Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Uchambuzi wa kina wa Vigezo vya Kiufundi
- 2.1 Viwango vya Juu Kabisa
- 2.2 Electro-Optical Characteristics
- 2.3 Electrical Characteristics
- 3. Grading System Description
- 4. Uchambuzi wa Mkunjo wa Utendaji
- 4.1 Usambazaji wa Wigo
- 4.2 Radiation Pattern
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Pin Configuration
- 6. Soldering and Assembly Guide
- 6.1 Reflow Soldering Temperature Profile
- 6.2 Storage and Moisture Sensitivity
- 6.3 Vidokezo
- 7. Ufungaji na Taarifa za Kuagiza
- 7.1 Reel and Carrier Tape Specifications
- 7.2 Label Information
- 8. Mapendekezo ya Ubunifu wa Matumizi
- 8.1 Typical Application Circuit
- 8.2 Data Protocol and Timing
- 8.3 Long-chain Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- 10.1 Je, taa LED zinaweza kuunganishwa mfululizo hadi ngapi kwa upeo?
- 10.2 Je, naweza kuziendesha taa hizi za LED kwa kutumia 3.3V microcontroller?
- 10.3 Why is there a 5mA current limit? Can I increase the brightness?
- 11. Practical Application Examples
- 12. Kanuni ya Ufanyaji Kazi
- 13. Technology Trends
1. Product Overview
61-236-IC ni kiendeshi cha LED cha usakinishaji wa uso chenye muunganisho mkubwa, kilichoundwa mahsusi kwa matumizi ya RGB yenye rangi kamili. Kinachanganya chipsi tatu za kujitegemea za LED (nyekundu, kijani, bluu) na IC maalum ya udhibiti ndani ya kifurushi kimoja cha P-LCC-6. Muunganisho huu unarahisisha muundo wa PCB, bila ya hitaji la vipengele vya nje vya kuendesha kwa kila njia ya rangi. Kifaa hiki kimeundwa kwa matumizi yanayohitaji mchanganyiko mkali wa rangi, athari za mwanga zinazobadilika, na utendakazi thabiti katika umbo dogo.
1.1 Core Advantages and Target Market
Faida kuu ya 61-236-IC iko katika urahisi wake wa kiwango cha mfumo. Inatumia itifaki ya uhamishaji data ya waya mmoja, ikipunguza kwa kiasi kikubwa idadi ya nyaya za udhibiti zinazohitajika kutoka kwa kidhibiti kidogo au kidhibiti kikuu ikilinganishwa na kiolesura cha kawaida cha LED cha RGB sambamba. Hii inaufanya kuwa suluhisho la gharama nafuu kwa miundo inayoweza kupanuliwa. Pembe yake ya upana ya digrii 120 inayopatikana kupitia kioakisi cha ndani na resini wazi, inahakikisha usambazaji sawa wa mwanga, na kuifanya kuwa chaguo bora kwa matumizi ya mabomba ya kuongoza mwanga na taa za mapambo ambazo mwonekano kutoka pembe nyingi ni muhimu sana.
Soko lengwa linajumuisha skrini za LED za rangi nyingi za ndani na nje, mkanda wa taa za mapambo na ujenzi, vifaa vya michezo, na matumizi yoyote yanayohitaji nukta za LED zinazoweza kuanzishwa na zenye rangi nyingi. Kifaa hiki kinakidhi viwango vya RoHS, REACH na bila halojeni, na kuhakikisha kinakidhi kanuni kali za kimataifa za mazingira na usalama.
2. Uchambuzi wa kina wa Vigezo vya Kiufundi
Sehemu hii inachambua kwa kina mipaka ya uendeshaji na sifa za utendaji wa kifaa chini ya hali zilizobainishwa.
2.1 Viwango vya Juu Kabisa
Viwango hivi vinabainisha mipaka ya mkazo ambayo inaweza kusababisha uharibifu wa kudumu wa kifaa. Uendeshaji katika au zaidi ya mipaka hii hauhakikishwi.
- Voltage ya usambazaji wa umeme (Vdd):4.2V hadi 5.5V. Hii inabainisha anuwai ya voltage ya uendeshaji ya mzunguko wa udhibiti wa ndani. Kawaida hutumia chanzo thabiti cha umeme cha 5V.
- Voltage ya pato (Vout):17V. This is the maximum voltage that the driver output stage can withstand, related to the LED forward voltage.
