unaongeza joto la kiungo, kusababisha uharibifu wa kasi wa fosforasi na semikondukta, na hatimaye kusababisha kuzorota mapema au kushindwa kufanya kazi.
Swali: Je, ni jinsi gani ya kuchagua upinzani unaofaa wa kukandamiza mkondo?
Jibu: Tumia fomula R = (Voltage ya usambazaji - VF) / IF. Kwa usambazaji wa 5V na mkondo lengwa wa 5mA, kwa usalama tumia VF ya juu zaidi ya 3.1V: R = (5 - 3.1) / 0.005 = 380 ohms. Thamani ya kawaida iliyo karibu zaidi (390 ohms) itakuwa chaguo zuri. Hakikisha kuthibitisha nguvu ya ukadiriaji ya upinzani: P = I^2 * R.
Swali: Naweza kutumia pini ya GPIO ya microcontroller kuendesha LED hii moja kwa moja?
Jibu: Labda, lakini kwa tahadhari. Pini ya kawaida ya GPIO inaweza kutoa/kukubali mkondo wa 20-25mA. Lazima ujumuishe resistor mfululizo. Zaidi ya hayo, hakikisha voltage ya pato ya microcontroller inatosha kushinda VF ya LED (2.7-3.1V). Microcontroller ya 3.3V inaweza kufanya kazi kwenye mwisho wa chini wa anuwai ya VF, lakini usambazaji wa 5V ni wa kuaminika zaidi. Kamwe usiunganishe LED moja kwa moja kati ya pini na ardhi bila resistor.
Swali: "Lead-free" na "Halogen-free" zina maana gani kwa matumizi yangu?
答:“无铅”意味着可焊性表面处理不含铅,符合RoHS等环保法规。“无卤素”(Br <900ppm, Cl <900ppm, Br+Cl <1500ppm)意味着塑料封装材料含有极少的卤素,如果器件暴露在极端高温或火灾中,可以减少有毒烟雾的排放,改善环境和安全性能。
9. Practical Design and Usage Cases
Scenario: Designing a backlit keyboard for medical equipment.
The design requires the installation of 12 white indicator lights behind the silicone rubber keys. Space on the double-sided PCB is extremely limited. The 17-21 LED was chosen for its minimal footprint. The designer selected the R2 luminous intensity grade to ensure good visibility in bright environments. All LEDs are specified to the same VF grade (e.g., 30) to promote uniform brightness in a parallel configuration (each parallel branch driven by a current-limiting resistor, rather than all 12 sharing one resistor). The PCB layout places thermal pads according to the datasheet drawing. Instruct the assembly factory to follow the specified reflow temperature profile and keep components in sealed bags before placement. After assembly, the 150° wide viewing angle ensures even illumination for each key without hotspots.
10. Working Principles and Technology Trends
10.1 Basic Working Principles
Hii ni LED nyeupe ya aina ya ubadilishaji wa fosforesheni. Kiini chake ni chipu ya semikondukta iliyotengenezwa kwa indiamu-galliamu nitraidi (InGaN), ambayo inatoa mwanga wa bluu au karibu na ultravioletti wakati wa upendeleo wa mbele (umeme-luminiscence). Mwanga huu wa msingi kisha unachukuliwa na safu ya fosforesheni – katika mfano huu, fosforesheni inayotoa mwanga wa manjano inayoelea kwenye kifungashio cha resini chenye kutawanyika. Fosforesheni hutoa tena mwanga kwa urefu wa wimbi mrefu zaidi (manjano). Mwanga wa bluu usiobadilishwa kutoka kwenye chipu na mwanga wa manjano uliobadilishwa kutoka kwenye fosforesheni huchanganyika na kutoa mtazamo wa mwanga "nyeupe". Kivuli halisi (baridi nyeupe, safi nyeupe, joto nyeupe) huamuliwa na muundo na kiasi cha fosforesheni inayotumika, ambayo hudhibitiwa wakati wa utengenezaji kufikia daraja maalum la rangi.
