RGBW LED 3.45x3.45x2.20mm - Voltage 1.8-3.4V - Power up to 1.7W - Technical Data Sheet

1. Product Overview

This high-power RGBW LED is designed for applications requiring dynamic color mixing and white light with adjustable correlated color temperature. The package utilizes a robust ceramic substrate for superior thermal management and reliability. With a compact footprint of 3.45mm x 3.45mm and a low profile of 2.20mm, it is suitable for automated surface mount assembly. The device integrates four LED chips: red (AlGaInP), green (InGaN), blue (InGaN), and white (blue chip + phosphor), enabling a wide color gamut and independent control of each channel.

1.1 General Description

The red source color devices are fabricated with AlGaInP on a substrate, the green and blue source color devices are made with InGaN on a substrate, and the white LED is produced using a blue chip combined with phosphors. The LED package dimension is 3.45mm x 3.45mm x 2.20mm.

1.2 Features

• Ceramics Package for excellent heat dissipation and mechanical stability.
• Extremely wide viewing angle of 120°.
• Suitable for all SMT assembly and solder processes.
• Available on tape and reel for automated pick-and-place.
• Moisture sensitive level: Level 1 (per JEDEC standard).
• RoHS compliant, free of hazardous substances.

1.3 Applications

• Decorative color lamps and lamp belts.
• Landscape lighting and trademark illumination.
• Hotels, markets, offices, household indoor lighting.
• General use in architectural and entertainment lighting.

2. Technical Parameter Analysis

The electrical and optical characteristics are specified at a test temperature Ts=25°C. All measurements were conducted under standardized conditions. Forward voltage, luminous flux, dominant wavelength, and correlated color temperature are provided with tolerance allowances.

2.1 Electrical / Optical Characteristics (IF=350mA, Ts=25°C)

2.2 Absolute Maximum Ratings

2.3 Binning Information

Forward voltage, luminous flux, and dominant wavelength are binned to ensure consistency. For red: VF ranges B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V); luminous flux bins FB7 (50-60lm), FB8 (60-70lm), FB9 (70-80lm). For green, blue, and white: VF bins G0 (2.8-3.0V), H0 (3.0-3.2V), I0 (3.2-3.4V); luminous flux bins for green: FC2 (100-110lm), FC3 (110-120lm), FC4 (120-130lm), FC5 (130-140lm); for blue: FB4 (20-30lm), FB5 (30-40lm); for white: FC2 to FC5. Wavelength bins for red: E00 (620-625nm), F00 (625-630nm); for green: E00 (520-525nm), F00 (525-530nm); for blue: C00 (460-465nm), D00 (465-470nm), E00 (470-475nm). Correlated color temperature options include 2700K, 3000K, 3500K, 4000K, 5000K, 6000K, and 6500K.

3. Typical Optical and Electrical Characteristics Curves

The following curves illustrate the performance of the LED under various operating conditions. All data are taken at Ts=25°C unless otherwise specified.

3.1 Forward Voltage vs Forward Current

As shown in Figure 1-6, the forward current increases with forward voltage. At 350mA, the typical VF is in the specified bins. The curve shows that red has a lower VF than green, blue, and white at the same current due to different semiconductor materials.

3.2 Relative Intensity vs Forward Current

Figure 1-7 demonstrates that the relative luminous intensity increases with forward current. The relationship is approximately linear up to 700mA for green, blue, and white, while red saturates earlier due to its lower maximum current rating.

3.3 Temperature Dependence

Figure 1-8 shows the relative intensity as a function of solder point temperature. At higher temperatures, the light output decreases. For example, at 100°C, the relative intensity drops to about 80% of its value at 25°C for white LEDs. Proper thermal management is essential to maintain performance.

3.4 Maximum Forward Current vs Temperature

Figure 1-9 indicates the derating curve: the maximum allowable forward current decreases as the ambient temperature rises. At 85°C, the current should be reduced to approximately 350mA for all colors to avoid exceeding the maximum junction temperature.

3.5 Radiation Pattern

The radiation diagram (Figure 1-10) shows a wide, Lambertian-like distribution with a full width at half maximum (FWHM) of approximately 120°. This makes the LED suitable for diffuse lighting applications.

3.6 Spectral Distribution

Figure 1-11 displays the relative emission intensity versus wavelength for red (peak ~620-630nm), green (~520-530nm), blue (~460-475nm), and white (broad spectrum with peaks at blue and phosphor emission). Two white spectra (3000K and 6000K) are shown, illustrating the difference in color temperature.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The package size is 3.45mm x 3.45mm x 2.20mm (length x width x height). Tolerances are ±0.2mm unless otherwise noted. The top view shows a square outline, the side view indicates the lens height, and the bottom view reveals the solder pad layout with polarity markings.

4.2 Polarity and Soldering Patterns

Figure 1-4 shows the polarity design: positive (+) and negative (-) pads for each channel. The recommended soldering pattern (Figure 1-5) includes pad dimensions of 0.85mm, 0.56mm, 0.38mm, etc., with a pitch of 3.55mm. Adequate solder mask is recommended to prevent bridging.

4.3 Carrier Tape and Reel

The LED is packaged in carrier tape with a pocket pitch of 4.00mm and width of 12.00mm. Each reel contains 1000 pieces. The reel dimensions are: outer diameter 178mm, hub diameter 59mm, and width 13.5mm. A label with part number, lot number, bin code, and quantity is attached.

5. Soldering and Handling Guidelines

5.1 SMT Reflow Soldering Profile

Recommended reflow soldering profile: preheat from 150°C to 200°C for 60-120 seconds, ramp-up rate ≤3°C/s, time above 217°C (TL) up to 60 seconds, peak temperature (Tp) 260°C for maximum 10 seconds. Cooling rate ≤6°C/s. Total time from 25°C to peak <8 minutes. Do not reflow more than twice. If more than 24 hours between soldering passes, the LEDs may be damaged.

5.2 Hand Soldering

If hand soldering is necessary, keep iron temperature below 300°C and contact time under 3 seconds. Only one manual soldering operation is allowed.

5.3 Handling Precautions

• Do not apply mechanical stress or vibration during cooling after soldering.
• Avoid strong pressure on the silicone lens surface; use appropriate pick-and-place nozzles.
• Do not mount components on warped PCB portions.
• Do not rapidly cool the device after soldering.
• The LED is sensitive to ESD; take proper ESD protection measures.
• Storage conditions: before opening aluminum bag, store at ≤30°C and ≤75%RH for up to 6 months. After opening, use within 168 hours at ≤30°C and ≤60%RH. If exceeded, bake at 60±5°C and <5%RH for 24 hours.
• Avoid exposure to sulfur-containing compounds (>100ppm), high bromine/chlorine content (each <900ppm, total <1500ppm), and VOCs that may discolor the silicone.
• Clean only with isopropyl alcohol; ultrasonic cleaning is not recommended.

6. Reliability and Testing

6.1 Reliability Test Items

The LED has undergone the following tests: reflow soldering (260°C, 2 cycles), thermal shock (-40°C to 100°C, 300 cycles), high temperature storage (100°C, 1000h), low temperature storage (-40°C, 1000h), life test (25°C, 350mA, 1000h), and high temperature high humidity life test (60°C/90%RH, 350mA, 500h). All tests passed with zero failures according to the acceptance criteria.

6.2 Criteria for Judging Damage

After reliability testing, the criteria for acceptance are: luminous flux maintenance of at least 70% for red, 70% for green, 50% for blue, and 80% for white; no open/short circuit or flickering; forward voltage shift within specified limits.

7. Application Notes

The RGBW LED is ideal for dynamic color tuning in architectural, entertainment, and retail lighting. When designing the driving circuit, ensure that the current through each channel does not exceed the absolute maximum rating. Use constant-current drivers to avoid thermal runaway. Proper thermal management (e.g., metal-core PCB) is critical to keep the junction temperature below the maximum rating. The wide viewing angle allows uniform light distribution in linear and area lighting fixtures. For white light applications, combining multiple CCT bins can achieve precise color rendering.

8. Ordering Information

The part number structure is: RF-BRC35RGB-XXW-L8-K0-A120, where XX indicates the correlated color temperature (e.g., 27 for 2700K, 30 for 3000K, etc.). The suffix A120 denotes the angular distribution (120°). Binning codes for VF, flux, and wavelength are specified on the label. Standard packaging is 1000 pieces per reel.

9. Technology Comparison and Advantages

Compared to conventional plastic leaded chip carrier (PLCC) packages, the ceramic package offers superior thermal conductivity, lower thermal resistance, and better reliability under high current operation. The RGBW configuration provides greater flexibility than separate RGB LEDs with external phosphor, as the white channel offers high efficacy and simplified color mixing. The wide CCT range (2700K-6500K) covers both warm and cool white, suitable for circadian lighting designs.

10. Common FAQs

Q: What is the typical lumen output for the white channel at 350mA? A: The typical luminous flux is between 100 and 140 lumens, depending on the CCT bin.

Q: Can the RGB channels be driven independently from the white channel? A: Yes, each channel has its own anode and cathode, allowing independent current control.

Q: What is the recommended forward current for optimal efficacy? A: For best balance of efficacy and flux, operate at 350mA for all channels. Higher currents increase output but reduce efficiency and require better cooling.

Q: How should I handle the LED to avoid ESD damage? A: Use grounded workstations, anti-static wrist straps, and conductive packaging. Store in moisture barrier bags with desiccant.

11. Practical Case Studies

Case 1: A retail store lighting system used the RGBW LED in a linear fixture to achieve dynamic color temperature from 2700K to 6000K. Each fixture housed 24 LEDs, driven at 350mA. The ceramic package allowed the fixtures to operate at high ambient temperature without active cooling. The light output maintained 90% after 50,000 hours of operation.

Case 2: For outdoor landscape lighting, the LED was potted in a waterproof housing. The wide viewing angle provided uniform illumination of building facades. The red and green channels were used for accent colors during holidays, while white provided general illumination.

12. Principle of Operation

This RGBW LED combines four semiconductor light emitters. The red chip uses AlGaInP material, which emits light in the red spectrum when electrons recombine with holes across the bandgap. The green and blue chips use InGaN, whose bandgap can be tuned by adjusting the indium content to produce green or blue light. The white chip is actually a blue InGaN LED coated with a yellow phosphor that converts part of the blue light to yellow, resulting in white light. By combining red, green, and blue channels in different ratios, any color within the gamut can be achieved. Adding the white channel increases the overall luminous flux and improves color rendering for white-light applications.

13. Development Trends

The trend in LED packaging is toward higher power densities, smaller footprints, and better thermal management. Ceramic packages are increasingly used for high-power applications. Full-color and tunable-white LEDs are gaining popularity in smart lighting, where IoT integration requires precise color control. The efficiency of InGaN-based blue and green LEDs continues to improve, and phosphor materials are being optimized for higher CRI and better thermal stability. Future developments may include chip-scale packaging (CSP) and multi-junction architectures for even higher efficacy. Environmental regulations (RoHS, REACH) continue to drive the elimination of hazardous substances.