- Input Voltage (Vin):-0.5V to Vdd+0.5V. This specifies the safe voltage range for the data input (Din) and set pins to prevent latch-up or damage.
- LED output current (Iout):5 mA. This is the maximum constant current for each color channel (red, green, blue). Exceeding this current may lead to LED performance degradation or failure.
- Operating temperature (Topr):-25°C to +85°C. The ambient temperature range for reliable device operation.
- Storage temperature (Tstg):-40°C to +90°C. The safe temperature range when the device is not powered.
- ESD (Electrostatic Discharge):2000V (Mtindo wa Mwili wa Binadamu). Inaonyesha kiwango cha ulinzi dhidi ya umeme wa tuli, inashauriwa kushughulikia kwa uangalifu wakati wa usanikishaji.
- Joto la Uchomaji (Tsol):Uchomaji wa Reflow: kiwango cha juu cha 260°C kwa sekunde 10; Uchomaji wa Mikono: kiwango cha juu cha 350°C kwa sekunde 3. Hii ni parameta muhimu ya usanikishaji wa PCB, ili kuepuka uharibifu wa joto kwa kifurushi au chip.
2.2 Electro-Optical Characteristics
Zilipimwa chini ya hali ya Ta=25°C, IF=5mA kwa kila njia, vigezo hivi vinabainisha sifa za mwanga unaotolewa na rangi.
- Nguvu ya Mwangaza (Iv):
- Red (RQH): 90 mcd (minimum) to 280 mcd (maximum).
- Green (GR): 280 mcd (minimum) to 900 mcd (maximum).
- Blue (BY): 71 mcd (min) to 224 mcd (max).
- Viewing Angle (2θ1/2):120 digrii (thamani ya kawaida). Inafafanuliwa kama pembe kamili wakati ukali wa mwanga unapungua hadi nusu ya thamani yake ya kilele. Mtazamo mpana ni sifa muhimu.
- Wavelength kuu (λd):
- Nyekundu (RQH): 617.5 nm hadi 629.5 nm.
- Kijani (GR): 525 nm hadi 540 nm.
- Bluu (BY): 462 nm hadi 474 nm.
2.3 Electrical Characteristics
Imefafanuliwa kwa Ta=-20~+70°C, Vdd=4.5~5.5V, Vss=0V.
- Mkondo wa Pato (IOL):5 mA (typical). The regulated current supplied to each LED.
- Input Current (II):±1 μA (max). Extremely low leakage current on the data input pin.
- Input voltage logic level:
- VIH (Logic High): Minimum 3.3V.
- VIL (Logic Low): Maximum 0.3*Vdd (e.g., 1.65V when Vdd=5.5V).
- Hysteresis Voltage (VH):0.35V (typical). Provides noise immunity for the data input by creating a voltage gap between the high and low level switching thresholds.
- Dynamic Power Supply Current (IDDdyn):2.5 mA (Typical). The current consumed by the internal control logic during data transfer and PWM operation.
3. Grading System Description
Mwongozo unadokeza mfumo wa kugawanya vigezo mbalimbali, ili kuhakikisha usawa wa rangi na mwangaza katika matumizi ya uzalishaji. Ingawa haujaelezewa kwa kina katika jedwali moja, lakini inaweza kudokezwa kutokana na anuwai ya vigezo kama ifuatavyo:
- Nguvu ya mwanga (CAT):Kifaa kinagawanywa kulingana na pato la mwanga lililopimwa (mcd) kwa kila rangi (nyekundu, kijani, bluu). Hii ni muhimu kwa kuhakikisha mwangaza sawa kati ya vitengo vingi kwenye skrini au ukanda wa taa.
- Wavelength kuu (HUE):LED zinagawanywa kulingana na wavelength yao ya kilele (nm). Hii inahakikisha nukta ya rangi thabiti kati ya vifaa vyote katika usanikishaji (k.m., kivuli sawa cha nyekundu au bluu), ambayo ni muhimu kwa mchanganyiko sahihi wa rangi na ubora wa onyesho.
- Voltage ya mbele (REF):Ingawa haijaorodheshwa kwenye jedwali kuu, sehemu ya vifaa vya ufungaji inataja "kiwango cha voltage chanya," ikionyesha kuwa chipi pia inaweza kuainishwa kulingana na sifa zake za voltage chanya (Vf) ili kuhakikisha usambazaji sawa wa nguvu katika mfululizo wa mfululizo/sambamba.
Wakati wa kuagiza, kwa kawaida unaweza kuomba msimbo maalum wa kikundi (CAT, HUE, REF) ili kufanana na mahitaji ya matumizi.
4. Uchambuzi wa Mkunjo wa Utendaji
The datasheet includes typical performance curves, providing insights into behavior beyond single-point specifications.
4.1 Usambazaji wa Wigo
The provided graph shows the relative luminous intensity of the red (RQH), green (GR), and blue (BY) chips across the visible spectrum. Key observations:
- Kila mkunjo unaonyesha kilele dhahiri na nyembamba kinacholingana na urefu wake mkuu wa wimbi, kuthibitisha usawa mzuri wa rangi.
- Utoaji wa rangi nyekundu umelenga katika eneo la urefu mrefu wa wimbi (~620-630nm), kijani katika sehemu ya kati (~525-540nm), na bluu katika eneo la urefu mfupi wa wimbi (~462-474nm).
- Mwingiliano kati ya wigo wa rangi ni mdogo sana, jambo linalofaa kwa kuunda anuwai pana ya rangi wakati wa kuchanganya rangi.
4.2 Radiation Pattern
"Radiation Pattern" inaelezea usambazaji wa anga wa mwanga. Curve ya LED yenye mtazamo mpana kama hii kawaida ni pana na inafanana na aina ya Lambert (usambazaji wa cosine), ikithibitisha vipimo vya digrii 120. Ukali ni wa juu zaidi inapotazamwa moja kwa moja kwenye mhimili (digrii 0), na hupungua kwa utaratibu kuelekea kingo (± digrii 60).
5. Mechanical and Packaging Information
5.1 Package Dimensions and Pin Configuration
The device is housed in a P-LCC-6 (Plastic Leaded Chip Carrier, 6-pin) package. The detailed dimension drawing specifies length, width, height, lead pitch, and pad size, with a general tolerance of ±0.1mm. This information is crucial for PCB pad design.
Ufafanuzi wa Pini:
- Vss:Kiunganishi cha kutia ardhini cha mzunguko wa ndani.
- NA:Haijaunganishwa / Hakuna kiunganishi cha ndani.
- Di:Control data signal input. Receives serial data stream.
- Do:Control data signal output. Transmits data stream to the next device in the daisy chain.
- NA:Haijaunganishwa / Hakuna kiunganishi cha ndani.
- Vdd:Positive power supply input (4.2V to 5.5V).
6. Soldering and Assembly Guide
6.1 Reflow Soldering Temperature Profile
Mwongozo hutoa mkunjo maalum wa joto wa reflow soldering isiyo na risasi:
- Upashaji joto kabla:150–200°C for 60–120 seconds. Maximum ramp rate: 3°C/sec.
- Reflow (above liquidus):Temperature must exceed 217°C for 60–150 seconds. Peak temperature must not exceed 260°C, and the time above 260°C must not exceed 10 seconds.
- Baridi:Kiwango cha juu cha kupunguza joto: 6°C/kwa sekunde. Muda wa joto la juu ya 255°C usizidi sekunde 30.
6.2 Storage and Moisture Sensitivity
The device is packaged in a moisture barrier bag with desiccant.
- Before opening:Hifadhi chini ya hali ya ≤30°C na ≤90% unyevu wa jamaa (RH).
- Maisha ya kiwanda:Baada ya kufungua mfuko uliofungwa, lazima umalizike uuzi ndani ya masaa 24 chini ya hali ya kiwanda (kawaida takriban 30°C/60%RH).
- Baking:If the bag has been opened for more than 24 hours, or if the desiccant indicator shows saturation, it needs to be baked at 60°C ±5°C for 24 hours to remove absorbed moisture and prevent "popcorn" effect (package cracking) during the reflow soldering process.
6.3 Vidokezo
- Kikomo cha Sasa:Kichocheo cha ndani kinatoa sasa thabiti. Hata hivyo, kiwango cha juu kabisa cha Iout ni 5mA. Mzunguko wa matumizi lazima uhakikishe hali ya uendeshaji haizidi kikomo hiki. Chini ya uendeshaji wa kawaida wa 5V, kichocheo chenyewe hakihitaji upinzani wa mfululizo wa nje kwa ajili ya kudhibiti sasa, lakini ni muhimu kuzingatia muundo wa usambazaji wa nguvu.