10.2 Objective Technical Trends
Mwelekeo wa jumla wa teknolojia ya SMD LED unaendelea kuelekea malengo kadhaa muhimu:Kuboresha ufanisi (lm/W):Kuongeza mwanga unaotolewa kwa kila kitengo cha nguvu ya umeme iliyowekwa, kupunguza matumizi ya nishati na mzigo wa joto.Uthabiti wa juu na maisha marefu:Kuboresha nyenzo na ufungaji ili kustahimili joto la juu zaidi na muda mrefu wa uendeshaji, wakati kupungua kwa mwangaza wa mwanga kuna kiwango cha chini.Kuboresha usawa wa rangi na ubora wa kuonyesha rangi:Mapungufu madogo zaidi ya kiwango, na kuendeleza fosforasi inayoweza kutoa thamani ya juu zaidi ya faharasa ya kuonyesha rangi (CRI) ili kupata mwanga mweupe wa asili zaidi.Kuzidisha udogo zaidi:Kukuza saizi ndogo za ufungaji, huku ukidumisha au kuongeza pato la mwanga.Suluhisho zilizojumuishwa:LED zilizo na kiwango cha sasa kilichowekwa ndani, kudhibiti, au chipi nyingi ndani ya ufungaji mmoja zinaongezeka ili kurahisisha muundo wa saketi. 17-21 LED zinawakilisha hatua hii ya uendelevu iliyokomaa na yenye gharama nafuu, zilizoboreshwa kwa utendaji thabiti katika matumizi makubwa yenye nafasi ndogo.
Ufafanuzi wa Istilahi za Vipimo vya LED
Ufafanuzi Kamili wa Istilahi za Teknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Kielektroniki na Mwanga
| Istilahi | Kipimo/Uwakilishi | Mafasiri ya Kawaida | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwanga unaotolewa kwa kila watt ya umeme, unavyozidi kuwa mkubwa ndivyo unavyozidi kuokoa nishati. | Inaamua moja kwa moja kiwango cha ufanisi wa nishati na gharama ya umeme ya taa. |
| Mfumuko wa Mwanga (Luminous Flux) | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya Kuangazia (Viewing Angle) | ° (digrii), k.m. 120° | Pembe ambapo nguvu ya mwana hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, makumbusho ya sanaa, n.k. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Hakikisha rangi ya taa za kundi moja hazina tofauti. |
| Mdomo mkuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Huamua hue ya LED za rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Urefu wa Mawimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa mawimbi tofauti. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Mafasiri ya Kawaida | Vidokezo vya Ubunifu |
|---|---|---|---|
| Forward Voltage | Vf | Voltage ya chini inayohitajika ili LED iwashwe, kama "kizingiti cha kuwasha". | Voltage ya chanjo ya umeme lazima iwe ≥ Vf, voltage inaongezeka wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as the current determines brightness and lifespan. |
| Mfumo wa mkondo wa juu zaidi (Pulse Current) | Ifp | Mfumo wa mkondo wa kilele unaoweza kustahimili kwa muda mfupi, unatumika kwa kudimisha au kumulika. | Pulse width and duty cycle must be strictly controlled to prevent overheating and damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Reverse connection or voltage surges must be prevented in the circuit. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa joto wa juu unahitaji muundo wenye nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), e.g., 1000V | ESD strike resistance; a higher value indicates greater resistance to electrostatic damage. | Antistatic measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Istilahi | Key Indicators | Mafasiri ya Kawaida | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi wa eneo la taa. |
| Uchakavu wa Joto (Thermal Aging) | Kupungua kwa Utendaji wa Nyenzo | Uharibifu wa nyenzo za ufungaji kutokana na joto la juu kwa muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Istilahi | Aina za Kawaida | Mafasiri ya Kawaida | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC ina mzuri kwa joto la juu, gharama nafuu; kauri inapunguza joto vizuri, maisha marefu. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichwa-chini (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Planar, microlens, total internal reflection | Optical structure on the package surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Mafasiri ya Kawaida | Kusudi |
|---|---|---|---|
| Mgawanyiko wa Flux ya Mwanga | Misimbo kama vile 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped according to forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Istilahi | Kigezo/Uchunguzi | Mafasiri ya Kawaida | Maana |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording data on brightness attenuation. | Inatumika kukadiria maisha ya LED (kwa kushirikiana na TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Inashughuli njia za uchunguzi wa mwanga, umeme na joto. | Msingi wa uchunguzi unaokubalika na tasnia. |
| RoHS / REACH | Eco-certification | Ensure the product is free from hazardous substances (e.g., lead, mercury). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati. | Uthibitishaji wa Ufanisi na Utendaji kwa Bidhaa za Taa. | Hutumiwa kwa mara nyingi katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |