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White LED 3.0x3.0mm SMD - 2.8-3.6V Forward Voltage - 2.16W Power - 600mA - EMC Package

Detailed technical specification for 3.0x3.0mm white SMD LED with EMC package. Features high brightness, wide viewing angle of 120°, and RoHS compliance. Ideal for backlighting and general illumination.
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Home » Documentation » White LED 3.0x3.0mm SMD - 2.8-3.6V Forward Voltage - 2.16W Power - 600mA - EMC Package

Table of Contents

1. Product Overview

1.1 Description

The RT-TVG*GE33MCZ is a white light emitting diode (LED) that utilizes a blue chip and phosphor conversion to produce a broad spectrum white light. It is housed in an EMC (Epoxy Molding Compound) package measuring 3.0mm x 3.0mm with a thickness of 0.72mm. This package offers improved heat dissipation and mechanical robustness compared to traditional PLCC packages, making it suitable for high current operation up to 600mA.

1.2 Features

1.3 Applications

2. Technical Parameters

2.1 Electrical and Optical Characteristics (at Ts=25°C)

The following table summarizes key electrical and optical parameters. Test conditions are at a forward current of 600mA unless otherwise noted.

ParameterSymbolMinTypMaxUnitTest Condition
Forward VoltageVF2.8—3.6VIF=600mA
Reverse CurrentIR——10µAVR=0.6V
Luminous FluxΦ140—220lmIF=600mA
Viewing Angle2θ1/2—120—degIF=600mA
Thermal ResistanceRTHJ-S—12—°C/WIF=600mA

2.2 Absolute Maximum Ratings

ParameterSymbolRatingUnit
Power DissipationPD2160mW
Forward CurrentIF600mA
Peak Forward CurrentIFP900mA
Reverse VoltageVR0.6V
ESD (HBM)ESD8000V
Operating TemperatureTOPR-40 ~ +85°C
Storage TemperatureTstg-40 ~ +100°C
Junction TemperatureTJ115°C

Notes: (1) Peak forward current is at 1/10 duty cycle, 0.1ms pulse width. (2) All measurements under standardized conditions.

3. Binning System

3.1 Forward Voltage and Luminous Flux Bins

At a forward current of 600mA, the forward voltage and luminous flux are sorted into bins to ensure consistency. Voltage bins range from G1 (2.8-2.9V) to J2 (3.5-3.6V). Luminous flux bins are designated T140 (140-145 lm) through T240 (240-245 lm). Other intermediate bins exist but are not listed entirely.

3.2 Chromaticity Binning

The CIE 1931 chromaticity diagram defines multiple color bins: D, H, K, T, etc. Each bin is defined by four corner coordinates. For example, bin D00 has coordinates (0.3025,0.2723), (0.2958,0.2760), (0.3003,0.2850), (0.3070,0.2813). These bins allow precise color selection for applications requiring tight color consistency.

4. Performance Curves

4.1 Forward Voltage vs. Forward Current

Figure 1-7 shows the relationship: forward voltage increases moderately with forward current. At around 600mA, VF is approximately 3.0V.

4.2 Forward Current vs. Relative Intensity

Relative luminous intensity increases almost linearly with forward current up to 600mA, indicating good efficiency over the operating range.

4.3 Solder Temperature vs. Relative Intensity

As solder pad temperature (Ts) rises from 20°C to 120°C, relative intensity decreases by about 15%, highlighting the importance of thermal management.

4.4 Solder Temperature vs. Forward Current

The maximum allowable forward current derates with temperature. At Ts=85°C, the forward current should be reduced to approximately 400mA.

4.5 Forward Voltage vs. Solder Temperature

Forward voltage decreases linearly with increasing temperature, with a slope of about -2mV/°C.

4.6 Radiation Diagram

The radiation pattern shows a Lambertian distribution with full width half maximum of 120°, providing wide angular coverage.

4.7 Chromaticity Coordinate vs. Solder Temperature

Color shift is minimal over temperature; the Δx and Δy remain within 0.01 over the operating range.

4.8 Spectrum Distribution

The emission spectrum peaks around 450nm (blue) and 550nm (yellow), typical for phosphor-converted white LEDs.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package has dimensions of 3.0mm × 3.0mm × 0.72mm (top view: 3.0×2.6? actual size is 3.0×3.0mm). Polarity is indicated by a notch on the top and a marked cathode. Recommended soldering pattern is provided.

5.2 Carrier Tape Dimensions

The carrier tape pocket dimensions are AO=3.2±0.1mm, BO=3.3±0.1mm, KO=1.4±0.1mm. Tape width is 8.0mm with standard pitch.

5.3 Reel Dimensions

Reel diameter is 178±1mm, width 16.9±0.1mm, hub diameter 59mm.

5.4 Label Specification

Each label includes part number, spec number, lot number, bin code (flux, chromaticity, VF), quantity, and date.

5.5 Moisture Resistant Packing

Reels are placed in moisture barrier bags with desiccant and humidity indicator card.

5.6 Reliability Test Items

Tests include reflow, thermal shock, high/low temperature storage, life test at 600mA and 25°C, and high temperature/high humidity life test. Acceptance criteria: 0/1 failure.

5.7 Criteria for Judging Damage

After testing, forward voltage must not exceed 1.1×USL, reverse current not exceed 2.0×USL, and luminous flux not drop below 0.7×LSL.

6. SMT Reflow Soldering Instructions

6.1 Reflow Profile

Preheat from 150°C to 200°C for 60-120 seconds. Ramp-up rate ≤3°C/s. Time above 217°C (TL) is 60-120 seconds with peak temperature 260°C for max 10 seconds. Cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes.

6.2 Soldering Iron

Hand soldering: iron temperature ≤300°C for ≤3 seconds, one time only.

6.3 Repairing

Repair is discouraged; if necessary, use double-head soldering iron and verify characteristics.

6.4 Cautions

The top surface is soft silicone; avoid excessive pressure. Do not mount on warped PCB. Avoid mechanical stress during cooling.

7. Handling Precautions

7.1 Sulfur and Halogen Content

Sulfur content in mating materials must be below 100PPM. Bromine and chlorine each below 900PPM, total below 1500PPM. This is advisory only.

7.2 VOCs and Silicone

VOCs from fixture materials can penetrate silicone and cause discoloration, reducing light output. Test all materials for compatibility.

7.3 Handling Tools

Use forceps on side surfaces; avoid touching silicone lens. Do not apply pressure to lens.

7.4 Circuit Design

Design current limit resistors to prevent exceeding absolute maximum ratings. Avoid reverse voltage to prevent damage.

7.5 Thermal Design

Heat generation degrades brightness and changes color. Provide adequate heat sinking.

7.6 Cleaning

Use isopropyl alcohol for cleaning. Ultrasonic cleaning may damage LED.

7.7 Storage Conditions

Unopened bag: ≤30°C, ≤75% RH for up to 1 year. After opening: ≤30°C, ≤60% RH for 24 hours. If exceeded, bake at 65±5°C for 24 hours.

7.8 ESD Sensitivity

LEDs are sensitive to ESD; use proper precautions. ESD yield >90% at 8kV HBM.

8. Application Notes

For backlight applications, multiple LEDs can be connected in series/parallel with appropriate current regulation. A constant current driver is recommended to maintain consistent brightness. Thermal management is critical: ensure good contact between LED pad and PCB heatsink. Use thermal vias if necessary. For outdoor applications, consider additional environmental protection due to silicone lens sensitivity.

9. Frequently Asked Questions

9.1 Why is forward voltage binning important?

It ensures uniform brightness and power consumption in parallel strings.

9.2 How to handle ESD?

Use grounded workstations, antistatic wrist straps, and antistatic packaging.

9.3 Can I exceed 600mA?

No, absolute maximum rating must not be exceeded. Even short pulses at 900mA are allowed only with 10% duty.

10. Practical Application Cases

Case 1: Linear tube light replacing fluorescent T8 tube. 24 LEDs per meter, driven at 600mA, achieving 3000 lumens per meter. Case 2: LCD backlight unit with 100 LEDs, each running at 300mA to reduce heat density.

11. Working Principle

This white LED uses a blue InGaN chip coated with YAG:Ce phosphor. Blue light (λ≈450nm) from the chip excites the phosphor, which emits yellow light. The combination of blue and yellow produces white light. The color temperature depends on the phosphor composition.

12. Development Trends

EMC packaging is gaining popularity due to its high temperature resistance, better light extraction, and compatibility with high current operation. Future trends include chip scale packaging and higher efficacy.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.