- Mkazo wa Mitambo:Epuka kutumia mkazo wa mitambo kwenye kifuniko wakati wa kuchomeka au usindikaji. Usipinde PCB karibu na kipengele baada ya kukusanya.
7. Ufungaji na Taarifa za Kuagiza
7.1 Reel and Carrier Tape Specifications
Components are supplied in embossed carrier tape format, wound on reels for automated surface-mount assembly.
- Packaging quantity:800 pieces per reel.
- Detailed drawings of reel dimensions, carrier tape pocket dimensions (width, pitch, depth), and cover tape specifications are provided to ensure compatibility with SMT equipment.
7.2 Label Information
Lebo ya reeli inajumuisha habari muhimu za kufuatilia na kukusanywa kwa usahihi:
- Nambari ya Sehemu ya Mteja (CPN)
- Manufacturer Part Number (P/N): e.g., 61-236-ICRQHGRBYC-A 05-ET-CS
- Quantity (QTY)
- Bin Code: CAT (Intensity), HUE (Wavelength), REF (Voltage)
- LOT No. for traceability
8. Mapendekezo ya Ubunifu wa Matumizi
8.1 Typical Application Circuit
Uhakikisho unaonyesha saketi ya kawaida ya matumizi ya 5V. Kielezo cha Udhibiti Dogo (MCU) au kielezo maalum cha udhibiti hutuma data ya mfululizo kwa pini ya Din ya kiendesha kwanza cha LED. Pini ya Dout ya kila kiendesha imeunganishwa na pini ya Din ya inayofuata, na kuunda mnyororo wa daisy. Chanzo kimoja cha umeme (5V) kinatoa umeme kwa pini zote za Vdd, na pini zote za Vss zimeunganishwa kwenye ardhi. Inashauriwa kutumia kichujio kidogo cha RC (kwa mfano, upinzani wa 100Ω na uwezo wa 100nF) kwenye mstari wa data karibu na MCU, ili kukandamiza kelele za masafa ya juu na kuboresha uadilifu wa ishara, hasa katika minyororo mirefu au mazingira yenye kelele.
8.2 Data Protocol and Timing
The device uses a proprietary single-wire return-to-zero protocol.
- Data Frame:Kila kifaa kina biti 24, zilizopangwa kama biti 8 za kijani, biti 8 za nyekundu na biti 8 za bluu (G7-G0, R7-R0, B7-B0). Hii inaruhusu viwango 256 vya nguvu kwa kila njia ya rangi (0-255).
- Muda wa biti:
- Mantiki '0': Muda wa kiwango cha juu (T0H) = 0.30 µs ±80ns, muda wa kiwango cha chini (T0L) = 0.90 µs ±80ns.
- Logic '1': High-level time (T1H) = 0.90 µs ±80ns, Low-level time (T1L) = 0.30 µs ±80ns.
- The total bit period for both logic '0' and '1' is 1.2 µs, with a data rate of approximately 833 kHz.
- Reset/Latch signal:A low-level pulse on the Din line lasting longer than 50 µs (RES) indicates the end of a data frame. Upon receiving this reset signal, all devices in the chain simultaneously latch the 24-bit data they have just received into their output registers and update their PWM outputs. This ensures all LEDs in the display update synchronously, preventing "ghosting" or "rainbow" effects during data refresh.
8.3 Long-chain Design Considerations
Kwa matumizi mengi ya vifaa vilivyounganishwa mfululizo (mfano, ukanda mrefu wa taa za LED):
- Uingizaji wa umeme:Lazima uingize umeme wa 5V katika pointi nyingi kwenye mnyororo, ili kuzuia kupungua kwa voltage, ambayo inaweza kusababisha LED zilizo mbali na chanzo cha umeme kuwa giza au kubadilisha rangi. Tumia nyuzi nene za umeme au waya tofauti za umeme.
- Uthabiti wa ishara ya data:Mstari mrefu wa data unaweza kukabiliwa na uharibifu wa ishara (muda wa kupanda/kushuka uliopanuliwa, kengele). Kutumia IC ya kuhifadhi au upinzani wa mfululizo wa thamani ya chini (mfano, 33-100Ω) kwenye pembejeo ya kiendeshi husaidia kufananisha upinzani na kupunguza tafakari.
- Kiwango cha Kufanya Upya:Muda wa Jumla wa Kusasisha = (Idadi ya LED * 24-bit * 1.2 µs) + Muda wa Kurejesha. Kwa mnyororo wa LED 100, ni takriban ~2.88 ms + ~0.05 ms = ~2.93 ms, ikiruhusu kiwango cha kufanya upya cha zaidi ya 300 Hz, ambacho kinatosha kwa matumizi mengi ya kuona.
9. Technical Comparison and Differentiation
Ikilinganishwa na suluhisho tofauti (LED ya RGB tofauti + kiendeshi cha mkondo wa kudumu cha nje au kipingamizi + mantiki ya kuzidisha njia nyingi), 61-236-IC inatoa faida kubwa:
- Kupunguzwa kwa idadi ya vipengele:Kuunganisha LED tatu na madereva zake kwenye kifurushi kimoja, kuokoa nafasi ya PCB na gharama ya usanikishaji.
- Udhibiti uliorahisishwa:Itifaki ya mnyororo wa Daisy ya waya mmoja inapunguza sana mahitaji ya GPIO ya MCU — kinachohitajiwa ni pini moja tu kudhibiti mamia ya LED, wakati udhibiti wa kimsingi wa PWM unahitaji pini tatu kwa kila LED ya RGB.
- Udhibiti wa sasa uliojumuishwa:Inatoa mkondo thabiti, unaoweza kurekebishwa kwa kila chip ya LED, kuhakikisha mwangaza na rangi sawia, bila kuathiriwa na mabadiliko madogo ya voltage ya mbele (Vf) kati ya LED binafsi. Hii inaondoa hitaji la vipinga vya kudhibiti mkondo na hasara ya nguvu inayohusiana.
- Sasisho la Sinkroni:Utendakazi wa kufunga/kuweka upya ulimwenguni huruhusu mabadiliko ya rangi kwenye skrini nzima kusawazishwa kikamilifu, ambayo ni kazi isiyoweza kutekelezwa kwa urahisi na LED tofauti za njia nyingi.
10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
10.1 Je, taa LED zinaweza kuunganishwa mfululizo hadi ngapi kwa upeo?
The specification does not stipulate rigid electrical limits. The actual limits are determined by the following factors:Data Timing:通过多个器件的累积传播延迟。对于非常长的链 (>500-1000),数据信号可能会劣化,需要信号调理或分段。 2.Power Distribution:Ili kuhakikisha kila kifaa kwenye mnyororo kinapata voltage ya kutosha (5V), ni muhimu kubuni baa ya usambazaji wa nguvu kwa uangalifu na kuweka sehemu nyingi za kuingiza.Mahitaji ya Kiwango cha Kufanya Upya:LED nyingi zaidi zina maana muda mrefu wa kusasisha sura, ambayo inaweza kuwa dhahiri ikiwa kiwango cha kufanya upya cha maudhui ya kienyezi kinashuka chini ya 60-100 Hz.
10.2 Je, naweza kuziendesha taa hizi za LED kwa kutumia 3.3V microcontroller?
Uhakiki unasema kiwango cha chini cha voltage ya pembejeo ya hali ya juu (VIH) ni 3.3V. Ishara ya mantiki ya hali ya juu ya 3.3V kutoka kwa microcontroller inakidhi kiwango hiki cha chini haswa. Hata hivyo, kufanya kazi kwenye ukingo wa maelezo hakuna ukingo wa kelele. Katika mazingira yenye viunganishi vifupi na yanayodhibitiwa, inaweza kufanya kazi. Kwa utendakazi unaotegemewa, hasa katika mnyororo mrefu au mazingira yenye kelele, inashauriwa kwa nguvu kutumia microcontroller ya 5V au kibadilishaji cha kiwango (mfano, MOSFET rahisi au IC maalum) kubadilisha ishara ya 3.3V kuwa ishara thabiti ya 5V.
10.3 Why is there a 5mA current limit? Can I increase the brightness?
Kikomo cha 5mA kimetatuliwa na muundo wa kiendesha mkondo wa ndani na sifa za joto/umeme za chipu ya LED iliyojumuishwa. Kuzidi kiwango hiki cha juu kabisa kuna hatari ya kupindukia kwa kiendesha IC au chipu ya LED, kusababisha kupungua kwa kasi kwa mtiririko wa mwanga (kuzorota kwa muda) au kushindwa kwa mshtuko. Mwangaza unapaswa kudhibitiwa kupitia uwiano wa wakati wa PWM wa biti 8 (0-255), na sio kwa kuongeza mkondo. Kwa mahitaji ya mwangaza wa juu zaidi, chagua bidhaa tofauti ya LED yenye kiwango cha juu cha mkondo.
11. Practical Application Examples
Scenario: Design a short addressable LED sign.The designer is creating a small sign with 50 independently controllable RGB pixels for displaying animations and text.
- Component Selection:61-236-IC ilichaguliwa kwa sababu ya kiendesha chake kilichojumuishwa, mtazamo mpana unaohakikisha kuonekana kuzuri na udhibiti rahisi wa mnyororo wa daisy.
- Ubunifu wa PCB:Mpangilio wa PCB unajumuisha pedi 50 za kifuniko cha P-LCC-6. Mstari wa data (Din/Do) umepangwa kutoka kwa kiunganishi cha MCU hadi kila pikseli kwa mpangilio. Tumia tabaka nene za usambazaji wa umeme wa 5V na ardhi. Weka capacitor kubwa ya 100µF na capacitors kadhaa za 0.1µF za kupunguza kelele karibu na sehemu ya kuingilia umeme.
- Programu thabiti:对MCU(例如ARM Cortex-M或ESP32)进行编程,以生成精确的1.2 µs位时序。一个缓冲区数组保存所有50个像素的24位颜色值。固件顺序传输1200位 (50 * 24),然后发送一个>50µs的低电平脉冲来锁存数据。
- Assembly:Place components using SMT equipment according to the specified reflow soldering profile. After assembly, test the sign by sending various color patterns to ensure all pixels respond correctly and synchronously.
12. Kanuni ya Ufanyaji Kazi
61-236-IC inafanya kazi kulingana na kanuni ya uendeshaji rahisi na ya moja kwa moja. Ndani yake kuna kijihesabu cha kuhama na kifungo cha kuhifadhi kwa kila njia ya rangi. Mtiririko wa data wa mfululizo unaopokelewa kwenye pini ya Din unahamishwa ndani ya kijihesabu cha kuhama cha biti 24 kulingana na mpangilio wa kingo za ishara. Mara tu msukumo wa kuanzisha upya unapogunduliwa, yaliyomo kwenye kijihesabu cha kuhama huhamishiwa sambamba hadi kwenye vifungo vitatu vya kuhifadhi vya biti 8 (moja kwa nyekundu, kijani, na bluu). Thamani hizi za kifungo hudhibiti moja kwa moja uwiano wa wakati wa jenereta tatu huru za PWM. Kila jenereta ya PWM huendesha chanzo cha mkondo wa mara kwa mara kilichounganishwa na chipi yake ya LED (nyekundu, kijani, au bluu). Chanzo cha mkondo wa mara kwa mara kinahakikisha kuwa wakati ishara ya PWM iko katika hali ya juu, LED inapokea mkondo thabiti wa 5mA, bila kuathiriwa na mabadiliko madogo ya voltage ya mbele ya LED. Mchanganyiko wa rangi za msingi tatu zilizorekebishwa na PWM katika kila nukta hutoa rangi iliyochanganywa inayohitajika. Data pia inahamishwa nje wakati huo huo hadi kwenye pini ya Dout, ikiruhusu mtiririko huo wa data kuenea kwa ucheleweshaji mdogo hadi kifaa kinachofuata katika mnyororo.
13. Technology Trends
Devices like the 61-236-IC represent a mature and widely adopted approach in the field of addressable RGB LEDs. The trend in this field is moving towards higher integration and more intelligent features:
- Higher Bit Depth:Kuendelea kutoka kwa biti 8 kwa kila kituo (viwango 256) hadi PWM ya biti 10, 12 na hata 16, ili kufikia mabadiliko laini zaidi ya rangi na usahihi wa rangi wa kiwango cha kitaalamu, hasa katika skrini za hali ya juu na taa za majengo.
- Kumbukumbu ya ndani iliyojumuishwa na muundo:Baadhi ya madereva mapya yana kumbukumbu ya ndani iliyokunjwa, inayotumika kuhifadhi muundo au uhuishaji wa taa uliopangwa awali, na hivyo kuondoa kazi hii kutoka kwa kudhibiti kuu na kuwezesha uendeshaji huru.
- Kasi ya juu ya data na itifaki:Adoption of faster, more robust serial communication protocols (such as SDI with differential signaling) to support longer cable lengths, higher pixel counts, and refresh rates suitable for high-speed video.
- Improved Efficiency and Thermal Management:Development of more efficient drivers to reduce power lost as heat, enabling the use of brighter LEDs or denser packaging. This includes advanced thermal design within the package.
- Kupanua anuwai ya rangi:Unganisha rangi za ziada za LED zinazozidi RGB, kama nyeupe (W), ya kahawia (A) au ya ndimu (L), ili kuunda moduli za RGBW au RGBAW, zinazoweza kutoa anuwai pana zaidi ya rangi, ikijumuisha nyeupe asilia zaidi na vivuli laini.
Maelezo ya Istilahi za Uainishaji wa LED
Ufafanuzi Kamili wa Istilahi za Teknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Kielektroniki na Mwanga
| Terminology | Unit/Representation | Layman's Explanation | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Mfumko wa Mwanga (Luminous Flux) | lm (lumeni) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa jina la "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuona (Viewing Angle) | ° (digrii), kama 120° | Pembe ambayo mwangaza hupungua hadi nusu, huamua upana wa mwale. | Inapata ushawishi kwenye eneo la mwanga na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects; Ra≥80 is considered good. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative indicator of color consistency; a smaller step number indicates better color consistency. | Ensure no color difference among luminaires from the same batch. |
| Mdomo Mkuu (Dominant Wavelength) | nm (nanometer), k.m. 620nm (nyekundu) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Mkunjo wa Mzunguko wa Mwanga dhidi ya Nguvu | Inaonyesha usambazaji wa nguvu za mwanga unaotolewa na LED katika kila mzunguko wa mwanga. | Inapotosha uhalisi wa rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Terminology | Ishara | Layman's Explanation | Mazingira ya Ubunifu |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series. |
| Mfuko wa Mbele (Forward Current) | If | The current value required for the LED to emit light normally. | Constant current drive is commonly used, as the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika. | Upanaaji wa upana wa msukumo na uwiano wa kazi lazima udhibitiwe kwa uangalifu, vinginevyo kunaweza kuharibika kwa joto kupita kiasi. |
| Reverse Voltage | Vr | Upeo wa voltage ya nyuma ambayo LED inaweza kustahimili, ukizidi huo unaweza kusababisha kuvunjika. | Katika mzunguko, ni muhimu kuzuia kuunganishwa kinyume au mshtuko wa voltage. |
| Upinzani wa Joto (Thermal Resistance) | Rth (°C/W) | Upinzani wa joto unaposogea kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wenye nguvu zaidi wa kupoza joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), kama 1000V | Uwezo wa kupiga umeme tuli, thamani ya juu inamaanisha uwezo mdogo wa kuharibika na umeme tuli. | Hatua za kinga dhidi ya umeme tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Layman's Explanation | Athari |
|---|---|---|---|
| Joto la Kiungo (Junction Temperature) | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Ufafanuzi wa moja kwa moja wa "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Mabadiliko ya Rangi (Color Shift) | Δu′v′ au Mduara wa MacAdam | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi katika eneo la taa. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to prolonged high temperatures. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Terminology | Aina za Kawaida | Layman's Explanation | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Muundo wa Chip | Usanidi wa Kawaida, Usanidi wa Kugeuzwa (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lens / Optical Design | Plana, microlens, jumla ya kutafakari | Optical structure on the packaging surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Udhibiti wa Ubora na Uainishaji
| Terminology | Yaliyomo ya Uainishaji | Layman's Explanation | Kusudi |
|---|---|---|---|
| Kikomo cha mwanga | Msimbo kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Inafaa kwa usawa wa chanzo cha umeme cha kuendesha, kuboresha ufanisi wa mfumo. |
| Kugawanya kwa makundi kulingana na rangi | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely narrow range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Color Temperature Grading | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Kukidhi mahitaji ya joto la rangi kwa matukio tofauti. |
Sita, Upimaji na Uthibitisho
| Terminology | Standard/Test | Layman's Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumens Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Msingi wa upimaji unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa Mazingira | Hakikisha bidhaa hazina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati | Uthibitishaji wa ufanisi wa nishati na utendaji kwa bidhaa za taa. | Inatumika kwa kawaida katika ununuzi wa serikali na miradi ya ruzuku, kuimarisha ushindani wa soko. |